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Cadence Launches AuraStack, Bringing Agentic AI to PCB and Advanced Packaging Design

New-Tech Magazines Group Ltd. July 27, 2026 Comments Off on Cadence Launches AuraStack, Bringing Agentic AI to PCB and Advanced Packaging Design

Cadence has introduced AuraStack, a new Agentic AI platform designed to automate and orchestrate the complete development process for printed circuit boards (PCBs) and advanced semiconductor packaging. The platform brings... Read More

STORY OF THE WEEK

Samsung and Broadcom Expand AI Chip Collaboration, Partnership Could Exceed $200 Billion

New-Tech Magazines Group Ltd. July 26, 2026 Comments Off on Samsung and Broadcom Expand AI Chip Collaboration, Partnership Could Exceed $200 Billion

Samsung Electronics and Broadcom have signed a memorandum of understanding (MoU) to expand their collaboration across advanced memory, semiconductor manufacturing and advanced packaging technologies. The initiative is aimed at supporting... Read More

Articles

Five Semiconductor Trends Defining the Next Generation of Computing

By New-Tech Magazine Group Team July 27, 2026 Comments Off on Five Semiconductor Trends Defining the Next Generation of Computing

Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry. Based on the TechInsights Semiconductor Outlook 2026, this article explores five trends that are redefining... Read More

Is RF Design Ready for Its Biggest Methodological Shift in Decades?

New-Tech Magazines Group Ltd. July 26, 2026 Comments Off on Is RF Design Ready for Its Biggest Methodological Shift in Decades?

A Princeton University research project suggests that future RF components may no longer be designed by refining existing geometries, but by defining the desired performance first and allowing AI-assisted algorithms... Read More

NEW PRODUCTS
AI TECH

Neo Launches with $100M to Secure AI Software Across the Enterprise

New-Tech Magazines Group Ltd. July 20, 2026 Comments Off on Neo Launches with $100M to Secure AI Software Across the Enterprise

Andreessen Horowitz and Bessemer Venture Partners back former SentinelOne executives building a real-time control layer to manage and secure AI for modern enterprises Neo, the Agentic Software Control company, today... Read More

START-UP

Qedma Integrates its Advanced Error Mitigation Software with Quantinuum’s Quantum Computing Platform

New-Tech Magazines Group Ltd. July 24, 2026 Comments Off on Qedma Integrates its Advanced Error Mitigation Software with Quantinuum’s Quantum Computing Platform

QESEM software enables enterprise and scientific research users of Quantinuum’s highly accurate quantum computers to further improve circuit fidelity Qedma today announced an integration with Quantinuum’s platform that will allow... Read More