PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

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Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and... Read More

Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage

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Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in... Read More

New cost efficient entry-level platform for high-end embedded computing

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congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces a brand new price-breaking Computer-on-Module for the entry-level of high-end embedded computing based on... Read More