FROM A SEED TO A TREE: LG HELPS REFOREST A NATIONAL PARK IN SPAIN - Making Inroads into High Speed Vision - New-Tech Europe Magazine | JULY 2019 - Fingerprint on Card Technology: The Right Sensor Ensures Scalability and a Consumer-Friendly Experience - New-Tech Europe Magazine | June 2019 - Intel’s Pohoiki Beach, a 64-Chip Neuromorphic System, Delivers Breakthrough Results in Research Tests - An Introduction to Embedded Motion Control - Massive MIMO and Beamforming: The Signal Processing Behind the 5G Buzzwords - How To Optimize Solder Stencil Aperture To Increase Connector Options - Baidu Named Development Partner on Intel Nervana Neural Network Processor for Training - SMART Global Holdings Announces Entry into Embedded Computing Market Through Acquisitions of Artesyn Embedded Computing and Inforce Computing - Siemens trams type Avenio for the city of Munich - Ams and SmartSens partner on 3D and NIR sensors - Industry digitalization a reality as Ericsson Tallinn 5G production goes wireless - TIM takes first commercial 5G steps in Italy with Ericsson - Rohde & Schwarz equips German airports with latest generation direction finders - Taiwan Star Telecom expands LTE services and prepares for 5G migration with Nokia end-to-end portfolio - Contract signed: BMW Group and Daimler AG launch long-term development cooperation for automated driving - Tiny motor can “walk” to carry out tasks - Cisco Intends to Acquire Acacia Communications - Wheel Reinvented – REE Emerges from Stealth to Power the Future of Mobility - DARPA funding brings machine learning to BAE Systems’ Signals Intelligence capabilities - Ficosa, first global manufacturer to receive the European RED certification for C-V2X technology from its CarCom platform - ERNI with broad portfolio of M8/M12 connectors - Important step in the digitisation of the automotive industry: New testing facility for EMC and antenna systems inaugurated - Semiconductor Industry Capex Forecast to Slump in 2019 and 2020 - VTT’s young research scientists represent the youth at an international ministerial meeting - Siemens launches urban data visualization of Berlin at Mercedes Benz Fashion Week - Volvo Cars and Uber present production vehicle ready for self-driving - Intel and Auto Industry Leaders Publish New Automated Driving Safety Framework - Imec world first to demonstrate 2 Metal layer back-end-of-line for the 3nm technology node - Automotive and Mobility Industry Leaders Publish First-of-its-Kind Framework for Safe Automated Driving Systems. - NI Announces Expansion of Vector Signal Transceiver Product Family to Cover X-Band Through Ka-Band Applications - Getting more heat out of sunlight - Volocopter Awarded as Technology Pioneer by World Economic Forum - XP Power introduces new, informative medical power supplies guide - Xilinx Hits Milestone with First Customer Shipments of Versal ACAP - Launch of module accelerates development of ultra-sonic water meters - New ams/MEGVII partnership for plug-and-play solutions enabling 3D face recognition in any smart device - LG TO EXPAND PARTNERSHIP WITH QT ON NEXT GENERATION EMBEDDED DEVICES RUNNING WEBOS - Analog Devices and First Sensor Developing LIDAR Offerings to Accelerate the Future of Autonomous Driving - Mouser Electronics Honored with Two Business Unit Distributor of the Year Awards from TE Connectivity - How to get a server rack in your back pocket? - Sepio Systems Partners with Distribution Giants Tech Data and SHI to Tackle Hardware-Based Cyber-Attacks - NeuroBlade raises over $27 million to develop a new type of AI chip - Engineers 3-D print flexible mesh for ankle and knee braces - Maxim’s Bi-directional Current Sense Amplifier with PWM Rejection Offers Industry’s Highest Accuracy and Fastest Settling Time for Greater Motor Efficiency - u-blox’s Senior 5G Tech Lead Sylvia Lu awarded as UK’s Top 50 Women in Engineering 2019 - Silent Switcher Devices Are Quiet and Simple - Sophistication of Satellite Communication Infrastructure Offering Strong Impetus to Defence Communication System Sales. - Nordic nRF91 Series roll-out brings cellular IoT to any application From asset tracking to medical monitoring, Nordic’s easy-to-design-in cellular IoT delivers a compact, low power, secure LTE-M and NB-IoT module for everything - Using Hardware Emulation to Verify AI Designs - DOCSIS* - The Data Over Cable Standard - Bringing human-like reasoning to driverless car navigation - AI takes the guesswork out of being human - ams Invites Austrian Homeless World Cup Players to Improve their Life and Work Opportunities - Siemens sells electric aircraft-propulsion business to Rolls-Royce - Ericsson launches enhanced 5G deployment options - Microchip gives its most precise atomic clock a performance upgrade - LightSail 2 launch expected no earlier than June 24 - Lockheed Martin and Airbus reaffirm tanker partnership at 2019 Paris Air Show - Korean President and Swedish Monarch celebrate eSports match at Ericsson Studio - GE names Michael Keroullé President & CEO of Steam Power - World’s First Truly Global Handheld Satellite PTT Radio Makes Commercial Debut - Teledyne e2v’s Emerald 67M, Ultra-high Resolution Image Sensor Now Available - Can We Believe The Hype About China’s Domestic IC Production Plans? - Vicor introduces a new 800V Bus Converter Module - CUI Introduces Terminal Block Connectors to Interconnect Portfolio - ROM-Based GNSS Module from STMicroelectronics Targets Mass-Market Tracking and Navigation Applications - Infineon is launching highly accurate digital Turbo MAP sensor - Imec presents a manufacturable solution for field-free switching operation of Spin-Orbit Torque MRAM devices - BAE Systems joins Boeing’s MQ-25 industry team - Formula E: Audi in the thick of the title race - TowerJazz Expands its Leading-Edge High Voltage Low RDSON Power Platform - Habana Labs Announces Gaudi AI Training Processor - Infineon launches world’s first monolithically integrated linear Hall sensor for ASIL D systems - Samtec Features Latest 32GT/s Interconnect Solutions at PCI-SIG® Developers Conference 2019 - TDK Honors Digi-Key with European Distribution Award in Gold for High-Service Distributors - Ericsson Mobility Report: 5G uptake even faster than expected - STMicroelectronics Raises Performance, Efficiency, and Security of Next-Generation Digital Power Applications with STM32G4 Microcontrollers - TI introduces the first system basis chip with integrated CAN FD controller and transceiver - Bosch technology teaches cars to fly - Imec demonstrates optimized process flows for high performance Ge-based devices - BMW Group and Jaguar Land Rover announce collaboration for next-generation electrification technology - Unleash the Full Potential of Your Micro Speakers with Maxim's DSM Smart Amplifier - Performing Automotive Ethernet Conformance Tests is Easy with CANoe - Microchip Enables China to Deploy World’s First Bandwidth-on-Demand Services Powered by Optical Transport Network (OTN) - Renesas Electronics and SAIC Volkswagen Unveil Joint Laboratory to Accelerate Development for China’s Automotive Market - NASA Opens International Space Station to New Commercial Opportunities, Private Astronauts - Smart mobility: Ukrainian city of Vinnitsa selects CIPURSE™ for transit ticketing - Autotalks and NoTraffic Cooperate to Improve Safety and Mobility by Delivering a Traffic Management Platform with Global V2X - NXP Premieres EdgeVerse Platform Brand to Support its Fast-Growing Edge Compute Portfolio - Nokia extends commitment to network security for the 5G world - AMD and Samsung Announce Strategic Partnership in Ultra Low Power, High Performance Graphics Technologies - Toshiba launches new family of low voltage driven photorelays - Communications IC Market to Again Surpass Computer IC Market - NXP Drives the 5G Revolution with Its Industry-Leading Portfolio of RF Infrastructure Solutions - European research project Power2Power for more efficient power semiconductors launches in Dresden - Dusun Electron Announces New Bluetooth® Audio Module for Wireless Speaker and Artificial Intelligence-Based Voice Assistant Products - F-35 Enterprise Delivers 400th F-35 and Fleet Surpasses 200,000 Flight Hours - Sensors/Actuators Reach Record Sales on Slower Growth - AMD and Samsung Announce Strategic Partnership in Ultra Low Power, High Performance Graphics Technologies - BMW Group enhances road safety by sharing anonymised traffic data. - More traffic safety with Car-to-X communication: Daimler is starting a Europe-wide cooperation project - BAE Systems Partners with UiPath to Expedite Machine Learning Adoption - Selecting an ASIC package - Infineon to acquire Cypress, strengthening and accelerating its path of profitable growth - Analog Devices Announces New Impedance & Potentiostat Analog Front End for Biological & Chemical Sensing - System-Level LO Phase Noise Model for Phased Arrays with Distributed Phase-Locked Loops - New-Tech Europe Magazine | May 2019 | Digital Edition - New-Tech Europe Magazine | April 2019 - Renesas Electronics Offers Complete Automotive Integrated Cockpit Reference Solution Based on R-Car System on Chip - ams Enables Homeless to Change their Lives through Football - Ericsson technology drives Hungarian 5G test track - Government of Vietnam and Ericsson forge strategic Industry 4.0 partnership - IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality - TE Connectivity announces the new LUMAWISE Drive LED Holder Type Z50 – DALI-2 series for more attractive and compact solutions in track and spot lighting - ESIstream IP – ease your way to deterministic data serialization - Ericsson and SoftBank Corp. to deploy multi-band 5G network - Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems - Gentex purchases Microchip’s 25 billionth MCU, advancing its HomeLink Interface - Renesas Electronics Launches Rad-Hard 16-Channel Current Driver with Integrated Decoder for Satellite Applications - Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity - TriEye Secures $17M in Series A Financing Led by Intel Capital to Solve the Automotive Low Visibility Challenge - ERM Advanced Telematics Enters the Rapidly Expanding Electric Vehicle Market - Sikorsky HH-60W Combat Rescue Helicopter Achieves First Flight - Triumph in Berlin: Audi Sport ABT Schaeffler repeats home victory in Formula E - Intel COMPUTEX Preview: New Products Deliver Real-World Performance — Up to 2x Gaming and 8x AI Boost - Renesas Electronics Launches RX23E-A Group, First RX Microcontrollers Built-In Industry-Leading Analog Front End For High-Precision Sensing and Measurement Equipment - NXP and FatPipe Networks Collaborate to Deliver SD-WAN Solution - Ericsson and Vodafone link gamers in Portugal and Spain via 5G global roaming - Qualcomm and Lenovo Unveil World’s First 5G PC Powered By The Qualcomm Snapdragon 8cx 5G Compute Platform - Rohde & Schwarz announces attractive package pricing for complete solutions in entry-level test instruments - Toshiba Starts Shipment of UL 508 Certified Photorelays for Industrial Control Equipment - First Air Taxi Volo-Port to be Built by End of 2019 - After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound - FLAGSHIPS project to deploy two hydrogen vessel - Nokia and U Mobile deploy Single RAN Advanced Network to expand LTE services and collaborate on 5G live network trial in Malaysia - BMW Startup Garage secures early access to pioneering innovations. - Imec presents Lifetime of Innovation Award to ASML President and CTO Martin van den Brink - Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems - EMVA appoints new Standards Manager Werner Feith coordinates standardization activities of the association - LEM reveals new brand identity - Autotalks Accelerates C-V2X Readiness Following Interoperability Testing and Successful Bench Tests - Fujitsu Brings Cloud Services Direct to Customer Environments with PRIMEFLEX for Microsoft Azure Stack - ERNI has Broken Ground for a New Production and Distribution Facility in Virginia, USA - Tom Arseneault Appointed President & COO for BAE Systems, Inc. - Börje Ekholm: Europe needs to act fast on 5G or lose out - Power Transistors to Hit Another Sales Record After Growth Bubble Ends - Rohde & Schwarz equips Chengdu Tianfu International Airport in China with advanced ATC communications system - ams, Ibeo and ZF partner to deliver industry-first solid-state LiDAR systems for the automotive industry - Melexis Extends its Smart Embedded Motor Drive Portfolio For Automotive Applications - New Infineon HybridPACK™ power modules enable fast and flexible electrification of vehicles - u-blox takes continuous lane accurate positioning to challenging urban environments - LEM LZSR current transducers offering, enlarges the measuring range up to 450 Apk with Closed-loop Hall effect technology - Advantest Introduces New V93000 Wave Scale Millimeter Solution to Cost-Effectively Test 5G-NR mmWave Devices up to 70 GHz - XP Power announces new low profile 180W U-channel PSU for space-critical medical (BF), industrial & ITE applications - ams is an official partner of Projekt Spielberg - MediaTek and Ericsson place standalone 5G call on 2.6GHz band - University of Essex selects Rohde & Schwarz to equip main Electronic Engineering teaching lab - Sensor technology guides next-generation missile to readiness - AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor - A smart radar system for gesture recognition and non-contact vital signs monitoring. - Samsung Electronics’ Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform - Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges - Renesas Launches RX72T Group to Expand Microcontroller Options for Servo Control in Industrial Robots - ON Semiconductor Showcases Automotive CMOS Image Sensors, LiDAR and Radar Solutions at AutoSens 2019 - New holographic technique opens the way for quantum computation - Audi networks with traffic lights in Europe - ERM Partners with Altair to Dramatically Improve Business Models for Deploying Vehicle Telematics and Asset Tracking - AudioCodes and Amazon Collaborate to Extend Mediant Session Border Controller Interoperability with Amazon Chime Voice Connector - Volkswagen relies on Infineon for its electric future - Innovative climate action – introducing the first credit card with a carbon spending limit - Using 60% less water in paper production - BAE Systems announces partnership with Invictus UK - CPI Supports ItoM Medical to Develop Smart Vest for Asthma Treatment - Samsung Electronics Expands SAIT AI Lab Montreal to Spur AI Research for Next-Generation System Semiconductor - Nokia and FAW Group to use 5G to accelerate digital transformation of the Chinese automotive sector - 1Q19 Registers the 4th Largest Sequential IC Market Decline on Record - Rohde & Schwarz shows outdoor models of its family of satellite uplink amplifiers at Satellite 2019 in Washington - ZTE Selects Intel’s eASIC Devices for 5G Wireless Deployment - ON Semiconductor to Launch SiC-based Hybrid IGBT and Isolated High Current IGBT Gate Driver at PCIM Europe 2019 - New fully featured 3 Phase input, 5kW AC-DC power supply delivers the ultimate flexibility through software configurability - New Global Partnership to Prioritise Safety in the Future of Manufacturing - SDR Boosts the Flexibility of RF Communication - Ficosa and Panasonic to provide co-developed Interior rear-view mirror with electronic toll collection for new BMW X5 in Japan - CPI and Partners Work on an Innovative Unmanned Air Vehicle - Record solar hydrogen production with concentrated sunlight - Formula E in Paris: Audi drivers brave April weather - World’s first ‘BioSolar Leaf’ to tackle air pollution in White City - Rohde & Schwarz and MediaTek validate 5G New Radio capabilities of MediaTek's new Helio M70 modem - European Space Agency names PLATO exoplanet hunting mission sensors in memory of Jean-Francois Bruyères - 9th Gen Intel Core: The Most Powerful Laptop Platform - Dan Leibholz Named CTO at ADI - Xilinx to Acquire Solarflare - CPI Collaborates on Unmanned Air Vehicle - Renesas Electronics Press Center 2019 Renesas Electronics Ships First Plastic Packaged, Radiation-Tolerant PWM Controller and GaN FET Driver for New Space SmallSats - Intel Acquires Omnitek, Strengthens FPGA Video and Vision Offering - ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility   - Qualcomm and Swisscom Bring 5G to Europe with the First-Announced Commercial Services - Airtel selects Ericsson for VoLTE expansion - Compact displays for quick assembly - Renesas Electronics Ships First Plastic Packaged, Radiation-Tolerant PWM Controller and GaN FET Driver for New Space SmallSats - TESS discovers its first Earth-sized planet - TAU scientists print first ever 3D heart using patient’s own cells - Rohde & Schwarz is the first provider of a complete end-to-end 5G NR network measurement solution - u-blox timing solutions help put China Unicom on the path to 5G - Adding a new package to the Easy family, Infineon now offers the broadest 12 mm power module portfolio without base plate - Lockheed Martin and MIT International Science and Technology Initiatives (MISTI) create the MIT-Lockheed Martin Seed Fund in Israel - Lotta Partanen appointed as manager of VTT LaunchPad – a business incubator aimed at creating business across sectors - Ericsson drives Azercell’s network towards 5G - Rohde & Schwarz and OPPO carry out 5G NR FR1 signaling test - ON Semiconductor Continues to Make Battery-less IoT a Reality with Bluetooth® Low Energy Multi-Sensor Platform - Toshiba’s new small surface mount LDO regulators lower power consumption - Teledyne e2v releases CIS120 CMOS imaging sensor for space and harsh environments - Melexis Extends Its 3rd Generation of Triaxis® Hall Position Sensors with Dual-Output Option - Renesas Electronics Simplifies Development of USB PD and USB-C™ Battery Charging Applications with New Reference Designs - Displays for low-power devices - Maxim Unveils Smallest, Most Power-Efficient Dual IO-Link Transceiver with DC-DC Regulator and Surge Protection - Renesas Electronics Launches Touch-Free UI Solutions with Capacitive Touch-Key Microcontrollers For 2D/3D Gesture Control - Autotalks Gains Momentum in China after a Successful C-V2X Field Test with a Chinese Tech Giant - LIVING SPACE SOLUTIONS SHOWCASE AT LG INNOFEST EUROPE - Absolutely real: Virtual and augmented reality open new avenues in the BMW Group Production System - Samsung’s Multi-Mode Exynos Chipsets Help Bring the 5G Era to Mobile Consumers - Ericsson and ABB join forces to accelerate wireless automation for flexible factories - Intel Driving Data-Centric World with New 10nm Intel Agilex FPGA Family - 5G: Ericsson, Audi and Sick present human-robot interaction in real time - Sony Easily Maintains Its Number 1 Ranking in the Diverse O-S-D Market - Imec and Jolywood achieve a record of 23.2 percent with bifacial n-PERT solar cells - CPI Works with GSK and AstraZeneca on Pharma Manufacturing - Lausanne Racing Team unveils an electric racing car - Volkswagen tests highly-automated driving in Hamburg - How a startup plans to clean up space - FMC Developments Support Legacy and Next-Gen Data Needs - Wireless options for the IoT - High Performance Data Converters for Medical Imaging Systems - Nokia and Netia conduct first field trial of Photonic Service Engine 3 super coherent technology over live production network - Siemens secures major order for integrated LNG-to-Power project in Brazil - Optoelectronics, Sensors/Actuators, and Discretes Hit Record Sales Again - The future of agriculture is computerized - At NAB 2019, Rohde & Schwarz presents a new era in media distribution with 5G Broadcast - MIT and NASA engineers demonstrate a new kind of airplane wing - New approach could boost energy capacity of lithium batteries - The new BMW Group High Performance D3 platform. Data-Driven Development for Autonomous Driving - U.S. Army Awards $1.13 Billion Contract to Lockheed Martin for Guided Multiple Launch Rocket System Production, Support Equipment - NXP Takes Melbourne Transit (myki) Mobile with Google Pay Integration for Trains, Buses and Trams - Intel Capital Announces $117 Million of New Investments in 14 Disruptive Tech Startups at Annual Global Summit - Imec researcher receives ERC Advanced Grant to develop ultra-bright thin-film light sources and lasers - CPI Welcomes Clients to New Printable Electronics Centre - TowerJazz Announces Signing Three-Year Agreement Extension with Panasonic Semiconductor Solutions - ON Semiconductor to Acquire Quantenna Communications - U.S. Companies Continue to Represent Largest Share of Fabless IC Sales - Daimler and Geely Holding form global joint venture to develop smart - DARPA awards BAE Systems contract to further develop autonomous software for air mission planning - Innovative water treatment at Audi saves up to 500,000 cubic meters of fresh water a year - It’s all about letterboxes, fashion designers and scooters: the city of the future where you’ll definitely want to live. - NVIDIA to Acquire Mellanox for 6.9$ Billion - Samsung Develops Industry’s First 3rd-generation 10nm-Class DRAM for Premium Memory Applications - US Department of Energy and Intel to Deliver First Exascale Supercomputer - RF antenna module uses optimised antenna beamforming for next generation high speed wireless networks - Frost & Sullivan Grants Sepio Systems the 2019 European Enabling Technology Leadership Award in the Rogue Device Mitigation Market - Germany’s Best Employer: Vector Takes Second Place - Würth Elektronik eiSos Promotes the Future Network - Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment - Teledyne e2v releases first military qualified Arm® based processor for Hi-Reliability applications - Limit Switch with integrated LED Status Indication - 16-bit General-Purpose MCUs Equipped with Safety Functions - With the new R&S NRX RF power meter, even complex test setups can be configured quickly - Dr. Sven Schneider to become CFO of Infineon on 1 May 2019 - Formula E technology partnership with Audi and eMobility strategy - Volvo Cars takes major step towards its electrified future with a range of new hybrid powertrains - UK Apprentice of the Year announced at Apprentice Awards - Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019 - ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications - Samtec Releases Ultra Micro Power Connectors with Incredible Design Flexibility - Siemens strengthens ownership culture - Flex Power Modules introduces dual-output digital PoL regulator for high power density ICT applications - Advanced IGBTs Optimized for Soft Switching Raise Induction-Heating Efficiency in Home Appliances - GE's Largest Onshore Wind Turbine Prototype Installed and Operating in the Netherlands - Industry’s First Highly Integrated USB-C Buck Charger from Maxim Reduces Size by 30 Percent - BMW Group wins major engine-delivery contract from INEOS Automotive Limited - Using artificial intelligence to save bees - Audi e-tron FE05 shines in record heat - Converting Wi-Fi signals to electricity with new 2-D materials - Boeing Partners with Aerion to Accelerate Supersonic Travel - Arsenal FC, Liverpool FC and Manchester City Bring Immersive Experiences to Fans with Intel True View - LG Display Introduces Latest Cutting-edge Displays at CES 2019 - Driving Performance on land and on water: Stronger and lighter: the eleventh boat from Mercedes-AMG and Cigarette Racing sets new benchmarks through extensive use of carbon-fibre - Mobility of the Future: Fraport and Volocopter Are Developing Airport Infrastructure and Passenger Processes for Air Taxi Services - Intel Drone Light Show and Intel True View Technology Enhance Pepsi Super Bowl LIII Halftime Show and Super Bowl LIII Viewing Experience - McCormick & Company and IBM Announce Collaboration Pioneering the Use of Artificial Intelligence in Flavor and Food Product Development - Successful launch! Israeli spacecraft Beresheet launched to the moon - Mini cheetah is the first four-legged robot to do a backflip - Unleashing Big Data of the Past – Europe builds a Time Machine - NASA is Aboard First Private Moon Landing Attempt - Next-generation optics in just two minutes of cooking time - High-Temperature Fuel Cell Achieves Lifetime of More Than 11 Years - Returning Astronauts to the Moon: Lockheed Martin Finalizes Full-Scale Cislunar Habitat Prototype - Robots enable bees and fish to talk to each other - Room40 uses Nokia's machine-learning powered video, audio and IoT analytics to flag emergencies and crime at service stations, parking lots and construction sites - Work starts integrating next generation Meteor and Spear onto UK F-35 Fleet - UnitedSiC announces strategic investment by Analog Devices - New-Tech Europe Magazine | MARCH 2019 - Accelerate cellular IoT adoption by balancing security with power efficiency. - Synchronization of Multiaxis Motion Control over Real-Time Networks - Unleash the Power CUDA and GPGPU in the Industrial Environment - Rohde & Schwarz and Prisma Telecom Testing demonstrate 5G standalone mode testing at MWC 2019 - CPI Collaborates on Project to Create Digital Twin - Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones - MTN and Ericsson extend mobile money partnership - Cable cars could reshape urban landscapes - The future of thermotechnology comes from Bosch - Ericsson, Telia and Volvo CE team up on 5G for industrial use - Trials of advanced fighter pilot helmet prove successful - Robust 100-V, 1-A synchronous buck converter enables designers to shrink board space, improve efficiency and simplify power-supply design - UK Startup Karantis360 Taps IBM Cloud for AI-Powered Assisted Living Solution - Ficosa connects to MWC 2019 with the latest 5G and V2X technology - Jazz signs five-year 4G network expansion deal with Nokia to boost network capacity and coverage - Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process - Advances in Logic IC Process Technology Move Forward - II-VI Incorporated and Samtec Demonstrate 56 Gbps PAM4 per Channel FireFly™ On-Board Optical Engines at OFC 2019 - ERM Advanced Telematics launches easy to install UBI products to help car insurers price policies - New SAR ADC family enables high-speed, high-resolution analogue-to-digital conversion in harsh environments - 97 IC Wafer Fabs Closed or Repurposed During Past 10 Years - TowerJazz Announces Successful Development of Axbio’s In-Vitro Diagnostic Bio-CMOS IC using its Advanced 300mm 65nm RFCMOS Platform - Toshiba starts sample shipments of automotive DC motor driver IC with LIN slave function - Fast laser helps doctors image full eye in 3D - Samsung Electronics Doubling Current Smartphone Storage Speed as it Begins Mass Production of First 512GB eUFS 3.0 - New ams light sensor with 50/60Hz flicker detect helps mobile phones take great photos every time - Updating F-35 Electronic Warfare Systems - Tipalti Introduces Multi-FX Solution to Further Streamline Global Payables - CPI Develops Hi-Therm System to Improve Heat Transference - Natural and fully multimodal interaction with the vehicle and its surroundings. BMW Group presents BMW Natural Interaction for the first time at Mobile World Congress 2019. - BAE Systems launches new FIRST Robotics Scholarship and Internship Program for High School Seniors to Inspire future Engineers - Toshiba Memory Europe Adds BiCS FLASH To Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products - Ericsson wins top awards for Massive MIMO and Private Networks solutions - BMW Group and Daimler AG invest more than €1 billion in joint mobility services provider - Develop low-power wireless sensor nodes with the industry’s smallest regulatory-certified sub-GHz module - Dialog Semiconductor’s Latest Family of Bluetooth Low Energy Wireless Multi-core MCUs, sets the Standard for Tomorrow’s Users - New fully integrated embedded motor controller with extended memory for automotive applications - Cypress USB-C with Power Delivery Making Universal Power Adapters a Reality - REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more - SamacSys and Altium deliver integrated platform for PCB footprints, schematic symbols and 3D models - Ericsson to acquire Kathrein’s antenna and filters business - Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems - Joint Demonstration of Anritsu 5G Tester with TCL Communication 5G USB Device at MWC2019 - Israeli startup Mixed Place integrates Mixed Reality content at two of Europe’s largest retail chains - Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator - e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting - Infineon Annual General Meeting increases dividend to €0.27 per share – the dividend payment has risen for the fifth time in succession - Siemens launches new enterprise class embedded Linux solution for embedded systems development - National mission to land a spacecraft on the moon is underway: Israeli spacecraft "Beresheet" to launch to the moon on February 22 - NanoLock and Cypress to Develop Flash-to-Cloud Management and Security for Automotive and Industrial Applications - BMW Group to expand global R&D network: Technology Office due to open in Tel Aviv in 2019 - PolarFire FPGA-based solution enables lowest-power, smallest-form-factor 4K video and imaging applications - ReWalk Announces 510k FDA Submission for ReStore™ Exo-Suit for Stroke Rehabilitation - Imec designs breakthrough sub-mW radar for presence detection in smart buildings - Casambi works with OSRAM DEXAL to boost wireless lighting within smart buildings - New TWIN SerDes devices in the APIX3 family from Inova Semiconductors - Vicor Power Systems introduces a new family of VITA 62 compliant power supplies for MIL-COTS VPX applications - Anritsu and Samsung Verify Industry’s First 5G NR Protocol Conformance Test in Sub-6 GHz Frequency Range - UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing - Ericsson wins iF DESIGN AWARDS for Design System and Brand Identity - At MWC 2019, Rohde & Schwarz heralds a new era in quality of experience with 5G Broadcast live on ai - A transformer to drive the transition from AC to DC - Imec and EnergyVille Present Unique Simulation Framework to Accurately Determine Energy Yield of Bifacial Solar Modules and Systems - Unleashing perovskites’ potential for solar cells - Low Power SSD Controller: X1 for Reliable 3D Flash Support - Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity - 3 W and 5 W Encapsulated Ac-Dc Power Supplies Offer Multiple Mounting Options - Swisscom selects Ericsson Security Manager - New CAN (FD)/LIN Network Interface for PCIe - SMART Modular Technologies Announces New N200 Family of SATA Flash Products - SPF Private Clients introduces its First AI Mortgage Advisor Built on IBM Watson and IBM Cloud - ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications - Ford Motor Company, Huayou Cobalt, IBM, LG Chem and RCS Global Launch Blockchain Pilot to Address Concerns in Strategic Mineral Supply Chains - Sikorsky's AAG and BLADE Announce Agreement for On-Demand Urban Mobility Option in New York City Using Sikorsky S-76® Helicopter - Microlease and Electro Rent Europe combine to become Electro Rent Corporation The two companies will unify their European operations to become the largest independent test and measurement equipment solutions provider - PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms - Rohde & Schwarz presents the world’s first WLAN 2x2 MIMO signaling tester for IEEE 802.11ax - Lockheed Martin Awarded $184 Million to Continue Providing the U.S. Navy with Electronic Warfare Systems - PerimeterX Raises $43M In Series C Funding To Fuel Expansion into New Markets and Accelerate Product Development - Micro miniature slide potentiometers from TT Electronics offer smooth and durable performance - C&K strengthens focus on business expansion with appointment of industry veteran as CRO - Kontron and Lynx partner to deliver secure connected commercial vehicles - India’s Lohia Group announces acquisition of Light & Strong Limited - MATRIX Industries’ pioneering no-charge GNSS smartwatch has u-blox and TransSiP PI technology under the lid - Ericsson opens new Center of Excellence training facility in Texas as US focus on 5G increases - Teledyne e2v completes delivery of image sensors to the Sentinel-5/UVNS instrument mission - STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB - Lunaphore, an EPFL spin-off, brings its first product to market - PROVERTHA takes over D-Sub portfolio from ERNI - Ericsson launches critical communications broadband networks offering - MWC 2019: Rohde & Schwarz presents its leading wireless mobile testing solutions for today and tomorrow - World première of the Mercedes-AMG Project ONE show car: Mercedes-AMG brings Formula 1 technology to the road - Audi Aicon concept car – autonomous on course for the future - First ever public demonstration of an autonomous urban air taxi in a mega city by volocopter - Emotion instead of emission: Audi heading for the motorsport future in electric power - “Superhero” robot wears different outfits for different tasks - Feeling woozy? Time to check the tattoo - Epic world solar car race begins in Australia - Finnish mobile device for detecting arrhythmia soon available for consumers - Intelligent World Drive – five continents in five months: On the road to autonomous driving: Mercedes-Benz on automated worldwide test drive - Developing robots that can walk more naturally - Samsung HMD Odyssey Introduces the Ultimate Windows Mixed Reality Experience - Two intelligent vehicles are better than one - Solar Decathlon: the Swiss team awaits the results - Nike calls “Flyleather” its most sustainable leather material yet - Dutch open 'world's first 3D-printed bridge' - Samsung Launches Star Wars Limited Edition of POWERbot™ Robot Vacuum - Flexible sensor ‘skin’ could help robots and prosthetics to perform everyday tasks - Experience Samsung 360 Round, a High-Quality Camera for Creating and Livestreaming 3D Content for Virtual Reality (VR) - Mouser-Backed Vaillante Rebellion Car Victorious at Fuji - Introducing Samsung Connect Tag, a New Way to Keep Track of All That Matters in Life - The world's first 3D printed steel bridge will be a 'living laboratory' - Mercedes-Benz on automated test drive in the Shanghai megalopolis - BLOODHOUND successful first public runs - Amazon patents a crazy car-charging drone idea - 2018 CES: New Smart and Connected Home Devices Start with Intel Inside - Engineers create plants that glow - Drone Use Case: Intel’s Falcon 8+ Drone Helps Preserve 15th Century German Cathedral - WORLD FIRST US-AUSTRALIA BIOFUEL FLIGHT TAKES OFF - ROHM supplies Full SiC Power Modules to Formula E racing team Venturi - Engineers design artificial synapse for “brain-on-a-chip” hardware - Swedish​ ​Uniti​ ​car​ ​owners​ ​will​ ​receive​ ​five​ ​years​ ​of​ ​free​ ​solar​ ​energy​ ​to charge​ ​their​ ​car​ ​–​ ​Partnership​ ​with​ ​E.ON - A robotic spy among the fish - Making lighter vehicles with magnesium alloys - LG SIGNAGE TECHNOLOGY GREETS ATLÉTICO DE MADRID FANS AT WANDA METROPOLITANO STADIUM - Turner Sports and Intel Announce Multiyear Partnership to Bring Virtual Reality to NBA Fans - Engineers develop smart material that changes stiffness when twisted or bent - Add-on clip turns smartphone into fully operational microscope - Giving everyone a window into the human body - Cutting-edge FRAMOS 3D System Supports Visually Impaired in Daily Life - Intel Drone Light Show Breaks Guinness World Records Title at Olympic Winter Games PyeongChang 2018 - VTT and the cities of Southern Finland improve the safety of natural ice trails - Samsung Electronics Wins 55 iF Design Awards - BMW Group reduces CO2 emissions in Europe again - MINI LIVING – BUILT BY ALL. MINI presents visionary living concept at Milan Design Week. - Rohde & Schwarz provides efficient workflows at the Berlinale 2018 - ViaVan launches revolutionary shared ride service in London - Goodyear Oxygene - a Concept Tire Designed to Support Cleaner and More Convenient Urban Mobility - You only need $80K to book a spot at the first hotel in space - Cutting-Edge Heat Shield Installed on NASA’s Parker Solar Probe - Drive system for the BMW i8 wins International Engine of the Year Award for the fourth time. - Mouser Interviews Uzi Hanuni, Developer of High-Tech Communication Solutions Invaluable in Saving Thai Soccer Team - Volocopter presents air taxi services at scale - Introducing the latest in textiles: Soft hardware - A little fold-up joystick brings haptics to portable devices - Synthetic 'brainy skin' with sense of touch gets £1.5m funding - City Of London To Source 100% Renewable Electricity For Square Mile - Mission Accomplished: “HP Mars Home Planet” Premieres Virtual Reality Experience - Samsung Pay Now Available in Six Continents, Accelerating Global Expansion - Stay Connected No Matter Where You Are with the New Samsung Galaxy Watch - BMW Summer School 2018: Focus on “Intelligent Cars on Digital Roads”. - “Hey BMW, now we’re talking!" BMWs are about to get a personality with the company’s Intelligent Personal Assistant. - New sensors track dopamine in the brain for more than a year - Wearable Ultrasound Patch Monitors Blood Pressure Deep Inside Body - Volocopter to Test its Electrical Vertical Take-Off and Landing (eVTOL) Air Taxis in Singapore - ADAC air rescue testing manned multicopters in emergency medical services - Renesas Electronics and Mahindra Racing Expand Formula E Technology Partnership for Season 5 - Imec and TNO launch Digital Twin of the city of Antwerp - NASA InSight Lander Arrives on Martian Surface to Learn What Lies Beneath - VTT's NanoSat hyperspectral camera remains stable after enduring one year of space weather and even a severe solar storm - Delivers high quality spectral data - CPI Helps Running Entrepreneur Take Big Step Forward - LG SINGS AND DANCES TO A WORLD RECORD - ‘LG OLED FALLS’ EXHIBIT WOWS CES ATTENDEES - Simona De Silvestro becomes ABB ambassador of ABB Formula E - Samsung Electronics Announces New Premiere Partnerships for ‘The Frame’ - Renesas Electronics Proud to be Official Technical Partner of the Victorious Mahindra Racing at Marrakesh E-Prix - Intel AI Protects Animals with National Geographic Society, Leonardo DiCaprio Foundation - Mercedes-Benz Vans is presenting the van of the future: intelligent, interconnected and electric - Dinner in 3D - Omron's table tennis robot FORPHEUS certified by Guinness World Records® as the world's "first robot table tennis tutor" - Analog Devices and Linear Technology to Combine Creating the Premier Analog Technology Company - Pouncer Food Aid By Air - Luxottica, Intel Announce Oakley’s Radar Pace is Available Now - BMW - THE NEXT 100 YEARS WORLD TOUR - Qualcomm to Acquire NXP - Airbus has a secret flying-car project called Vahana - Intel Announces Commercial Drone: Intel Falcon 8+ System - The first fully 3-D-printed heart-on-a-chip - World's first 4-seater fuel-cell plane takes off in Germany - Intel Announces $250 Million Investment for Autonomous Driving - Shift: The New Generation of Drone and Controller - ADIDAS UNVEILS WORLD’S FIRST PERFORMANCE SHOE MADE FROM BIOSTEEL® FIBER - Digital lifestyle: MINI Connected expands to include a new personal mobility assistant. - The logistics of the future: from data goggles to electric trucks - A Phone That Charges in Seconds? UCF Scientists Bring it Closer to Reality - European Aviation Network (EAN) is airborne! - An innovative window system earns a European patent - Lexus Unveils LED-Covered LIT IS with Premiere of Dua Lipa’s “Be the One” Music Video - BMW Group, Intel and Mobileye will have autonomous test vehicles on the roads by the second half of 2017 - Researchers design one of the strongest, lightest materials known - World’s first floating city one step closer to reality in French Polynesia - Engineers get under robot's skin to heighten senses - Here to stay: car2go Europe CEO presents six assumptions on the future of car sharing - El Clasico as it's never been seen before thanks to Intel's 360° replay technology - New drone dives like a bird and leaps like a flying fish - Piaggio Group Reinvents the Future of Transportation with Introduction of Gita, the First Offering by Piaggio Fast Forward - Artificial intelligence learns to predict heart failure - Living sensors at your fingertips - Toward all-solid lithium batteries - Solar Team Great Britain designs the UK’s first family-sized solar-powered car - Paris experiments with driverless buses - Voice control everywhere - 3Q: Julien de Wit on the discovery of seven temperate, nearby worlds - Intel Drone Technology Takes the NBA’s 2017 Verizon Slam Dunk Contest to New Heights with First Drone Assist to Aaron Gordon - Medical robot made from hair-width fibre optic to be developed by scientists - GETTING READY TO FLY! LEGO TECHNIC® BMW R 1200 GS ADVENTURE DESIGN CONCEPT HOVER RIDE - PEUGEOT INSTINCT CONCEPT, augmented freedom - Human carrying drones by HOVERSURF inc - $10 Raspberry Pi Zero W is new Raspberry Pi Zero variant with wireless WAN and Bluetooth - Cooperation European Transmission System Operators to develop North Sea Wind Power Hub - This identified flyer takes transport to a new level. The future is now. - UrbanX | Convert Any Bike to an Electric Bike in 60 Seconds - Intel and TAG Heuer Fuse Style and Innovation with TAG Heuer Connected Modular 45 - ONE-OF-A-KIND LG TONE STUDIO WIRELESS WEARABLE BEGINS GLOBAL ROLLOUT - DLR inaugurates the world's largest artificial Sun Sun at the push of a button - Airbus and Italdesign unveil modular urban land and air transport system - Volvo’s first all electric car will be made in China - Flying water taxis are hitting the rivers of Paris this summer - World premiere of the Volocopter series model 2X – The flying taxi is just about to be launched onto the market - adidas and Siemens set to collaborate in the digital production of sporting goods - AeroMobil is launching a flying car that you can actually buy this year - 3-D printing offers new approach to making buildings - Electric motor sets two speed records - Biggest X-ray laser in the world generates its first laser light - The clever electronic inks rewriting our energy future - Researchers engineer shape-shifting noodles - Uber sets 'flying car' launch for 2020 - Giving robots a sense of touch - Construction begins on the world’s first super telescope - Inspired by nature: New body protection for BMW employees - BLOODHOUND IS GO! A supersonic racing car designed to hit speeds of 1,000mph is to be tested for the first time. - Pavegen unveils world’s first energy-harvesting smart street in London - Autotalks Launches Bike-to-Vehicle (B2V) Technology to Prevent Motorcycle Accidents - Eager Anticipation Ahead of Berlin – Europe Plays Host to the Formula E Race Series - A new all-electric aircraft with a range up to 600 miles unveiled at Paris Air Show - France aims to have ‘driverless’ high-speed TGV trains by 2023 - Robots to Enhance, not Replace Humans in most Jobs: ARM Survey - NEXT GENERATION OF IRON MAN FLYING SUIT WILL BE 3D PRINTED - Panda Solar Stations - Youth Engagement and Innovation to Promote Sustainable Development - Audi models with a solar roof: Car manufacturer cooperates with Hanergy - LG UNVEILS WORLD’S LARGEST OLED SCREEN IN DUBAI - Miniaturizing the brain of a drone - Hyperloop One Goes Farther and Faster Achieving Historic Speeds - KLM develops smart Care Tag that assists travelers in Amsterdam - Scientists are testing out a device that could heal organs and brain injuries in seconds. - Speedo and Samsung Make Waves with Partnership to Bring Industry-Leading Swim Tracking Capabilities to Gear Fit2 Pro and Gear Sport - Lilium secures $90 Million Series B Funding Round - HP Steps Up With 3D Technology to Revolutionize the Footwear Market - Engineers unveil futuristic unmanned aircraft concept that uses both fixed and rotary wing flight - BAE Systems engineers have developed novel technology to protect pilots from laser attacks - QUEEN'S UNIVERSITY INNOVATION COULD MEAN FLEXIBLE BATTERIES FOR PACEMAKERS - New moovel lab project – “Who Wants to Be a Self-Driving Car” - Intel and Parley SnotBot Use Game-Changing Artificial Intelligence and Drones to Advance Whale Research - The world's largest BiOPV installation completed in France using Heliatek's Solar Film Solution, HeliaSol® - BMW Group, Daimler AG, Ford Motor Company and the Volkswagen Group with Audi and Porsche form Joint Venture - Wallpaper bio-solar panel developed by researchers - BMW Group invests 200 million euros in Battery Cell Competence Centre - Airbus, Rolls-Royce, and Siemens team up for electric future - Drone Breakthrough - SkyX Drone Completes 100km Flight - Engineers 3-D print a “living tattoo” - XEV says its 3D printed electric car is ready for mass production - A smart car that can read brain signals - Bosch and e.GO bring stress-free parking to Aachen - Researchers 3D print electronics and cells directly on skin - Atomically thin magnetic device could lead to new memory technologies - Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution - Volvo Cars unveils first solar energy installation at Ghent car factory - New digital tiles turn bedroom walls into cinema screens - New foldable drone flies through narrow holes in rescue missions - Hyundai Motor Reveals World’s First Smart Fingerprint Technology to Vehicles - Siemens and Alstom regret European Commission's decision to prohibit combination of their mobility businesses - One-Board Discovery Kit from STMicroelectronics Contains Three 8-Pin STM8 Microcontrollers for Best Convenience and Value - Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage - TE Connectivity introduces M8M12 cable assemblies for sensors and actuators used in harsh environments - Xilinx Introduces HDMI 2.1 IP Subsystem - University students full of ideas for living on the moon - X-FAB Announces Full Production Release of New High-Voltage Galvanic Isolation Technology - Renesas Electronics Expands RX24T and RX24U Microcontroller Lineup for High-Temperature-Tolerant Motor Control Applications - Infineon extends its portfolio of CoolSiC™ MOSFET power modules for UPS and energy storage applications - Lockheed Martin and Royal Netherlands Air Force Celebrate Rollout of the First Dutch Operational F-35 - VTT and ESA begin strategic cooperation with an aim to develop nonterrestrial 5G networks - MIRIS selects Nokia AirFrame Open Edge technology to deploy sustainable edge data center networks across Nordic region - Land UK wins 155mm ammunition competition for the British Army - Vector takes over Munich-based TESIS - KDDI deploys Nokia gigabit G.fast solution to bring new services to its high-speed internet 'au Hikari' customers in Japan - Larry Weiss to Join Analog Devices as Vice President, General Counsel and Secretary - Semiconductor R&D Spending Will Step Up After Slowing - Intel Names Robert Swan CEO - Intel Capital Fuels Cloud Innovation with a Combined $30 Million Investment in Three Startups - MWCapital, SEAT, Telefónica, Ficosa, ETRA and i2CAT promote a Connected Car pilot project - Work Complete on new National Healthcare Photonics Centre - New DAC Aims to Ease System Design - Siemens launches Fund for the Future to shape structural transformation in Germany - Ericsson joins O-RAN Alliance - At Cabsat 2019 Rohde & Schwarz will showcase latest advances in scalable storage, satellite amplifiers and file-based media solutions - Raman-on-Chip for High-Throughput, High-Resolution Handheld Spectroscopy - Operations and Workforce Expansion - Michael Maurer appointed new Product Marketing Manager for Power Management ICs at ROHM - Pliops Raises $30 Million in Series B Funding Led by Softbank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML - New-Tech Europe Magazine | February 2019 - From Development Board to Production Solution in Zero Time - When Robots Can Communicate with Each Other What Industry 5.0 and Machine-Vision Systems Mean for Industrial Automation - Beyond Distribution - ready-to-use products - Improving Embedded Security with the Armv8-M Architecture and TrustZone - Artificial Intelligence: It's all about the Cloud or it’s on the Edge ? - Community Boards as Development Platforms - AI & Automation: benefits for business & industry - How Real-Time Control, Safety, and Security Are Driving Technological Innovation in the Factory of Tomorrow - Re-Defining Embedded Vision SMART IMAGING FOR THE VISION OF THINGS - AI systems will become our workmates. Workmates we understand and trust. - Security is changing in the IoT era - Adaptive Acceleration Holds the Key to Bringing AI from the Cloud to the Edge - Anritsu wins World-First GCF Approval for both 5G RF Conformance Tests and 5G NR Protocol Conformance Tests News Release Anritsu wins World-First GCF Approval for both 5G RF Conformance Tests and 5G NR Protocol Conformance Tests - ROHM provides automotive-grade wireless charging solution with NFC communication - Custom tailored Micro Coax Cables for high Speed Transmission - Renesas Electronics Launches Digital Isolators with Superior Radiation Performance for Small Satellites in Low Earth Orbit - Cypress Advances Premium Automotive Infotainment User Experience with Wi-Fi 6 Connectivity Solution - IoT Provider Increases Location Services Accuracy 3X Using New Bluetooth 5.1 Direction Finding Feature - Waterproof USB Micro B and Type C Receptacles Feature IP67 Ratings - Microchip’s First Libero SoC Design Suite Release Boosts FPGA Designer Productivity and Delivers One Unified Design Suite for Latest Families - Hailo expands Series A round to $21M and launches Hailo-8™ Fast Track program for select customers - Sky and Space Global Shortlisted for the Best Mobile Innovation for Emerging Markets MWC Award - Würth Elektronik eiSos opens subsidiary in Slovenia - New site in the global battery production network: Mercedes-Benz Cars to build battery factory in Jawor, Poland - New supercomputer boasts unparalleled computing power - SolarEdge Announces Closing of S.M.R.E. Spa Acquisition - Tiny, low profile, 150W AC-DC power supply from XP Power features medical (BF) and ITE approvals. - Samsung Enables Stunning Picture Quality and Elegant Designs in 8K TVs with Advanced Display Driver IC - Kerlink Licenses Low-Power IoT Reference Design Solution To Kaertech, a Leading Provider of Connected Objects - Semiconductor Unit Shipments Exceeded 1 Trillion Devices in 2018 - New AI-based Ericsson Operations Engine makes managed services simple - Smart microrobots that can adapt to their surroundings - BAE Systems wins company prize from Worshipful Company of Shipwrights and apprentice named Shipyard Apprentice of the Year - Audi expands premium mobility offering in Europe: Audi on demand starts in Spain - Toshiba Memory Europe Unveils Industry’s First UFS Ver. 3.0 Embedded Flash Memory Devices - TE Connectivity extends M12 portfolio with the L-code PCB/panel-mount power connectors - Dropbox to acquire HelloSign - TowerJazz Announces Smallest in the World Global Shutter Pixel Ramping to Production on 65nm Platform in its 300mm Japanese Site - Microchip and Acacia Communications Collaborate to Enable First Flexible Rate Optical Transmission Up to 600G - T-Contact Products From Harwin Now Available Globally via Digi-Key, Mouser and TTI Channels.. - ETHERTRONICS®, AN AVX GROUP COMPANY, ANNOUNCES NEW PORTABLE MILLIMETER WAVE MEASUREMENT SYSTEM - National Geospatial-Intelligence Agency awarded BAE Systems a five-year contract - Hyperstone appoints a new Vice President of Sales for the Americas - Boeing Autonomous Passenger Air Vehicle Completes First Flight - Rohde & Schwarz strengthens its monitoring and IP contribution business fields by integrating GMIT GmbH - TowerJazz and Ranix announce a partnership to develop RF transceivers to be used in V2X and ETCS Systems for the Automotive Market - Toshiba Expands Ethernet Bridge IC Lineup for Automotive and Industrial Applications - Fast-Recovery Super-Junction MOSFETs from STMicroelectronics Bring Superior Performance to Bridge and ZVS Converters - Global GDP Growth Increasingly Important Driver of IC Market Growth - Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-screen Display Smartphones - Rheinmetall and BAE Systems to create a UK based Land Systems Joint Venture - Digi-Key Announces Winner of Coveted Camaro at electronica - Integrated IoT Solutions - From Data Acquisition to Device Control - First motorised luminaire with Dynamic Beam Shaping and smart wireless controls - Nokia's Service Operations Center powers Telefónica UK's drive towards customer-centric operations - Samsung Launches Exynos 7 Series 7904 Mobile Processor, Tailored for Indian Consumers - Singtel, Ericsson and Singapore Polytechnic open 5G Garage - Qualcomm Chipsets and RF Front End Power More than 30 Commercial 5G Mobile Devices Scheduled to Launch in 2019 - Analyzing frequency response using Bode plots with oscilloscopes from Rohde & Schwarz - Value of Semiconductor Mergers and Acquisitions Falls Considerably - Renesas Electronics Simplifies Home Appliance Maintenance with Failure Detection e-AI Solution for Motor-Equipped Home Appliances - Interview: Stefan Juraschek, Vice President Development Electric-Powertrain. - New-Tech Europe Magazine | January 2019 - Man and machine collaborating on the factory floor: a nightmare or a match made in heaven? - Nordic nRF91 Series roll-out brings cellular IoT to any application From asset tracking to medical monitoring, Nordic’s easy-to-design-in cellular IoT delivers a compact, low power, secure LTE-M and NB-IoT module for everything - How Real-Time Control, Safety, and Security Are Driving Technological Innovation in the Factory of Tomorrow - CES 2019 Proves AI and 5G Will Transform the Future Every company is a tech company at the world’s most influential tech event - Solid State Switching for Next Generation Wireless Test Applications - Analog Devices’ Katsu Nakamura Named IEEE Fellow - New-Tech Europe Magazine | December 2018 - European consortium developed components for miniaturized gas sensors based on Mid-IR spectroscopy - Flash Memory Remains Primary Target for Capex Spending - University's contribution to global technology recognised in UK’s Best Breakthroughs list - LiNaMan Project Working on Next Generation EV Batteries - Infineon first chipmaker to be named "Partner of The Year" by Hyundai for cooperation in electro-mobility - China Market Drives Essentially All Pure-Play Foundry Growth in 2018 - 60 mm thyristor modules from Infineon Technologies Bipolar combine right fit functionality with proven reliability - ERNI Electronics implements global materials procurement strategy to meet high demand - First Network Interface for Car2x/V2X Communication - Semiconductor Leaders’ Marketshares Swell Over the Past 10 Years - Lotus leaf inspires scientists to create world’s first self- cleaning metals - Imec and CARDIS partners develop unique photonic-based medical device for the screening of arterial stiffness and the diagnosis of cardiovascular diseases - Cypress Advances Premium Automotive Infotainment User Experience with Wi-Fi 6 Connectivity Solution - Dual-Radio Bluetooth®/LPWAN IoT Development Kit from STMicroelectronics Enables Creatively Connected Smart Devices - STMicroelectronics’ STM8L050 Extends Choice and Freedom in 8-bit Microcontrollers, with Rich Analog and DMA in Low-Cost 8-pin Package - NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving - Tampere University and VTT to lead robotisation of SMEs with a total funding of EUR 32 million - Israel’s Magenta Venture Partners announces first closing of a new $100M fund focused on early stage Israeli startups - New multi-channel spectral sensor from ams set to transform the market for mobile color and light measurement - LG ELECTRONICS’ PROMISE OF AI FOR AN EVEN BETTER LIFE DELIVERED AT CES 2019 KEYNOTE - Toshiba Memory Europe Unveils 1TB Single Package PCIe Gen3 x4L SSDs with 96-Layer 3D Flash Memory - Ericsson and Qualcomm complete 5G data call on 2.6 GHz band - Falk Herrmann appointed new CEO of Rohde & Schwarz Cybersecurity - Samsung and KDDI Demonstrate Real Time 4K Video Communication Powered by 5G at a Japanese Train Station - CPI Supports Project to Improve Industrial Productivity - Flex Power Modules broadens portfolio to meet rising demand in industrial and railways sectors - Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement - T-Mobile, Ericsson and Intel successfully complete first 5G call on 600 MHz - Qualcomm Chipsets and RF Front End Power More than 30 Commercial 5G Mobile Devices Scheduled to Launch in 2019 - 2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration - Maxim’s Latest Ultra-Low-Power PMIC Enables Highest Sensitivity Optical Measurements - Hyundai Motor Group and WayRay Unveil  Next-generation Visual Technology at CES 2019 - ams introduces world’s smallest 1D time-of-flight sensor for accurate proximity sensing and distance measurement in smartphones - Daimler Trucks invests half a billion Euros in highly automated trucks - Imec and TNO launch comfortable, disposable health patch with long battery life to measure vital signs - NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution - CEVA Introduces WhisPro™, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices - Toshiba announces new 16TB Enterprise Capacity Hard Disk Drives – MG08 Series - Autotalks’ C-V2X Capabilities to be Demonstrated by HARMAN at CES 2019 - Toshiba Develops DNN Hardware IP for Image Recognition AI Processor ViscontiTM5 for Automotive Driver Assistance Systems - BMW Group at the CES 2019 in Las Vegas. Virtual drive in the BMW Vision iNEXT - Rohde & Schwarz, China Mobile and MediaTek successfully perform a technical trial of a 5G mmWave prototype terminal - Valeo Demonstrates Telematics Platform Equipped with Autotalks' Global V2X at CES 2019 - Ficosa reinforces its presence in Portugal with new facilities - Analog Devices and Momenta Collaborate to Advance High-Definition Maps for Autonomous Vehicles - ams to ease implementation of 3D optical sensing technology through partnership with software specialist Face++ - STMicroelectronics Drives AI to Edge and Node Embedded Devices with STM32 Neural-Network Developer Toolbox - Volvo Cars and Luminar show groundbreaking autonomous technology development at Automobility LA 2018 - Nokia completes the sale of its IP Video business - SolarEdge to Enter E-Mobility Market with Acquisition of S.M.R.E. Spa - New Horizons: The Historic flyby of Ultima Thule - Customizing computer-aided design - Samsung’s Exynos Auto V9 to Power Next-generation Platform for Audi’s In-vehicle Infotainment System - AVX INTRODUCES NEW ULTRAMINIATURE, THIN-FILM TRANSMISSION LINE CAPACITORS FOR HIGH-PERFORMANCE MICROWAVE & RF APPLICATIONS - ON Semiconductor Announces Strata Developer Studio™, Industry’s Most Comprehensive Research, Evaluation and Design Tool - Four-in-one environmental sensor, available from RS Components, saves space and power in portables, wearables, and IoT devices - In Germany, young people are pushing e-mobility: acceptance of it decreases with age. Drivers choose "green" power for their electric vehicles - Sikorsky, Boeing Provide First Look at SB>1 DEFIANT™ - Laser-pointing system could help tiny satellites transmit data to Earth - TIM and Ericsson make first 5G NR video call using mmWave spectrum in Europe - ams shows why ‘Sensing is life’ at CES - Teledyne e2v’s delivery of 125 science-grade sensors completes contract for world’s most powerful survey telescope - Osram makes car keys superfluous: unlocking with iris scan and facial recognition - Digital and Analog MEMS Microphones Added to CUI’s Audio Product Group - Industry’s first RISC-V SoC FPGA architecture brings real-time to Linux, giving developers the freedom to innovate in low-power, secure and reliable designs - Single-chip maXTouch® touchscreen controllers enable 20-inch automotive touchscreens - Optimizing Device Lifecycle Management Of Remote, IoT Connected, LPWA Devices - A smart shoe for athletes and diabetics - Würth Elektronik eiSos to build technology center in Munich - Carbon handprint: New environmental indicator for evaluating the positive climate impacts of products - NXP, Nokia Awarded CATRENE Award for Driving 5G Innovation - Airbus Helicopters honors Rohde & Schwarz as “Best Performer” with the Supplier Relationship Management Award - CPI Collaborates on Faraday Challenge Battery Cell Project - Research project “FastCharge”: ultra-fast charging technology ready for the electrically powered vehicles of the future. - Osram enters the 3D sensing market with two new VCSELs - How innovation can shape the payment card market of the future - Qualcomm Introduces Next-Gen Cellular Chipset Purpose-Built for IoT - Smallest data converters deliver high integration and performance - STMicroelectronics’ Compact STM8L001 Microcontroller Covers Essentials for Smart Devices, as it Cuts Power, Cost, and Footprint - Renesas Electronics Announces Industry’s First USB-C™ Combo Buck-Boost Battery Charger for Mobile Computing Systems - Quality is key: Infineon ships world’s first industrial-grade eSIM in miniaturized package - u-blox and MBC develop the world’s first fully integrated L1/L2 RTK solution for centimeter-level positioning applications. - Toshiba launches H-bridge driver IC supporting low-voltage, large current drive - PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cable Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost - AVX Adds A New Insulator to the Industry’s Only 2.55mm-Profile IDC Series to Further Expand Application Suitability - Lynx and Teledyne e2v reduce time and risk for safety certifiable PowerPC system development - High Reliability 3.00mm Pitch Power Connectors & Cable Assemblies with 10A Current Capacity - Startup founded by MIT alumnus unveils electric vehicles for the future - Imec reports for the first time direct growth of 2D materials on 300mm wafers - Daimler buys battery cells in a total volume of 20 billion euros - Autotalks Validates C-V2X Chipsets Using Rohde & Schwarz Equipment - GE Advances Digital Leadership with Launch of $1.2 Billion Industrial IoT Software Company - DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019 - CPI Supporting BodySense Project to Develop Smart Devices - Ericsson, SK Telecom and Qualcomm collaborate to break 5G barriers - Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node - Cypress Strengthens Internet of Things Leadership with Cirrent Software Offering - First implementation of the new NATO standard: Rohde & Schwarz awarded order from Royal Danish Navy for BRASS EO - Connected, flexible, autonomous: BMW Group expands use of innovative technologies in production logistics - Ficosa inaugurates its new e-Mobility Hub, a pioneering centre at a national and international level for electric mobility technology - Fast Jet and Formula One technology sharing partnership signed between BAE Systems and Williams - EPFL part of Europe's largest research initiative on urban mobility - Belgian team secures million-dollar funding from Chan Zuckerberg Initiative - Rohde & Schwarz and Huawei conduct field trial precision latency measurements for 5G cellular V2X communication - Qualcomm Announces New Flagship Snapdragon 855 Mobile Platform - A New Decade of 5G, AI, and XR - Swisscom optimizes customer experience with Ericsson Expert Analytics - 5G network to improve road safety - Siemens inaugurates new campus in Zug - ON Semiconductor’s Battery-Free Smart Passive Sensors™ Win China IoT Innovation Award for Outstanding Technical Innovation - Samsung’s Big Semi Capex Spending Keeps Pressure on Competition - u-blox partners with Arvento to develop multi-purpose people and asset tracker - A new way to provide cooling without power - More processing power for connected aircrafts, in-flight infotainment and augmented reality in aviation - New-Tech Europe Magazine | November 2018 - Rohde & Schwarz acquires Pixel Power Limited and strengthens its Broadcast & Media business - Qualcomm Launches $100M AI Investment Fund - STMicroelectronics Adds High-Quality User-Interface Design Software to Free Development Ecosystem for STM32 Microcontrollers - Samsung Electronics Brings Multi-terabyte Storage Capacities at Accessible Price with 860 QVO SSD - Lockheed Martin Drives Affordability in F-35 Training Millions Saved on F-35 Trainers, Advanced Manufacturing Reduces Production Costs - TowerJazz Announces Korea Electrotechnology Research Institute (KERI) Begins Prototyping Gate Driver IC on its Advanced 0.18um SOI Power Platform - Siemens acquires COMSA to further extend lead in automotive electrical systems design - Toshiba recognised as Most Committed Supplier in Agfa HealthCare Supplier Excellence Awards - Engineering’s long-term need for outsider talent - When logic goes democratic: The potential of spintronic and plasmonic majority gates. - Flattening Negative Gain Slope with MMIC Fixed Equalizers - MIT engineers fly first-ever plane with no moving parts - Great things come in small packages: enabling augmented & virtual reality’s next wave - VectorCAST Certified for Medical Software Engineering - Ultra slim, low cost DIN rail power supplies launched by XP Power - High-accuracy Hall effect magnetic torque sensor from TT Electronics boosts EPS drivability for safer, sustainable motoring - Bosch and Daimler: San José targeted to become pilot city for an automated on-demand ride-hailing service - Imec, Ghent University and SEED Demonstrate Electronics in Hydrogel-based Soft Lenses - 5G powers 3D holographic communication - Infineon and IDEX Biometrics join forces to advance biometric card solutions - PROVERTHA Offers Very Compact Distribution Box with 360° Shielding - Infineon’s SECORA™ Pay W turns fashion wearables into payment devices – first implementations by leading fintechs - Maxim’s TRUSTECH 2018 Demo Showcases Mobile Payments Via PIN-on-Glass Technology - CPI Supports PowerDrive Line to Develop Battery Charging - New at FRAMOS: Sony Brings Small 0.5” OLED Display With UXGA Resolution and High Speed - Virtually Develop and Test AUTOSAR ECU Software Faster with vVIRTUALtarget from Vector - Positronic Releases Panther II – A Unique Connector Designed for Rugged Industrial Applications - Finnish 5G technology enables efficient mobile streaming to large audiences - Renesas Electronics Accelerates Sensor Network Gateway Design with RZ/N1S IO-Link Master Solution for Smart Factory - electronica 2018 - The electronics of the future are smart, safe and secure - Embedded vision made easy - Anritsu Announces release of All-in-One 400GbE PAM4 BER Measurements - Siemens honors 12 researchers who account for 590 inventions - Deutsche Telekom and Ericsson partner to provide industry solution for OSRAM - Ams releases industry’s slimmest proximity/color sensor module for bezel-less smartphone designs - zweiB invests in latest generation mastering station from Rohde & Schwarz - Outlook Remains Bright for Automotive Electronic Systems Growth - STMicroelectronics Adds 6-Axis Inertial Module to Ultra-Low-Power MEMS Sensors Offering for Industrial Applications - Alfa and Nokia deploy 4.5G Pro technology for ultra-broadband on the evolutionary path to 5G - Samsung Electronics Expands Horticulture LED Lineups to Advance Greenhouse and Vertical Farming - Imec and CEA-Leti join forces on Artificial Intelligence and Quantum Computing - First in Finland: Nokia signs the UN Standards of Conduct for Business to pledge support for LGBTI rights worldwide - Rohde & Schwarz presents new modular RF switch and control platform for a wide range of test scenarios - Flex Power Modules targets emerging Direct Conversion market with class-leading isolated DC-DC converter - Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio - Renesas Electronics' Extreme Low-Power SOTB™ Process Technology Eliminates the Need for Batteries to Power IoT Devices - A million printed components in just ten years: BMW Group makes increasing use of 3D printing - Osram presents long-life LED for general lighting - Autotalks Expands into China with its Truly Secure LTE-V2X Solution - Revised SI system promises innovations for the future of industry - Game-Changing Digital-Micro-Switch Technology from Menlo Micro Now Commercially Available - Analog Devices Announces Industrial Automation Solutions to Help Accelerate the Path to Industry 4.0 - ON Semiconductor Delivers Energy Harvesting Bluetooth® Low Energy Switch Based on the Ultra-Low-Power RSL10 SIP - New Intel RealSense D435i Stereo Depth Camera Adds 6 Degrees of Freedom Tracking - Nokia, ABB and Kalmar conduct industry's first trial with ultra-reliable, low-latency 5G technology for electricity grid and harbor automation - Accelerate Development of Remote IoT Nodes with the Industry’s Lowest-power LoRa System-in-Package Family - Developers use 5G to power innovation in robotics - Samsung Brings On-device AI Processing for Premium Mobile Devices with Exynos 9 Series 9820 Processor - INICnet Technology Simplifies Automotive Infotainment Networking with Support for Ethernet, Audio and Video Over a Single Cable - “Making cities smarter”: moovel presents the latest digital mobility solutions at Smart City Expo World Congress in Barcelona - Toshiba Unveils 130nm FFSA™ Development Platform Featuring High Performance, Low Power and Low Cost Structured Array - Tiny Coin-Shaped Development Kit from STMicroelectronics Delivers Sensor Fusion, Voice Capturing, and Bluetooth 5.0 Mesh Networking - Nine Top-15 2018 Semi Suppliers Forecast to Post Double-Digit Gains - Cypress USB-C Controller Enables Fast Charging of Portable Electronics in Vehicles - Siemens and Aruba, a Hewlett Packard Enterprise company, form strategic partnership for integrated networks - Intel Accelerates Timing for Intel XMM 8160 5G Multimode Modem to Support Broad Global 5G Rollouts - Ericsson, Einride and Telia power sustainable, self-driving trucks with 5G - New ams gas sensor module for kitchens enables automatic control of cooker hoods and ventilation fans - Rohde & Schwarz optimizes power supplies for educational applications - Teledyne e2v launches improved version of its award-winning Digital-to-Analog Converter - New Automotive Intelligent Power Modules from ON Semiconductor Provide Space and Power Saving Integrated Solution for Vehicle On-Board Charging Applications - Analog Devices’ High-Power µModule Regulator Eases Data Center Cooling Requirements - Gallium nitride solutions from Infineon are in volume production - EVERLIGHT Demonstrates Smart Automotive and Infrared Products at Electronica 2018 - Advantest Introduces New Module, Extending EVA100 Measurement System’s Capabilities to Include High-Voltage Semiconductors - EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications - Nyxoah Raises €15 Million in New Financing, Completes BLAST OSA Clinical Study - electronica 2018: Tailored security solutions for the Internet of Things - € 16 Million for the Battery of the Future - PragmatIC and S&S smooth the way for ultra low cost printed RFID - New Infineon IFX007T – An easy-to-use high power motor driver qualified for industrial and consumer applications - Murata shrinks NBIoT module and stretches battery life - ON Semiconductor and Mercedes EQ Formula E Team will work jointly to develop innovations for electric power trains of the future - Nokia signs frame agreements worth more than EUR 2 billion with three Chinese operators - NXP Opens Electronica 2018 with Solutions for Machine Learning at the Edge for Industry 4.0 Applications - Renesas Electronics Introduces Innovative Safety Analysis Tool to Simplify Automotive ISO 26262 Compliance - TI unlocks mmWave technology for worldwide industrial market through new 60-GHz sensor portfolio - Gyrfalcon Launches Second-Gen AI Accelerator - u blox collaborates with ERM to launch a vehicle tracking device with a built-in Wi Fi hotspot - Teledyne e2v delivers first flight module for EUMETSAT’s Meteosat Third Generation (MTG) - Full-Bridge 600V/3.5A System-in-Package from STMicroelectronics Delivers Space Savings with Flexibility and Safety - Quarterly Year-over-Year Growth Slows Substantially for IC Market - Maxim’s Go-IO Drives Intelligence to the Digital Factory Edge - Maxim's Digital Input ICs Deliver 50% Smaller Footprint, 60% Lower Power and 6x Faster Throughput - Imec Adds UV Sensing Capabilities to Its Portfolio of CCD-in-CMOS-based Time-Delay-Integration Imagers - Volvo Cars and Baidu join forces to develop and manufacture autonomous driving cars - FRAMOS Launches Embedded Vision Ecosystem of Sensor Modules and Adapters - Renesas Electronics Sub-Gigahertz Wireless Solution Selected as Candidate of Standard Test Bed Unit for Wi-SUN FAN Specifications - UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series - Ericsson driving real-life customer trials with 5G devices - Intel Shows Breadth of Data-Centric Platform with Cascade Lake Advanced Performance and Xeon E-2100 - Analog Devices’ Transceivers Bring High-Def Video via Existing Vehicle Cable and Connector Infrastructure - Infineon at electronica 2018: Electromobility is being made fit for long distances, drones are coming of age, and robots are becoming agile - u-blox’s first multi-band GNSS timing receiver meets 5G’s stringent accuracy requirements - Hyundai Invests in Deep Learning Computer Vision Startup allegro.ai - NanoLock and Winbond to Unveil Industry’s First Secure Cloud Controller Flash Memory for IoT Devices at electronica 2018 - 50 Megapixel CCD Image Sensor from ON Semiconductor Targets Inspection of Smartphone Displays - Volkswagen, Mobileye and Champion Motors to Invest in Israel and Deploy First Autonomous EV Ride-Hailing Service - Teledyne e2v announces new 5Mpixel CMOS image sensor for high-speed scanning and embedded vision solutions - Qualcomm Snapdragon 675 Mobile Platform Brings Outstanding Gaming with Advanced AI and Cutting-Edge Camera Performance to Consumers in Early 2019 - CYBEREASON PARTNERS WITH ARM TO PIONEER PROTECTION FOR THE IOT ECOSYSTEM - Qualcomm and Ericsson Successfully Make First 3GPP-compliant 5G NR Sub-6 GHz OTA Call with a Mobile Form Factor Device - Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2 - TIM, Ericsson and the City of Turin explore the impact of 5G - TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0 - Extend battery life in portable devices with new ultra-low Iq LDO - Maxim Unveils Industry’s First Authenticator IC with SHA3-256 Cryptographic Engine - World’s first TPM for cybersecurity in the connected car - Sharing your own car via an app: Infineon and XAIN to collaborate on bringing blockchain into the car - AT&S develops and manufactures miniaturised printed circuit boards for medical technology - New Connected-Car Automotive MCU from STMicroelectronics Enables Secure Remote Updates and High-Speed In-Vehicle Networking - INDO DEFENCE 2018: Rohde & Schwarz presents innovative portfolio of communications and intelligence systems - Toshiba announces Bluetooth® 5 IC for automotive applications - ON Semiconductor Introduces Mesh Networking and New Development Support for Industry-Leading RSL10 Bluetooth® 5 Radio Family - Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market - Imec Releases Neuropixels Neural Probe to the global Neuroscience Community - Optoelectronics, Sensors/Actuators, Discretes Climb Again - €600 million for Berlin – Siemens signs future pact for Germany as an industrial location - Teledyne e2v and partners to build a new generation of ultra-precise atomic clocks - Basler Presents IoT Demo with Embedded Vision System at electronica 2018 - Award Success for CPI Partner Company Stream Bio Limited - New TI portfolio of ready-to-use, 600-V GaN FET power stages supports applications up to 10 kW - BAE Systems announces £3.5m electric propulsion development - Robust Circular Sensor Connectors Target Motorsport Deployment - Teledyne e2v and The Open University’s Centre for Electronic Imaging renew 5-year partnership - TowerJazz Reports Revenues of $323 million with Net Profit of $34 million for the Third Quarter of 2018 - New-Tech Europe Magazine | October 2018 - Belgium Selects F-35 Lightning II for Future Defense Needs - omniCOOL: Introducing a unique approach to fan design - Accelerating RF/Microwave Design From Concept to Product - Connector Designs To Address Data Rate and Density Challenges - Outsourced development - why is it good and a little about how - Build vs Buy: Why Developing Your Motor Drive with Smart Microsystems May Be Your Best Option - Realizing 5G New Radio Massive MIMO Systems - Teledyne e2v announces full HD CMOS image sensor for low-cost machine vision - UltraSoC and ResilTech partner to further functional safety in automotive systems - Ultra-light gloves let users “touch” virtual objects - ON Semiconductor Announces Industry’s First CE Certification for Sigfox Verified RF System-in-Package Solution - Arrow Electronics Showcases IoT, Start-up and Software Solutions at electronica - Flexible, efficient and successful. - Rohde & Schwarz presents its next generation T&M solutions for 5G, automotive and IoT at electronica 2018 - DECT Remerges as Driving Technology for Magenta Smart Speaker HD Voice Calling Powered By DSP Group - Renesas and BlackBerry Deliver R-Car Based Development Environment Integrating Virtualization, Functional Safety, and Security - HGH Infrared Systems Wins Multi-Million Euro Contract to Equip African Warships with SPYNEL Thermal Imaging Camera - New-Tech Europe Magazine | September 2018 - Kerlink Launches Japanese Subsidiary to Serve Growing Interest in the IoT in Japan and Speed Expansion in Asia - Ericsson and Limelight Networks to accelerate content delivery and edge cloud adoption - Renesas Electronics Recognizes BFG Engineering With 2018 Renesas European Alliance Partner of the Year Award - Universum’s employer survey 2018: VTT voted one of the most attractive employers in Finland - Imec and ASML Enter Next Stage of EUV Lithography Collaboration - Infineon to drive edge-computing based applications running on Amazon Web Services - Absolute Encoder Series Adds Multi-Turn Output Option - The unique R&S QAR from Rohde & Schwarz visualizes and characterizes signal penetration of radomes - Faster, More Flexible Probe from STMicroelectronics Eases STM8 and STM32 Programming on the Bench or in the Field - XP Power launches highly flexible 500W peak-power AC-DC supply, targeting industrial and Body Floating rated medical applications - Connecting everything - smart, safe & secure  - Monitor temperature at multiple locations with low-power 1.8V temperature sensor family - Rohde & Schwarz adds new handheld microwave spectrum analyzers to its R&S Spectrum Rider FPH family - AVX Releases New Lambda-Bridge Thermal Conductors - UnitedSiC expands SiC JFET portfolio with Gen-3 1200 V and 650 V options - Renesas Electronics Accelerates HMI- and Camera-Based Development with Integrated RZ/A1 Design Environment - Murata develops world’s smallest 32.768 kHz MEMS resonator - Flex Power Modules boosts portfolio for RFPA applications with PKB-D 250W DC-DC converter - STMicroelectronics and Fidesmo Bring Secure Contactless Transactions to Wearables in Complete Payment System-on-Chip - Bosch launches IoT software solutions on Huawei Cloud - TowerJazz Increases ITAR Portfolio, Adds 65nm Technology in Support of Growing Aerospace and Defense Customer Demand - Advanced Technology Key to Strong Foundry Revenue per Wafer -  Visitors are Invited to “Win with Digi-Key” at electronica 2018 Munich - VTT, TactoTek and their work on structural electronics won an international innovation award - Communications Rise To Represent Largest Portion of Foundry Sales - Pharrowtech boosts millimeter-wave fixed wireless access coverage - European Society of Radiology and GE Healthcare announce exclusive artificial intelligence partnership for ECR 2019 - Intel Artificial Intelligence and Rolls-Royce Push Full Steam ahead on Autonomous Shipping - TDK at electronica 2018 – Attracting Tomorrow! - Cypress Expands Collaboration with Arm to Deliver Full-featured IoT Platform with Secure Device Management - Samsung Electronics Starts Production of EUV-based 7nm LPP Process - FRAMOS® partners with Rhonda Software to Strengthen Embedded Vision Development - Maxim to Showcase Adaptive Manufacturing, Wearables and Automotive Solutions at electronica 2018 - Testing new drugs with “ALS-on-a-chip” - L4MS launches its first Open Call: €1.5M equity-free funding for manufacturing SME’s - Study opens route to flexible electronics made from exotic materials - Researchers quickly harvest 2-D materials, bringing them closer to commercialization - Vicotee Njord, the versatile Plug & Play IoT solution based on Linear Technology's SmartMesh IPTM to be launched at Electronica 2016 - Linear Technology Demonstrates First Wireless Battery Management System in BMW i3 at Electronica Show - ON Semiconductor Introduces Automotive Industry’s Most Compact Intelligent Power Module at Electronica 2016 - TI enables more efficient motor design with faster, more accurate current-sense amplifier - Highly accurate relative humidity and temperature sensor IC from ams ideal for space- and power-constrained designs ENS210 enables portable and connected smart home devices to improve perfor-mance and implement valuable new features - electronica Trend Index: Worldwide, Germans rely the most on data protection - FUJITSU releases a full line-up of capacitive touch panels - Maximum capacity, minimum space - NXP Introduces Modular IoT Gateway Solution with Multi-Protocol Compatibility for Secure, Reliable Wireless Connectivity in Smart Cities and Smart Industries - World record: Infineon chip solves Rubik's Cube in 637 milliseconds - A milestone for laser sensors in self-driving cars - OmniVision and Corephotonics Announce Dual-Camera Zoom Reference Design for Smartphones - Maxim’s LED Matrix Manager Empowers High-Density Automotive Matrix and Pixel Lighting - Students at electronica Win Great Prizes Sponsored by Digi-Key - Startup uses 3-D printing to reinvent the production of metal parts - Nokia expands Fixed Wireless Access FastMile portfolio for greater flexibility and performance in delivering ultra-broadband services - Electric motors on the rise - Samtec Announces Acquisition of PCI - Dr. Christof Ehrhart takes lead of Corporate Communications, External Relations and Brand Management at Bosch - Standardized LED signal lamps from Osram and Koito are being used for the first time on the new Toyota Corolla Sport - Intel Announces World’s Best Gaming Processor: New 9th Gen Intel® Core™ i9-9900K - Half the size, twice the current: new Infineon SPOC™+2 configurable SPI Power Controllers - Lockheed Martin Reveals New Human Lunar Lander Concept - ams AS6501 offers speed, precision for LiDAR and medical imaging applications - Maxim Unveils First Wrist-Worn Platform for Monitoring ECG, Heart Rate and Temperature - Highest-precision reinforced isolated amplifier enables longest lifetimes in industrial voltage-sensing application - Mouser Electronics First Authorized Distributor to Receive AS6496 Accreditation for Strong Anti-Counterfeit Measures - Automotive lighting of the future: Osram’s Oslon Boost HX opens up new concepts - Exostar, LLC Acquires Pirean Limited - ON Semiconductor Completes Additional Share Purchase of Fujitsu’s 8-inch Wafer Fab - NXP Accelerates Time to Market for Automotive Radar Applications with New Radar Solution - Siemens closes Mendix acquisition, extending industry leading digital innovation platform - Intel Xeon Scalable Processors Set 95 New Performance World Records - New cost efficient entry-level platform for high-end embedded computing - TowerJazz and SRI International Provide CMOS Imager Launched in NASA’s Parker Solar Probe Mission - Toshiba releases DC brushed motor IC with current limit detection - Harwin Strengthens its Popular Gecko Series - DRAM Market Braces For Slower Growth - Teledyne e2v expands its Emerald CMOS image sensor family with the addition of a new 8.9 Megapixel detector for machine vision and intelligent traffic systems - Xilinx Launches the World's Fastest Data Center and AI Accelerator Cards - Bradford Announces AI-Powered Hospital Command Center, First of its Kind in Europe - Renesas Electronics Unveils RZ/A2M Microprocessor for High-Speed Processing of e-AI Imaging in Smart Appliances, Service Robots, and Industrial Machinery - Rohde & Schwarz and Spirent announce collaboration for TC8 Automotive Ethernet testing - 3D Printing to Make Synthetic Fuels More Efficient and Cheaper - Osram and mantro present sensor for efficient building management - Renesas Electronics Introduces True Bidirectional Synchronous Buck-Boost Controllers for Industrial Battery-Powered Applications - ISELED Alliance expands to further drive market entry of the “digital LED” Belgian semiconductor player Melexis joins ISELED Alliance - Adobe, Microsoft and SAP announce the Open Data Initiative to empower a new generation of customer experiences - Ficosa develops and manufactures the digital rear-view system of the Audi e-tron, the first automobile to market with this technology - Ericsson and Qualcomm add 28 GHz to menu of bands ready for 5G early movers - Could a DIY ultrasound be in your future? UBC breakthrough opens door to $100 ultrasound machine - u-blox enters worldwide patent license agreement with Philips for 2G, 3G and 4G products - Kerlink & Macnica Sign Distribution Agreement to Deliver Turnkey Solutions and Support for Japan’s Internet of Things Networks - Microwave mining: engineering team behind revolutionary copper mining technology wins prestigious Academy Award - Amphenol Socapex presents its latest member to the high-speed connector family, a Cat.6A, 10 Gb/s Ethernet solution packed into a MIL-DTL-38999 Series III derived shell - AT&T and Ericsson team up on IoT cybersecurity - NXP Triples Its 65 V LDMOS Offering for RF Power - Renesas Synergy™ AE-CLOUD2 Kit Speeds Global LTE IoT Connectivity Development - ISELED Alliance is Continuously Growing - Rohde & Schwarz introduces the all-new R&S FSW with enhanced analysis bandwidth and RF performance - 98% Efficient Bidirectional Buck-Boost Controller for 12V-12V Redundant Battery Systems in Autonomous Vehicles - The Ocean Cleanup chooses Iridium - STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications - New Digital Signal Controller (DSC) Accelerates DSP Performance for Time-Critical Control Applications - Imec’s screen printed large-area nPERT solar cells surpass 23 percent efficiency - INEEL and VTT LTD promote technical cooperation within the energy sector - Intel Targets 5G Infrastructure with Latest Silicon Photonics Technology - World premiere: Alstom’s hydrogen trains enter passenger service in Lower Saxony - BAE Systems eyes novel way of flying - Mobility of the future: Daimler opens Immendingen Test and Technology Center - EM Microelectronic enables easy deployment of smart logistics and location services with a new generation of Bluetooth beacons - Renesas Expands Access to Robust Portfolio of IP Licenses - Belden Helps Simplify Industrial Security with Unidirectional Ethernet Network Appliance - Anritsu to Introduce, first time worldwide, the New 64G PAM4 MP1900A Signal Quality Analyzer at ECOC 2018 in Rome - Implement your servo controller in a day with the TMC4671 - Intel Acquires NetSpeed Systems for Chip Design - Digi-Key partners with RevX Systems to provide cellular connectivity services - Mouser Electronics and Marvell Enter Global Distribution Agreement - Rohde & Schwarz presents solutions for optimizing power electronics - Renesas Electronics Introduces Integrated Open Image Signal Processor Solution for Automotive Camera System Development with MM Solutions - ON Semiconductor Expands Bluetooth® 5 Radio Family with System-in-Package (SiP) Module - Infineon supports AI startups at the NVIDIA Inception Awards - Industry's first 200-W and 100-W USB Type-C™ and USB Power Delivery controllers with fully integrated power paths simplify designs - Nissan Integrates Maxim's Battery Monitoring IC Into New Nissan LEAF - Murata Adds New Functionality to SimSurfing Design Support Software - Medtronic to Acquire Mazor Robotics - New Ultra-Compact Automotive Grade Buck DC/DC Converters - Seven IC Products to Outpace Total 16% IC Market Growth in 2018 - SiTime and Bosch accelerate innovation in MEMS Timing for 5G and IoT - NXP Semiconductors and Hitachi Solutions Collaborate on Secure DSRC-based V2X Solution for Japanese Market - NXP Semiconductors Announces US$1 Billion Bridge Financing - Alibaba and Intel Transforming Data-Centric Computing from Hyperscale Data Centers to the Edge - Molex Showcases QSFP-DD 3-meter DAC Running 400 Gigabit Ethernet with Ixia - LynQ’s network-free location tracker featuring u blox M8 GNSS receiver goes into pre-sale - BAE Systems to provide actionable GEOINT capability for the National Geospatial-Intelligence Agency’s Janus portfolio - Nokia and Altran introduce joint solution to streamline train maintenance for railways - Rohde & Schwarz to present world's first Bluetooth® LE signaling test solution at Bluetooth World 2018 - Unleashing the Benefits of Industrial Convergence - How Cellular Technology is Transforming Home Security and Alarm Panels - Anritsu to Exhibit 64-Gbaud PAM4 Pulse Pattern Generator (PAM4 PPG)nat ECOC 2018 - congatec reports strong growth with record revenues for the first half of 2018 - Homogeneous illumination for facial recognition thanks to VCSEL technology from Osram - Fluxunit – Osram Ventures and Bayern Kapital invest in Munich-based Medtech company iThera Medical - ams Active Noise Cancellation technology empowers Linner to drive innovation in on-ear and over-ear audio applications - Ericsson and Singtel achieve Asia’s fastest five-carrier aggregation on LTE - Facilitating diagnosis with a new type of biosensor - Vector Acquires French Squoring Technologies - WIN-A-ROBOT COMPETITION LAUNCHED BY EPSON - Renesas to Acquire Integrated Device Technology, to Enhance Global Leadership in Embedded Solutions - TRACO POWER Group announces the opening of TRACO POWER France, its new subsidiary in Paris - T-Mobile and Ericsson sign major $3.5 billion 5G agreement - EiceDRIVERs: Infineon's 1EDN7550 and 1EDN8550 solve ground-shift issues in SMPS - Anritsu Company Introduces ACCESS Master™ MT9085 Series That Simplifies Verification of Fiber in High-bandwidth Networks - Toshiba H-bridge motor drive IC supports low voltage, high current drive - STMicroelectronics and Biricha Digital Power Cooperate to Implement Digital Power Supplies on STM32 MCUs - Next generation storage solution from Rohde & Schwarz on display at IBC 2018 - ON Semiconductor Expands Bluetooth® 5 Radio Family with System-in-Package (SiP) Module - Melexis announces low noise fandriver for automotive applications - Focus on modular IoT standards - NanoLock Security Selected to Prestigious Thales CYBER@Station F Program - Plessey and Jasper Display collaborate on tailored backplane for monolithic microLED displays - MCUs Sales to Reach Record-High Annual Revenues Through 2022 - Imec.xpand raises EUR 117 million to invest in innovative, early-stage ideas leveraging imec’s knowledge, expertise and infrastructure - Meeting the Challenges of Transforming the Digital Building from Concept to Reality - More than Just a Phase: Understanding Phase Stability in RF Test Cables - IoT platform for the process industry - European Investment Fund (EIF) first ever equity investment in Israel - New solutions around food: Fazer, IBM and VTT to set up an innovation ecosystem and research restaurant - Tektronix Expands Cloud-Based Asset Management Solution, Adds Managed Services Offerings - Renesas and OpenSynergy Adopted by Parrot Faurecia Automotive’s Safe Multi-Display Cockpit - MIT researchers 3-D print colloidal crystals - u-blox accelerates the development of low power location trackers with u-track toolset - LETI AND VSORA DEMONSTRATE 3GPP NEW RADIO (5G NR) ON MULTI-CORE DIGITAL SIGNAL PROCESSOR - Belden to Show Complete Rail IoT Solutions at InnoTrans2018 - Intel and Ericsson Achieve Milestone with First 3GPP NR-Compliant End-to-End Data Call over 39 GHz Spectrum - Anritsu Announces Release of 53 Gbaud Upgrade for PAM4 Optical Signal Analysis - Toshiba releases automotive 40V ultra low RDS(ON) MOSFETs in 5mm x 6mm packages with double-sided cooling - Memory ICs to Account for 53% of Total 2018 Semi Capex - Chassis Mount Ac-Dc Power Supplies Housed in Low Profile Metal Case - The next level in operating cost savings – the new medium-power transmitter from Rohde & Schwarz at IBC 2018 - NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks - Autotalks Launches the World's First Global V2X Solution Unifying DSRC and C-V2X on its Deployment-Ready Chipset - Antenova is shipping its ultra-small GNSS active antenna module with LNA and SAW for better positioning from difficult locations - Mouser Signs Global Distribution Agreement with Samtec - UltraSoC embedded analytics selected by Kraftway for solid state disk controller products - Ericsson strengthens end-to-end transport solutions for 5G - TomTom and STMicroelectronics to Offer Innovative Geolocation-Based Tools and Services - Teledyne e2v’s Emerald 12M and 16M image sensors enter mass production - Less Price Erosion Will Lift MEMS Sensor/Actuator Growth - Infineon complements its driver portfolio with a 200 V half-bridge gate driver IC for reliable start-up operation - The BMW Vision iNEXT World Flight. Two companies – one mission. - Enhanced Ericsson Radio System increases speed and adaptability of 5G rollouts - Rohde & Schwarz adds outdoor models to its family of satellite uplink amplifiers - Avnet Expands Share Repurchase Authorization by $500 Million; Increases Dividend by 5.3% to $0.20 per Share - Pasternack Quick Connect RF Loads - Teledyne e2v ultraviolet laser detector technology deployed on ESA’s Aeolus Satellite to profile the world’s winds - Samtec Releases Flyover™ QSFP28 Cable System - Wireless communication breaks through water-air barrier - It’s All in the Mix: Jülich Researchers are Developing Fast-Charging Solid-State Batteries - Nokia lands EUR 500 million EU Financing for 5G research - Qualcomm and Datang Demonstrate World’s First Multi-Chipset Vendor C-V2X Direct Communication Interoperability - New high-end wideband I/Q data recorder from Rohde & Schwarz enables realistic device tests in the lab - Samtec Introduces new VITA 42 XMC 12 mm mated connector sets - AVX RECEIVES 4-STAR SUPPLIER EXCELLENCE AWARD FROM RAYTHEON - Maxim’s LED Backlight Driver with Integrated LCD Bias Delivers Smallest Footprint for Larger Automotive Displays - World’s first portable recording studio: Infineon's digital MEMS technology enables Zylia ZM-1 microphone array - Toshiba gives more capacity to SAS 3.5” enterprise HDD models - u-blox module first to be certified on U.S. Cellular’s new LTE Cat M1 network - Nokia licensing rate expectations for 5G/NR mobile phones - German distribution stable but uninspired - Helping the Microchip Industry Go (Very Low) with the Flow - Toshiba sampling new high-definition microstepping motor driver - Aalto University and VTT launch a major innovation ecosystem aimed at doubling the value of forest industry - Mouser Electronics and Grant Imahara Explore Forefront of Cybernetics in New “Generation Robot” Video - Hi3G selects Ericsson to develop transport network for 5G in Denmark - Seven Top-15 1H18 Semi Suppliers Register ≥20% Gains - Samsung Announces Exynos Modem 5100, Industry’s First 5G Modem Fully Compliant with 3GPP Standards - C&K Launches New High Operating Life Cycle SDB DIP Switches With Low Profiles to Save Space on PCB layouts - Infineon extends its market leadership for power semiconductors - Maxim's 5kVRMS Reinforced Digital Isolator: 2x More Throughput at 4x Lower Power - ERNI Electronics Expands its M12 Connector Portfolio Introducing 12- and 17-Pin Variants - Samtec Announces New VITA 57.4 FMC+ Development Kits with FireFly™ Optical Engines - Labcenter Partners with SamacSys to Provide Schematic Symbols, PCB Footprints and 3D Models - Anritsu and COMPRION achieve eSIM OTA Test Solution Verification to Support ERA-GLONASS - Providentia research project: Rohde & Schwarz investigates mobile telecommunications infrastructure on the A9 - New 950 V CoolMOS P7 Superjunction MOSFET for PFC and flyback topologies - Toshiba announce next-generation superjunction power MOSFETs - VTT’s robot car, Martti, now “speaks 5G” and takes another step towards full automation - Reproducible Disturbances of CAN (FD) Networks - Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology - Protect In-vehicle Networks from Hackers with the Industry’s First Automotive Security Development Kit - UltraSoC brings SEGGER J-Link to embedded debug and analytics environment - miniDSP High-Performance USB Mic Array Now Shipping - Marvell Demonstrates Artificial Intelligence SSD Controller Architecture Solution - C&K Launches New KSC PF Switch to Provide Automotive and Medical Device Designers With a Reliable, Water-Resilient, Potting-Friendly Solution - 650 V TRENCHSTOP™ IGBT6 for small motor drives up top 1 kW - Qualcomm’s latest antenna module announcements bring 5G smartphones closer to commercial reality. - New at FRAMOS®: ON Semiconductor’s Latest EMCCD Imager Increases NIR Image Quality with Improved Quantum Efficiency - BAE Systems to develop automated cyber defense tools for DARPA - Government Confirms £1bn Funding for British Innovation - Arrow Electronics IC Solution Reduces IO-Link Development Time and Costs - Samsung’s 16Gb GDDR6 Memory Powers Latest NVIDIA Quadro Professional Graphics Solution - Martina Maier appointed new Chief Compliance Officer of Siemens - Plug-and-Play Wireless-Charging Kit from STMicroelectronics Creates Ultra-Compact Chargers for Wearables and IoT Devices - Size of Semiconductor Acquisitions May Have Hit Limit - The potential of sequential-3D integration for avanced semiconductor scaling - Connector Designs To Address Data Rate and Density Challenges - Simplifying CSP Manufacturing By Improving Heliostat Design - Conquering wireless connectivity challenges with simple, low-power proprietary wireless solutions - Kerlink and AdriNet to Expand Kerlink’s Distribution Network in Adriatic Market - Digi-Key Bolsters Industrial Automation Portfolio with Notable Suppliers; New Mobile-Friendly Landing Page - New-Tech Europe Magazine | August 2018 - On-chip optical filter processes wide range of light wavelengths - Qualcomm’s latest antenna module announcements bring 5G smartphones closer to commercial reality. - New-Tech Europe Magazine | July 2018 - Allegro MicroSystems Announces the Establishment of a New Research and Development Center in the Czech Republic - Siemens strengthens its digital enterprise leadership with acquisition of mendix - Optical fibers that can “feel” the materials around them - Using PoE networks to power IoT smart infrastructure for commercial buildings - A record year for Digi-Key Electronics - The future is optical! - NanoLock Security wins Gold for Startup of the Year in the 13th Annual 2018 IT World Awards® - Arm acquires Treasure Data to set the stage for IoT transformation - Vivacom launches 4G Voice service and Wi-Fi calling in Bulgaria - Qualcomm and NetEase Announce Continued Collaboration to Lead the Innovation and Transformation of Mobile Gaming Experiences - R&S AREG100A automotive radar echo generator – the reliable and future-proof production tester for automotive radar sensors - CPI Working with MIF to Boost UK's Innovation Capabilities - Samsung Electronics Starts Mass Production of Industry’s First 4-bit Consumer SSD - STMicroelectronics Expands Presence in Ultrasound Market with High-Performance 16-Channel Pulser - Global GDP Impact on Worldwide IC Market Growth Forecast to Rise - Ericsson and TIM complete Turin’s 5G-ready network transformation - Toshiba obtains UL 508 certification for eight photorelays - Computer tomography in automotive construction: BMW Group uses X-ray measurements for vehicle analysis - Infineon and Alibaba Cloud Sign MoU on Internet of Things (IoT) - New at FRAMOS®: The MOD255I is the First Sensor Module from Sunex Optics for Embedded Video Applications - Maxim’s Secure Microcontroller Delivers Advanced Cryptography, Secure Key Storage and Tamper Detection in a 50 Percent Smaller Package - Audi and Ericsson to pioneer 5G for automotive manufacturing - Epson Shipping Samples of a 32-Bit Microcontroller with Dedicated Sound Hardware - Display for vertical installation - Best-in-class ARM processor in application friendly shape - Analog Devices and B-Secur Collaborate on Biometric Authentication Technologies for the Automotive Industry - Intel to Collaborate with SiTime on MEMS Timing for 5G Modems - C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC - Play selects Ericsson to accelerate nationwide mobile network expansion in Poland - Toshiba launch high current photorelays in DIP4 package - Compact Power Entry Module with Filter - The winning team tracks the secure transport of blood samples with a Würth Elektronik radio module - Samsung Begins Mass Producing Industry’s First 2nd-Generation 10nm-Class, 16Gb LPDDR4X Mobile DRAM - Cell-sized robots can sense their environment - Qualcomm Delivers Breakthrough 5G NR mmWave and Sub-6 GHz RF Modules for Mobile Devices - EU Scientists harness photonics to develop faster, high capacity internet networks - 50A µModule Regulator Scalable to 250A Runs Cool with Inductors Exposed as Heatsinks - 150V Step-Down DC/DC Controller Draws Only 9µA in Battery-Powered Systems - 3.2A, 35VIN/35VOUT Synchronous Monolithic Multi-Chemistry PowerPath Manager/Charger Features Digital I2C Telemetry & MPPT Operation - Hyperstone announces Shinden Hightex Corporation as Distribution Partner - Toshiba Releases Compact Power MOSFET Gate Driver Intelligent Power Device - Toshiba release compact power MOSFET gate driver intelligent power device - Anritsu Introduces Industry-first PIM Over CPRI Capability for BTS Master™ Handheld Base Station Analyzers - CPI Receives £107m Government Funding Boost - Speed record for TU Munich: "WARR Hyperloop" reaches 290 mph (467 km/h) with Infineon chips - Maxim High-Performance PMICs: Powering Next-Generation Consumer Applications - Analog Devices’ Self-Calibrating Energy Metering IC Simplifies Embedded Electricity Measurement - ON Semiconductor Announces New Multimedia Analog Audio Switch And High Precision Current Sense Amplifiers for USB-C Applications - Imec Beats Silicon PV with 27.1 Percent Perovskite-Silicon Tandem - Nokia Open Innovation Challenge 2018 seeks startups with disruptive ideas to shape the future of industrial automation - Mouser Electronics and Grant Imahara Present New “Generation Robot” E-Book Focused on Service Robots - Vodafone grants global certification to u-blox LTE Cat 1 module with 2G fallback - AudioCodes Declares Annual Dividend of 20 Cents per Share - Sigma-Delta A/D Converter Provides Single Configurable & Reusable Data Acquisition Footprint for AC & DC Performance - Singtel and Ericsson to launch Singapore’s first 5G pilot network - Toshiba Memory Europe announces 96-layer BiCS FLASHTM development with QLC technology - Samsung Electronics Announces Industry’s First 8Gb LPDDR5 DRAM for 5G and AI-powered Mobile Applications - Standalone USB Type-C Power Delivery Controller from STMicroelectronics Enables Fast and Easy Migration to Type-C - GE and Microsoft Enter into their Largest Partnership to Date, Accelerating Industrial IoT Adoption for Customers - Ericsson, Telstra and Intel achieve first end-to-end multi-vendor 5G commercial network data call over licenced 3.5GHz spectrum - Reduce Driver Distraction with Automotive-Qualified 3D Gesture Recognition Controller - Maxim PMICs Drive Optimized Power for Automotive ADAS Functions - Wideband Microwave Synthesizer Delivers Industry Leading Phase Noise, Output Power and Spur Performance with Operation from 55 MHz to 15 GHz - Renesas Electronics Simplifies Power Supply Design with Scalable Digital Controllers for Cloud Computing, Communications, and Industrial Applications - ABB wins $150 million order to grid-connect world’s largest offshore wind farm - NXP Named One of World’s Most Impactful Industrial IoT Companies in 2018 - ams CCS8xx product family of VOC sensors enhances end-user experience for indoor air-quality monitoring - Xilinx Announces the Acquisition of DeePhi Tech - Ericsson announces changes to Executive Team - Reduce Costs and Bill of Materials with Microchip’s PAC1932/33 Single Power Monitoring ICs that Measure Power from 0V to 32V - Precision Low-Noise Op Amp from STMicroelectronics Boosts Flexibility with Extended Voltage and Temperature Ranges - Rohde & Schwarz and MediaTek collaborate on mmWave OTA measurement technologies - Teledyne e2v’s Quantum Group is putting Quantum Gravity Sensing in Satellites - Semi Content in Electronic Systems Forecast to Reach 31.4% in 2018 - Analog Devices' DSP Creates Internal and External Engine Sound for Electric and Hybrid Electric Vehicles - Kvaser Launches Pro-level multiple bus interface - Hitachi Rail Italy signed a contract worth 87 million Euros for further 12 Leonardo trains for Milan metro. - Teledyne e2v signs contract with UK Centre for Earth Observation Instrumentation to develop advanced CMOS TDI image sensor for small satellite applications - Tektronix Delivers More Speed & Lowest Noise for Increased Measurement Confidence with 6 Series MSO Mixed Signal Oscilloscope - New High- and Very-High-Performance STM32 Value Lines from STMicroelectronics Boost Real-Time IoT-Device Innovation - ams laser arrays bring face recognition to Android-based smartphones - Lockheed Martin Signs Teaming Agreement with Rafael to Market SPICE Air-to-Surface Missile Kits - Internet of Water to tackle growing water risks - Biotech startup PlantArcBio completes a $3M funding round and signs a collaboration agreement with the University of Wisconsin-Madison - Vicor DCM in ChiP package expands enhanced output voltage regulation models - AVX IS NOW QUALIFIED TO PRODUCE & SUPPLY MIL-PRF-123 CAPACITORS AT ITS CORPORATE HEADQUARTERS - Flex Power Modules expands innovative BMR480 DC/DC advanced bus converter series with 1300 Watt rated version - World's first OLED displays with pins for fast mounting - New at FRAMOS®: Emergent Launches 25GigE High-Speed Area Scan and Line Scan Cameras - AVX Releases A New Interactive Online Simulation Tool for Tantalum, Polymer, Niobium Oxide, & Multilayer Ceramic Capacitors - New Intel Xeon E Processor Tailored for Entry-level Workstations - Siemens report urges cities to plan now for arrival of autonomous vehicles - TI DLP® technology brings micron-to-sub-millimeter industrial accuracy, speed and flexibility to desktop 3D printers and portable 3D scanners - Samsung Electronics Brings Next Wave of High-Performance Storage with Mass Production of Fifth-generation V-NAND - Reduce Driver Distraction with Automotive-Qualified 3D Gesture Recognition Controller - Infineon hits 5 bn production milestone of its bulk-CMOS radio frequency switches - Baidu to Integrate Mobileye’s Responsibility Sensitive Safety Model into Apollo Program - Premier Farnell Signs Contract for State-of-the-art Order Fulfilment Solution for New Leeds Distribution Centre - NXP Delivers New Security and Connectivity to 2018 FIFA World Cup Russia™ Finals with Smart Stadium Experience - New-Tech Europe Magazine | June 2018 - Designing a Broadband, Highly Efficient, Gallium Nitride, RF Power Amplifier (RFPA) Using NI AWR Design Environment Software Platform - Optimizing Device Lifecycle Management Of Remote, IoT Connected, LPWA Devices - Blu Wireless streams ultra-fast Gbps video through central Bristol as part of EU’s final 5G-XHaul demonstration - Kerlink Signs Agreement with Leading Electronics Distributor in Brazil, As the Country Positions Itself for Rapid IoT Network Growth - Telesat and Gilat Join Forces to Develop Broadband Communication Modem Technology for Low Earth Orbit (LEO) Satellites - NetSpeed unveils Orion AI – Delivering extreme performance and ultimate efficiency for next-gen AI SoCs - Toshiba announce new analog output IC photocoupler for automotive applications - Anritsu announces MT8000A Test Platform to Support MediaTek Inc on 5G Chipset Development and Verification - New Current Sense Transformers Now Available at Wurth Electronics Midcom - Harwin Expands Breadth of Robust Surface Mount 3-Point PCB Socket Series - NXP and Smart Columbus Continue to Partner on the Future of Smart Mobility - LETI DEMONSTRATES NEW WAVEFORM FOR 5G LOW-POWER WIDE-AREA INTERNET OF THINGS NETWORKS - Kerlink Partners with SPHINX to Bring Internet of Things Solutions to More Network Integrators & Resellers in Europe - Industry’s Widest Bandwidth RF Transceiver Speeds Development of 2G-5G Base Stations and Phased Array Radar - Microchip releases first 32-bit MCUs to feature robust, chip-level security and Arm TrustZone® technology - Flexible Power Line Communication (PLC) modem streamline deployment of smart energy equipment - Hyundai Motor Company Partners with Autotalks to Develop Connectivity Technology for Increased Road Safety - Avnet Abacus honoured with Senten Manten Gold Award by TDK - CUI Partners with SnapEDA to Offer Free PCB Footprint Files - New at FRAMOS®: Sony Launches Two New 4K Block Cameras with 30x Equivalent Optical Zoom - Maxim Enables a Healthier World with Wearable Platforms for Health and Fitness Applications - Microchip dual-core dsPIC® digital signal controller enables separate code design and seamless integration - New angle sensors: Infineon combines highest functional safety grading with an easy-to-use concept - LITE-ON Cooperates with STMicroelectronics to Bring Ultra-Low-Power Sigfox-Verified Modules to the IoT Market - ON Semiconductor Announces New Family of Multi-Chip Module PWM Buck Regulators Offering Market-Leading Current Density and Fully Integrated MOSFETs - Otaniemi to host a unique smart energy testing platform - Ericsson and MediaTek collaborate to accelerate and expand NB-IoT device ecosystem - At ISC 2018, Intel Transforms the Future of High-Performance Computing - Analog Devices’ Integrated Optical Module Reduces Smoke Detector False Alarms and Meets New Regulatory Standards - Boeing HorizonX Ventures Invests in On-Demand Urban Aerial Delivery Startup Matternet - TowerJazz Announces RF SOI 65nm Ramp in its 300mm Fab with Best-in-Class Metrics - Maxim’s Fuel Gauges with ModelGauge m5 EZ Maximize Device Runtime for a Broad Range of Applications - Samsung Brings Enhanced Color Accuracy and Sharpness to Mobile Photos with New ISOCELL Plus Technology - University of Nottingham eMotorbike Picks up 2nd Place in the Isle of Man TT Zero Cup - 5G connects London and Berlin in music and song - Computation in Memory fits into a new concept of scaling that may bring huge, largely untapped energy-savings - High Power Monolithic Silent Switcher 2 Regulators Meet CISPR 25 Class 5 EMI, Fit Tight Spaces - Researchers devise new way to make light interact with matter Reducing the wavelength of light could allow it to be absorbed or emitted by a semiconductor, study suggests. - How Motion Control Defines System Design The Engineering View - Device Protection, Management and Secured OTA - Delta Automation and Evatronix develop innovative control and measurement system - ERM Advanced Telematics Completes Development of Anti-Ransomware Solution for Vehicles - Harwin Expands Breadth of Robust Surface Mount 3-Point PCB Socket Series - NXP Introduces New High Power RF Products for 5G Networks - The VTT robot car Marilyn parks in the furthermost lot fully autonomously - STMicroelectronics’ Off-Line Converters for 5-30V Power Supplies Enhance Ruggedness, Efficiency, and Flexibility - European Eurofighters celebrate Finnish Air Force's 100th Anniversary - Imec furthers high-mobility nanowire FETs for nodes beyond 5nm - Analog Devices Enhanced A2B Transceivers Deliver Unparalleled Flexibility for Emerging Applications - Arrow Electronics receives multiple awards from Molex - New at FRAMOS®: The ECX334C OLED Micro Display from Sony® Semiconductor Solutions as a super-small and fast solution to Electronic View Finders and Wearables - Turning silicon photonics into a new competitive asset for the electronics industry - Intel CEO Brian Krzanich Resigns; Board Appoints Bob Swan as Interim CEO - congatec teams up with OSADL to optimize the support for Real-Time Linux - Speed Time to Market with Maxim’s Portfolio of EMI-Compliant Himalaya Solutions for Industrial and General-Purpose Applications - Samsung Introduces 8TB SSD for Data Centers in Next-generation ‘NF1’ Form Factor - First real-time test of Li-Fi utilization for the industrial Internet of Things - NanoLock’s Lightweight, Unbreakable Security and Management Platform Sets New Standard for IoT Security Solutions - New-Tech Europe Magazine | May 2018 - Audi connects the electric car with the house - Lockheed Martin's Miniature Hit-to-Kill Interceptor Matures to Development Stage - Masach - Arrow - Global Distribution Partnering - Digital all-round: the European research project iDev40 focuses on networking – from the idea and concept to the consumer - Ericsson, Intel and China Mobile achieve 3GPP-compliant, multi-vendor Standalone 5G NR interoperability - Intel Starts Testing Smallest ‘Spin Qubit’ Chip for Quantum Computing - Industrial Internet and Connected Vehicles Drive IoT Sales Through 2021 - TMR angle sensor in a TO-6 package for PCB-less applications - Wireless system can power devices inside the body - New high-performance oscilloscope from Rohde & Schwarz: innovative signal integrity, measurement speed and range of functions - TI introduces smallest and most efficient SIMPLE SWITCHER® synchronous converters - 5G on a roll, cellular IoT deployments ramping up – Ericsson Mobility Report - Nokia's new 5G design and deployment services deliver faster time to market and lower total cost - Imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas - Tektronix, IEMN Demonstrate 100 Gb/s Wireless Transmissions Using New IEEE 802.15.3d Standard - BAE Systems to develop first-of-its-kind software for DARPA to model conflicts - 3D Glass Solutions Releases Industry’s First Integrated Passive Devices PDK Specifically for NI AWR Software - NXP, Mastercard and Visa Transform Mobile Payments for Billions of IoT Devices - Renesas and Magna Bring Advanced Safety Features to More Vehicle Segments and Consumers - AT&T and Nokia to deliver rapid global IoT deployments - Infineon gears up for stronger long-term growth - New system recovers fresh water from power plants - General Assembly elects EMVA Board of Directors which now consists of nine members - AVX Launches New High-Temperature, Max Capacitance Wet Electrolytic Tantalum Capacitor Series for 230°C Operation - Vishay Honors Digi-Key with 2017 European Catalog Distributor of the Year Award - Powerful IT security for the car of the future – research alliance develops new approaches - ON Semiconductor Announces SiC Diodes for Demanding Automotive Applications - Analog Devices’ Isolated Power Converters Support Class B System EMI Levels - ON Semiconductor Announces Industry Leading Ultra-High PSRR LDO Regulators for Demanding Applications - KDDI, Hitachi Collaborate on Global IoT Busines - Rohde & Schwarz presents DOCSIS analyzer with new upstream analysis option at ANGACOM - Frontier Communications selects Nokia next-generation fiber technology to deliver 10-Gigabit business and residential services - Cypress and Semtech Collaborate on Integrated LoRaWAN™ Solution for Smart City Applications - Imec Extends Damascene Metallization Towards the 3nm Technology Node - LEM completes its range of open-loop Hall effect current transducers with digital outputs for drives applications - Simplify the Development of Secure Connected Nodes Using Cryptography-Enabled Microcontroller with DICE Architecture - Vicor releases bidirectional 48V/12V NBM Converter for data center and automotive applications - u blox accelerates V2X active traffic safety - ON Semiconductor Announces Industry Leading Ultra-High PSRR LDO Regulators for Demanding Applications - TT Electronics acquires Precision Inc. Precision Inc. to expand TT’s electromagnetic capabilities and global presence - Double DPAK: first top-side cooled SMD solution for high power applications - Anritsu Announces World-First PCI Express Test Solution with Multivendor Oscilloscope Support - ams’ new XYZ color sensor offers widest dynamic range, highest sensitivity for high-end consumer and industrial applications - AVX CELEBRATES THE CONTINUING SUCCESS OF THE CHEMCAM ON NASA’S CURIOSITY ROVER, WHICH IS ENABLED IN PART BY 630 AVX CAPACITORS - Analog Devices’ Low-Power, Single-Channel 16-Bit DAC Enables High Density Analog Output Modules without De-Rating - Anritsu 2x2 MIMO Measurement Function Improves the Quality of WLAN Equipment - Tektronix, IEMN Demonstrate 100 Gb/s Wireless Transmissions Using New IEEE 802.15.3d Standard - Easily Implement Low-power Touch Pads with Surface Gestures Using Microchip’s New Software Library - Teledyne e2v awarded second phase of €42M contract to provide custom image sensors for ESA PLATO mission - From vehicles to the factory, TI mmWave sensors create a smarter world - Maxim Provides Industry’s First True Fault Protection Solution for High-Speed USB Ports and Industrial Voltage Applications - Computation in Memory fits into a new concept of scaling that may bring huge, largely untapped energy-savings - HIL improves test coverage, lowers R&D costs and streamlines certification processes, leading to better products and lower OPEX. - Siemens drives digital transformation in buildings with acquisition of Enlighted - Hungarian Prime Minister, Viktor Orbán, and Ericsson CEO, Börje Ekholm, open new Ericsson Hungary headquarters - MILESTONE AVIATION COMPLETES PURCHASE AND LEASEBACK OF FOUR S-92® HELICOPTERS - Infineon prepares for long-term growth and invests €1.6 billion in new 300-millimeter chip factory in Austria - Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5 - Automotive IC Market on Pace for Third Consecutive Record Growth Year - Ericsson signs credit facility agreement with the European Investment Bank - Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial Cypress Unveils the World’s Most Advanced Flash Memory Solutions for Developers of Safety-Critical Applications in Automotive and Industrial - Scientific Advisory Board found great potential in SMACC - Imec Packs New Fast Eye Tracking Technology into Ergonomic Design for High-Quality AR/VR Experiences - Plug-and-play diagnostic devices - Nordic Prime Ministers unite to prioritize 5G and digitalization - Arm Drives Smart Utilities for KEPCO’s Behind the Meter Project - Latest upgrade to Casambi app brings easier commissioning of smart lighting – plus brand new functionality - NASA, Uber to Explore Safety, Efficiency of Future Urban Airspace - Characterization Methods for Flexible Absorber Sheets WE-FAS - From the HDBaseT revolution to the new IoT world - everything you wanted to know and didn't have whom to ask - Instrumentation And The Internet Of Things Seven Essentials For Rugged Connectors In Instrumentation Applications - Kudelski Group and u-blox to collaborate on secure connectivity for consumer, automotive and industrial IoT - Customized cybersecurity: encrypting unique codes on chips with maskless lithography - Affordable Solutions for Testing 28 GHz 5G Devices with Your 6 GHz Lab Instrumentation - New-Tech interview with Eitan Livneh, President & CEO of Orbit Communications Systems - Choosing and Using Advanced Peltier Modules for Thermoelectric Cooling - Ericsson pioneers machine learning network design for SoftBank - Thirteen Top-15 1Q18 Semi Suppliers Register Double-Digit Gains - Cypress USB-C Technology Powers Advanced Mobile Computing Experience for Samsung DeX - VTT Marilyn, a Finnish robot car, has taken a leap towards automatic 24/7 driving – also sees through fog - Osram acquires stake in Montreal-based horticulture startup company Motorleaf - Toshiba to exhibit multiple exciting new products at PCIM Europe - Boeing, Assembrix to Collaborate on Secure 3D printing - TowerJazz Achieves IATF 16949 Automotive Quality Certification Expanding its High Quality Automotive Manufacturing Capabilities - Dedicated, flexible, on-demand launch vehicles crucial to meet huge demand, finds Frost & Sullivan - Imec demonstrates direct optical reading of single-molecule DNA bases in modified nanopores - Samsung Makes Image Sensor Integration Easier with New 16Mp ISOCELL Slim 3P9 and Plug & Play Solution - ON Semiconductor Releases the First Two Devices in the New X-Class CMOS Image Sensor Platform, Enabling High Performance with Small Footprint Integration - Europe aims to become a world-class commercialiser of fuel cell technology - UltraSoC analytics IP selected by Esperanto Technologies for RISC-V many-core parallel processing in AI and ML applications - TowerJazz and Newsight Imaging Announce Advanced CMOS Image Sensor Chips for LiDAR used in ADAS and Autonomous Vehicles - Digi-Key Offers Unlimited Access to Ultra Librarian EDA/CAD Models - Intel FPGAs Bring Power to Artificial Intelligence in Microsoft Azure - TI's ultra-small 5.5-V DC/DC step-down power module delivers true 6-A performance - Cypress Expands USB Leadership with Next-generation USB-C and Power Delivery Controller for Electronically-marked Cables - Rohde & Schwarz presents innovative test and measurement equipment for next generation designs at PCIM 2018 - NI Releases New Infrastructure for Deployed Systems Management - Samsung Electronics Begins Offering LED Component Solutions for Horticulture Lighting - Nokia and SFR first in France to conduct a 5G New Radio call using 3.5 GHz spectrum - STM32 Expansion Software from STMicroelectronics Simplifies Security Implementation on IoT Endpoints - CMOS Image Sensor Sales Stay on Record-Breaking Pace - DARPA selects BAE Systems for optical seeker on precision munitions - Infineon launches new Development Center for automotive electronics and artificial intelligence in Dresden - Intel Capital Announces $72 Million of New Investments in 12 Tech Startups at Annual Global Summit - TI's ultra-small 5.5-V DC/DC step-down power module delivers true 6-A performance - DARPA selects BAE Systems for optical seeker on precision munitions - ON Semiconductor Acquires SensL Technologies Ltd., Leading Provider of SiPM, SPAD and LiDAR Sensing Products - Nokia and SFR first in France to conduct a 5G New Radio call using 3.5 GHz spectrum - Solar UAV to be developed with the potential to stay airborne for a year - Advantest Announces Floating Power Source to Extend V93000 Test Platform’s Capabilities in Diverse Power-Management Markets - Strong earnings in second quarter. Continued high order intake driving faster capacity expansion - Intel Unveils Drone Software Solutions that Enable Businesses to Unlock Potential of Aerial Data - Texas Instruments Expands Lead Among Top Analog Suppliers in 2017 - Nokia enters into exclusive negotiations for the sale of its Digital Health business - Analog Devices Opens New Bengaluru Facility - Intel Saffron AI Speeds Issue Resolution for Manufacturing, Software and Aerospace - STMicroelectronics Reveals Free Safety-Design Package for Faster Certification of STM32-based IEC 61508 Safety Critical Applications - UltraSoC selected by Andes for RISC-V development with trace and debug - End-to-end Sub-1 GHz kit for easy cloud connectivity exclusively from Farnell element14 - ICsense files new patent on zero-leakage high-voltage analog switches - Highly Efficient Single-Chip Three-Phase and Three-Sense BLDC Driver Boosts Runtime from Batteries in Portables and IoT Devices - Step Down Converter, Inductor and Capacitors in a Compact Package - Samsung Electronics Sets New Performance Standards for NVMe SSDs with 970 PRO and EVO - TSMC Continues to Dominate the Worldwide Foundry Market - ams introduces sensor reference design for blood pressure, vital signs for smart health and wearables - Cypress Empowers Developers With New Sensing Solutions for State-of-the-Art Industrial Designs Incorporating Metals - New facility to exploit opportunities in Internet of Things - LG ACQUIRES GLOBAL PREMIUM AUTOMOTIVE LIGHTING COMPANY ZKW GROUP - Jim Keller Joins Intel to Lead Silicon Engineering - Renesas Electronics Introduces ISL91302B, ISL91301A, and ISL91301B Multiphase PMICs with Highest Efficiency and Smallest Footprint - Top AI Chipset Companies Announced, Including NVIDIA, Intel, NXP, IBM, and AMD based on CompassIntel.com Research - 5GAA, Audi, Ford and Qualcomm Showcase C-V2X Direct Communications Interoperability to Improve Road Safety - Zero defects in four years: Infineon receives highest quality award from Toyota’s Hirose Plant - STMicroelectronics and Jorjin Introduce Ultra-Low-Power Sigfox IoT Modules with Dual RF Connectivity - Prophesee (formerly Chronocam) announces initial closing of $19M funding round, to include key new strategic investor - Ericsson to transform Wind Tre core network in Italy - New global alliance for 5G industrial applications - Nokia launches industry-first Edge Cloud data center solution for the 5G era, supporting industry automation and consumer applications - Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles - Israeli Startup will Allow Businesses to Receive Real Time Bitcoin and Cryptocurrency Payments - Arvato Financial Solutions invests in Israeli behavioral biometrics pioneer SecuredTouch in a joint effort to ensure greater security and user experience for digital transactions - Intel and Partners Accelerating the Promise of Intelligent Factories - Ultra-low latency of 5G improves production of jet engine components - BMW Group plans Additive Manufacturing Campus: Technological expertise in industrial-scale 3D printing to be consolidated at new location - BAE Systems and Dell EMC collaborate to offer mission-ready cloud solution for the U.S. Governmen - DONGWOON ANATECH LICENSES CODASIP’S BK3 RISC-V PROCESSOR FOR MOTOR CONTROL ICS FOR MOBILE CAMERA - Nano-C Completes $11.5 Million Funding Round: Secures Investment from Analog Devices Chairman Ray Stata - Integrating optical components into existing chip designs - TOSHIBA RELEASES FULL LINE-UP OF CONSUMER HARD DRIVES - VTT prepares development paths towards 2050 climate goals– Finnish economy to revolve around the bioeconomy - Defence Secretary visits Glasgow to view progress of the first City Class Type 2 - Blu Wireless and LGS Innovations collaborate to deliver impact in 5G - Miniature high-speed data: Fischer MiniMaxTM Series with AWG24 Ethernet and 20m/24h IP68 sealing - Construction starts at the world's largest hydrogen pilot plant - ESPResSo, an Ambitious EU Funded Collaboration to Make Perovskite Solar Cells a Market Reality - PROVERTHA presents fully shielded M8 crimp connectors - HTA to present strategy to maintain Europe sovereignty in micro- and nanotechnologies & smart systems - Rohde & Schwarz presents next generation software defined airborne radios - PROVERTHA offers D-Sub crimp connectors for vacuum applications - Bantam Tools Desktop PCB Milling Machine Available for Immediate Shipment Worldwide from Digi-Key - AVX RELEASES THE FIRST INDUSTRIAL INSULATION DISPLACEMENT CONNECTORS WITH A 2.55MM PROFILE - Wuerth Elektronik eiSos horticulture LEDs - exceet Card expands banking business with SECORA™ Pay from Infineon - OTI Lumionics Announces Availability of New Aerelight for Print OLED Technology - Sterling Suffolk chooses Plessey’s Hyperion 1750 LED grow light for its new UK tomato greenhouse project - Nexperia secures $800M financing to fund future growth plans - Globally unique electrified road enables fossil-free road transport - New centre of excellence for autonomous driving. BMW officially opens its autonomous driving campus in Unterschleißheim near Munich. - Nokia and OSIsoft collaborate to boost analytics capabilities with high-capacity infrastructure - SSS announces new partnership with VPT, Inc - VTT has 3D printed a smart metal part: a step towards artificial intelligence - Nokia and KDDI successfully trial 4G LTE connected vehicle applications in Japan - Lighting you can bend into any shape - Nano Dimension’s Multi-Material 3D Printing Inks Earn Technical Development Materials Award from IDTechEx - New Piper Computer Kit from forthings.io encourages children to build electronics and learn to code - Photonic communication comes to computer chips - Toshiba Releases Medium-voltage Photorelay in Small 4-pin SO6 Package for Factory Automation and Other Industrial Applications - Highly Integrated Digital-Power Controller from STMicroelectronics Streamlines Design to Latest Efficiency and Safety Standards - Imec reaches milestone for next-gen solid-state batteries to power future long-range electrical vehicles - Semiconductor Leaders’ Marketshares Surge Over the Past 10 Years - ON Semiconductor Introduces First High Resolution Image Sensors with NIR+ for Improved Night Vision - Save Weight & Reduce Battery Pack Size - Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision - Wurth Electronics Midcom: Contenders Announced for Design Contest - Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream - £10 million investment to develop new technologies for the Maritime Integration & Support Centre - Ultra-soft IGBT freewheeling diodes offer industry leading losses - Mechanical Design for Microphonic-Sensitive Electronics - Convergent Audio/Video Monitoring and Multiviewer-Solution for Broadcast und Streaming Media by Rohde & Schwar - Ericsson Media Solutions selected by Telefónica to transform its TV services - C3 IoT and Microsoft announce strategic partnership to accelerate AI in the enterprise - New-Tech Europe | April 2018 - AVX RELEASES THE FIRST INDUSTRIAL POKE-HOME CONNECTOR AVAILABLE WITHOUT A WIRE STOP - Vicor Launches 12V to 48V NBM Module at GTC 2018 - Imec and Qromis Present High Performance p-GaN HEMTs on 200mm CTE-matched Substrates - Australian consumers get a first close encounter with 5G - Harwin Introduces Ultra-Compact Fine Pitch Cable-to-Board Connector Offering - KEMET Expands ESD Rated Ceramic Capacitor Product Portfolio - Marvell Announces Integration of Industry’s First Secure Automotive Ethernet Switch into NVIDIA DRIVE Pegasus Platform for Level 5 Autonomy - ROHM announces Industry's First Power Supply ICs for Hi-Fi Audio - Bosch expands its Research and Technology Center - Osram and Continental sign joint venture contract - New release of BrainChip Studio, the AI-powered video analysis software, adds auto-rotated models, Linux support and an API for easier systems integration - Toshiba Releases Small MOSFET with High ESD Protection to Drive Headlight LED - Maxim's Ultra-Small Step-Down Converters Deliver the Industry's Lowest Quiescent Current and Highest Peak Efficiency for Always-on - CoolSET™ family: New fixed frequency PWM controller and integrated power IC delivers high performance and circuit protection - Improve Reliability and Performance in Harsh Environments with Microchip’s New Automotive MEMS Oscillators - Cypress Delivers Robust Wireless Connectivity to Raspberry Pi 3 Model B+ IoT Single Board Computer - An EPFL startup raises 20 million francs - NI Technology Helps Subaru Reduce Electric Vehicle Test Development Times by 90 Percent - Optoelectronics, Sensors/Actuators, and Discretes Hit Record-High Sales - Intel Core i9 PROCESSOR comes to Mobile - Autotalks and Griiip Demonstrate the World's First Motorsport V2V Application on a Racetrack - ON Semiconductor Expands Imaging Options for Extreme Low-Light Imaging - Mentor Graphics Partners with SamacSys to Provide Schematic Symbols, PCB Footprints and 3D Models for PartQuest - Maxim’s Low-Power Microcontrollers Extend Battery Life for Wearables and Other Compact Devices - Veritas Capital to Acquire Revenue-Cycle, Ambulatory Care and Workforce Management Software Unit from GE Healthcare for $1 Billion - Innovative Low-Dropout Voltage Regulator from STMicroelectronics Packs Big Performance in Tiny Footprint - The Future of Truth: Ericsson Innovation Awards 2018 finalists announced - Wind River to be Acquired by TPG - NXP’s New Automotive Echo Cancellation Noise Reduction Solution Makes Calls Clear - Visually appealing solar modules as architectural elements in building façades - Analog Devices’ SigmaStudio 4.0 Delivers Improved Audio Graphical Programming and Advanced Voice Processing Algorithms - Quantum Technology Supersensors Launch with CPI Help - Mercedes-Benz plant Sindelfingen starts production of the Compact SUV GLA - BAE Systems, Cammell Laird and BMT team-up to deliver additional Type 45 power generation - BMW Group and Daimler AG agree to combine mobility services - Nokia wins its largest-ever GSM-Railway contract with Polish PKP Polskie Linie Kolejowe to modernize critical communications network - Optoelectronics, Sensors/Actuators, and Discretes Hit Record-High Sales - Swedish cloud platforms paving the way for emergency vehicles - Building the Foundation for a Better 5G - Mitsubishi Tanabe Pharma and Hitachi Utilize AI Technology to Begin Collaborative Creation for Improving Efficiency of Clinical Trials for New Drug Development - A King Has Arrived: Sikorsky CH-53 King Stallion Heavy Lift Helicopter Arrives in Germany for International Debut - Würth Elektronik eiSos expands its range of SMD spacers - KDDI and Samsung Successfully Complete 5G Multi-Device Trial at a Professional Baseball Stadium in Okinawa, Japan - Nokia's new AI-powered analytics software dramatically improves customer experience and satisfaction - A new way to find better battery materials - Using 24 GHz Radar to Speed Commercial UAV Adoption - It’s all about user experience - Getting the Green from the Grey - Get your daily health check in the car - “Body on a chip” could improve drug evaluation - Product Technology: Panasonic passive component: Power choke coil and hybrid capacitors. - Waveguide Attenuators at a Glance - Small Cells taking cellular to new heights with IoT tech and global deployments - The path to high GNSS accuracy - Business Combination Agreement signed and top Board Members nomination proposals - Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers - Ericsson MediaFirst TV platform available on Amlogic’s Set Top Box Chipset - Eurotunnel and GE Partner to Increase Traffic in France/UK Channel Tunnel - Qualcomm Announces Support for Next-Generation VR Experiences With New Snapdragon 845 Virtual Reality Development Kit - U.S. Companies Maintain Largest Share of Fabless Company IC Sales - Golden touch: next-gen optical disk to solve data storage challenge - NXP’s MIFARE 2GO and Google Pay Transform Public Transportation - APG unveils the "Peres" family of unmanned aerial systems – the UAS that takes off and lands vertically – and transitions from vertical to horizontal flight - ON Semiconductor Opens Design and Industrialization Center in Milan - Huawei Ground Breaking NB-IoT Chipsets now Supported by Anritsu Wireless Test Solution - congatec simplifies integration of smart vision at transportation checkpoints - Seamless communication soon possible even in crisis situations? - Marvell Introduces Industry’s First NVMe Chipset Solutions to Address Emerging Data Center SSD Requirements - Toshiba launches 1.5A LDO regulators in ultra-small package - Rohde & Schwarz is first T&M manufacturer to validate conformance test cases for RCS 5.3 - Construction Set to Begin on Digi-Key’s 1-Million-Square-Foot Product Distribution Center Expansion in Thief River Falls - Maxim's Himalaya uSLIC Solution, the Industry's Smallest Power Modules, Revolutionizes Design for Highly Space-Constrained Applications - Samsung Enables Premium Multimedia Features in High-End Smartphones with Exynos 7 Series 9610 - WE-KI HC and WE-CAIR Inductive Component Series in Simulation - Automatic emergency call saves lives: Daimler builds on eSIMs from Infineon - KLA-Tencor Announces Agreement to Acquire Orbotech Ltd. - Silicon breakthrough could lead to new high-performance bendable electronics - Samsung Electronics Diversifies its 8-Inch Foundry Offerings with New RF/IoT and Fingerprint Technology Solutions - New-Tech Europe Magazine | March 2018 - KLA-Tencor Announces Agreement to Acquire Orbotech Ltd. - Toshiba Launches Photocoupler with UVLO Function for Digitally Controlled Switching Power Supplies and IPM Drives - Flex Power Modules announces new highly efficient small-footprint DC/DC converter - Anritsu Announces Signal Analyzer MS2850A Selected by Samsung for 5G system development - Europe invests to boost the uptake of robotic technologies by start-ups and SMEs - A wireless patch for monitoring emergency-room patients - Siemens and Munich Airport agree on strategic partnership for digitalization - Honda to supply Power Manager units for UK energy management demonstration project - Vicor's Power-on-Package System Provides up to 1,000A Peak Current - Samsung Enhances Chip-Scale LED Package Lineup with Industry’s Highest Luminous Efficacies - Rohde & Schwarz to present compact amplifier for latest-generation satellite uplinks - X-Class CMOS Image Sensor Platform from ON Semiconductor Enables New Functionality for Industrial Camera Design - u-blox announces smallest industrial Bluetooth 5 module - IC Insights Raises 2018 IC Market Forecast from 8% to 15% - Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award - Strategic investment: Mercedes-Benz Cars pushes electric initiative in South-East Asia with battery production in Thailand - CPI’s National Formulation Centre Opens - VTT enters cooperation with Hitachi - Compact Power Measurement Tool for IoT Applications from Qoitech Now in Stock at Digi-Key - RS Components introduces new flush-mount pushbuttons for modern control panel design - Iridium CertusSM Distribution Expands; Enables Globally ‘Connected Vehicles’, Assets and Teams - TowerJazz Announces Industry’s First Open Foundry SiPho Design Kits with Leading EDA Tool Support - Insights from Farnell element14 customers confirm why the Raspberry Pi is increasingly being adopted for professional use - MIT and newly formed company launch novel approach to fusion power - Analog Devices Adds Innovative RADAR Technology for Industrial and Automotive Markets with Acquisition of Symeo GmbH - Cree acquires Infineon RF Power Business - Highest Resolution 35 mm Format CCD Image Sensor Addresses Latest Inspection and Surveillance Applications - KEMET Introduces KC-LINK Capacitors for Fast-Switching Wide Bandgap Semiconductor Applications - Highest resolution 35 mm format CCD image sensor addresses latest inspection and surveillance applications - CEVA First to Deliver Bluetooth® 5 Dual Mode IP - Sikorsky CH-53K Completes Critical Flight Envelope Expansion with 36,000-pound External Lift - Aerosense develops surveying solution with drone using u-blox high performance positioning technology - Smallest 65W USB-PD Adapter Solution Using Industry Standard Super Junction FETs from ON Semiconductor - Intel and Microsoft Enable AI Inference at the Edge with Intel Movidius Vision Processing Units on Windows ML - New High Efficiency Controller Solutions for LED Lighting Applications from ON Semiconductor - New ACEPACK™ Power Modules from STMicroelectronics Deliver Advanced Performance and Economy - New features on Farnell element14’s IoT Hub include the Internet of Robotics and why Development Boards are essential, but the Internet may not be - Cisco Disrupts Optical Transport with Innovative Modular Platforms - SatixFy modem demonstration with R&S SMW200A wideband modulator from Rohde & Schwarz - Teledyne e2v, pSemi and GaN Systems Unveil Industry’s Fastest Hi-Rel GaN Power Solution at Satellite 2018 - Siemens leads Germany in European patent applications - Photonics Innovation Hub Secures €10 million To Create 750 New Hi-Tech Jobs - Conrad Business Supplies strengths its Purchasing department with Jesper Rasmussen, new Director Electronic Components - With Health EU, everyone will have an avatar to manage their health - Farnell element14 Names Top Raspberry Pi Accessories for Makers - Are the Major DRAM Suppliers Stunting DRAM Demand? - 5G test site for TV broadcasting in the Bavarian Oberland - Nokia pushes optical network capacity to theoretical limits with Photonic Service Engine 3 chipset; massive scale and radical simplicity for video, cloud and 5G growth - New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger from TI cut power supply size and charge time in half - STRATASYS REVEALS DEVELOPMENT OF NEW METAL ADDITIVE MANUFACTURING PLATFORM FOR SHORT-RUN MANUFACTURING APPLICATIONS - BrainChip to be showcased at London Security and Counter Terrorism Exposition - Rohde & Schwarz and Unigroup Spreadtrum & RDA to establish joint network operator test lab - World’s first NB-IoT module certified for use in hazourdous environments enters initial production - congatec enables cost-efficient 10GbE edge server designs - KEMET Introduces KONNEKT Technology Enabling Higher Power Densities in Smaller Form Factors - Siemens wins first place for "Best Idea Management" - Ficosa wins five important contracts for battery management systems for the Chinese market - Imec and Cadence Tape Out Industry’s First 3nm Test Chip - 92 IC Wafer Fabs Closed or Repurposed From 2009-2017 - Jazz selects Ericsson to optimize their complete Radio Network - AMPHENOL SOCAPEX EXPANDS ITS RJ FIELD & USB FIELD RANGE OF RUGGED CONNECTORS WITH TWO NEW “REDUCED FLANGE” VERSIONS: RJF TV6 & USB3F TV FOR REDUCED SPACE APPLICATIONS - RS Components, MikroElektronika, Cypress Semiconductor co-create flexible platform for faster IoT-device development - OriginGPS Releases OriginIoT™ LTE-M System With Gemalto's Cinterion® Module to Expedite Development of IoT Products With Low Power Consumption - Toshiba Announces New 2TB Hard Disk Drive for Client Storage Applications - ON Semiconductor's SiC Diodes Offer Higher Efficiency, Power Density and Lower System Costs - NXP Ushers in New Era of eSIM-enabled Devices for 5G and IoT With Industry’s First Single NFC and Secure Element Monolithic Chip - Artificial Intelligence Technology Behind Advanced Gaming and Driverless Cars Powers New GE Healthcare Ultrasound System - Teledyne e2v unveils its next ultra-compact advanced computing module to join its Qormino® family - element14 Community Launches ‘Bluetooth Unleashed’ Design Challenge - AAEON Technology Europe BV announces collaboration with Eurotech to power its IIoT gateways with ESF edge framework - Rohde & Schwarz to present world’s first signaling test solution for Bluetooth® LE - Infineon and Cree agree on long-term supply of silicon carbide wafers - Ericsson and Swisscom demonstrate network slicing for critical communications - Partnership agreed between Bosch and Munich Re - Qualcomm Introduces New Snapdragon 700 Mobile Platform Series - Small and secure RF modules for embedded applications - S3 Semiconductors joins Arm Approved design partner program - Intel Introduces ‘Intel AI: In Production’ Program – a New Way to Bring Artificial Intelligence Devices to Market - Ericsson at MWC 2018: 5G open for business - Ceragon License CEVA DSPs for Full 5G Wireless Backhaul - Digital Control Meets Intelligent Analog to Streamline Design - Single-Chip Custom Solutions for the IoT Edge - Vehicle communication: Infineon and Elektrobit improve data security in the car - SMARC module for Industrial Ethernet - congatec AG acquires Real-Time Systems GmbH - Bosch reaches agreement with EU Commission on joint settlement of antitrust proceedings - Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT - Qualcomm Technologies Announces Industry’s First Comprehensive Modem-to-Antenna Solution Featured in Xperia XZ2 Smartphone - Integrated Circuit Technology Advances Continue to Amaze - From “sensors to sunset “ - Imec Presents Together with Renesas Electronics an Ultra-Low Power Transceiver for Bluetooth 5 and Beyond with Lowest Supply Voltage Ever Reported - KT, Qualcomm and Samsung Achieve Multi-vendor 5G NR Interoperability on Path to Mobile 5G NR Trials in 2018 - UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environment - Intel to Bring 5G to Mobile PCs Next Year - Infineon Technologies equips Juniper Networks with hardware-based security solutions to further protect routers and network equipment - Highly reliable metal alloy resistors from TT Electronics are AEC-Q200 qualified - Ericsson unlocks IoT ecosystem with IoT Accelerator Marketplace - Bosch acquires U.S. carpooling start-up SPLT - CEVA Announces Industry’s First 802.11ax Wi-Fi IPs - ON Semiconductor announces new set of low power, fully compliant USB-C 1.3 devices - ams, X-Rite and PANTONE® to develop a mobile color sensing solution - Scientists upgrading production of cellulose-based electrical insulation components - Bosch establishes division for connected mobility services - VTT and Neonelektro have made LED advertising boards light, flexible and energy-efficient - Waterproof Electret Condenser Microphones Offer Ingress Protection Ratings up to IP67 - Bosch extends its Industry 4.0 portfolio - New silicon structure opens the gate to quantum computers - MC272561-DRAGONFLY and SmartMesh IP® - Testing Bluetooth® low energy systems - Samsung Electronics Begins Mass Production of Industry’s Largest Capacity SSD – 30.72TB – for Next-Generation Enterprise Systems - Simplify Industrial-Grade Linux Designs with SAMA5D2 MPU-Based System On Module (SOM) - Rohde & Schwarz collaborates with Gemalto to minimize multi-region drive testing for LTE-Advanced wireless modules - Better sound for smart home applications: Infineon acquires Merus Audio - Anritsu Successfully Completes 2nd ETSI NFV Interoperability Plugtests with 100% Success Rate - Green Hills Software Expands Platform for Secure Connected Car with u-blox Connected Driving Technologies - Sunny Optical and Corephotonics Announce Strategic Partnership for Dual Camera Technologies - Siemens and partners sign joint charter on cybersecurity - Validate the performance of eCall modules with new GNSS performance test solution from Rohde & Schwarz - Installed Ericsson Radio System products ready for 5G NR - Highly integrated, wide voltage input synchronous converters feature industry-leading EMI and thermal performance - NEW at FRAMOS: The Cutting-Edge ON Semiconductor AR0430 CMOS Sensor for Simultaneous 2D and 3D Imaging - Singtel, Ericsson first-in-world to achieve 1Gbps speeds on quad-band FDD/TDD carrier aggregation network - Anritsu Announces New Test Platform to Support Qualcomm Technologies’ 5G Chipset Development - EconoDUAL™ 3 IGBT modules with integrated shunts reduce system costs - VTT's cyber security team is the best at identifying the attack vectors with the highest vulnerabilities - Nokia and Qualcomm complete key foundation tests of 5G New Radio network and devices - Samsung and Cisco Team With Orange for First Multi-Vendor 5G Fixed Wireless Trial in Europe - IP-Classes in Rugged Computing - Elbit Vision Systems Announces Acquisition by Uster Technologies AG - ON Semiconductor Named One of the 2018 World’s Most Ethical Companies® by Ethisphere Institute - CLOSE TO THE EDGE: BRAIN-INSPIRED TECHNOLOGIES WILL BRING DATA PROCESSING AND ANALYTICS TO INTERNET OF THINGS DEVICES - Premier Farnell invests in new 360,000 sq foot warehouse at Logic Leeds - Imec Introduces CMOS Chip With 16,384 Micro-electrodes and 1,024 Channels for Multimodal Cell Interfacing - Arrow Electronics and Basler join forces to strengthen industrial embedded vision solutions - Securing IoT Nodes - Cooling for high-performance industrial computers Novel liquid cooling expands application spectrum for CompactPCI computers - NUS engineers invent tiny vision processing chip for ultra-small smart vision systems and IoT applications - New-Tech Europe Magazine | February 2018 | Digital Edition -  “IoT technology is catching up with our visionary dream” The advance of IoT: from smart gadgets to optimized office building - 7 THINGS I KNOW ABOUT… why the network of the future will be DPI-enabled - Lowering the barriers to IoT application development - TSN: Converged Network for Industrial IoT - Renault-Nissan-Mitsubishi launches a venture capital fund to invest up to $1 billion over five years - KT, Verizon and Samsung Collaborate to Demonstrate and Advance Next Level of 5G Innovation - ELTEC Elektronik expands its wireless router family by adding a comprehensive gateway solution - A revolutionary material for aerospace and neuromorphic computing - Nokia and EDF join forces to test Internet of Things technology for industries - AVX Acquires Innovative, Award-Winning Antenna Company, Ethertronics - ON Semiconductor Names 2017 Distribution Partner Award Winners - X-FAB Becomes First Semiconductor Foundry to Achieve IATF 16949 Automotive Quality Certification - Toshiba releases 100V N-channel power MOSFETs for industrial applications - KEMET Announces New Automotive Grade Film Capacitors for Use in the Most Challenging Environments - Rohde & Schwarz presents world's first WLAN signaling tester for IEEE 802.11ax - CUI Expands USB Product Line with USB Type C Connectors - Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs - Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications - New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8% - Anritsu Partners with Trescal in The Netherlands to Provide Calibration and Repair Services for RF Handheld Range - BAE Systems selected to help U.S. Navy SPAWAR identify and track threats - Artificial sounds for traffic safety - Anritsu Delivers Higher Line Productivity and Lower Costs with World’s First Fully Automatic Testing for IEEE802.11ax Devices - Curtiss-Wright Announces Its First VITA 48.8 Air-Flow-Through (AFT) 3U VPX 6Gsps Wideband Transceiver FPGA Card - Advantech Opens Expanded European Service Center in Eindhoven to Drive Industry 4.0 Growth - ST Technologies Help Neonode Add Touch Interaction to Any Object, Surface, or Space - Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018 - Automating materials design - BAE Systems awarded 40 Mk4 Naval Gun contract for Finland - Achronix Completes Production Silicon Validation of 16nm FinFET+ Speedcore eFPGA Technology - Hamburg Port Authority collaborate in 5G research in industrial environment - Mobile System on Chip Designs, Embedded Processing Lift MPU Market - One for all: the embedded motherboard that suits all high-end applications - First LAN Transformer Manufactured 100% by Automation Now Available as a Gigabit Version - eCOUNT embedded presents new high-performance 4K UHD flatpanel controllers - VersaSense, an Exclusive Digi-Key Supplier, Honored with IoT Sensor Company of the Year - New Buck-Boost Converter from ROHM Provides 1.3x Longer Battery Life - FUJIFILM Holdings and Xerox Announce Agreement to Combine Fuji Xerox Joint Venture with Xerox - Rohde & Schwarz adds six new probe models to its power electronics measurement portfolio - Multi-million pound battery project led by Imperial College London announced - BMW Group acquires Parkmobile, LLC to become world’s leading provider of digital parking solutions - UltraSoC delivers industry’s first RISC-V processor trace IP - Samsung Electronics Launches 800-Gigabyte Z-SSD™ for HPC Systems and AI Applications - Imec’s high-speed ultrasonic SNAPSCAN camera enables hyperspectral imaging acquisition in less than one second - ON Semiconductor Announces Strategic Partnership with Audi on Progressive SemiConductor Program (PSCP) - NXP Expands Automotive Ethernet Portfolio with new Gigabit Switch and Dual Port PHY - Navigant Research Names GM, Waymo, and Daimler-Bosch as Top 3 Leading Companies Developing Automated Driving Systems - Developers can maximize efficiency in cost-sensitive power-control applications with new additions to TI's C2000™ Piccolo™ microcontroller portfolio - AVX Adds New Case Size & Codes to its Automotive-Grade TRM Professional Series Ultralow-ESR Tantalum Capacitors - Worldwide user organization founded for open IoT platform MindSphere - New optics solution from VTT - 360-degree panoramic view onto single sensor matrix - Renesas Electronics Expands RX130 MCU Lineup to Enhance Functionality for Touch-Based Home Appliances and Industrial Automation Applications - Bosch, Vodafone, and Huawei enable smart cars to communicate with each other - Bosch opens IoT campus in Berlin - Successful Consortium for Powder Processing - Imec demonstrates Shortwave Infrared (SWIR) range hyperspectral imaging camera - A new approach to rechargeable batteries - PV Nano Cell is Targeting Commercial Opportunities in Printed Electronics - Wi-Charge Wins CES 2018 Best of Innovation Award - Eurotech and ALTEN Calsoft Labs partner up to provide innovative solutions in the IoT space - Toshiba launches small LDO regulator ICs suitable for IoT applications - AVX Releases New Accu-L® Series Thin Film Chip Inductors for Automotive Signal & Power Applications - u-blox introduces world's smallest LTE Cat M1 and NB-IoT multimode module with quad band 2G fallback - Teledyne e2v launches next generation of trilinear line scan cameras - The future of transport – powered by Ericsson - element14 Announces Winners of Annual Community Awards - Melexis announces new automotive-grade fan driver ICs for small applications - u-blox technology provides cellular connectivity for a professional IoT platform - Nokia launches world-first MulteFire(TM) small cell to widen adoption of private LTE for industries, enterprises and operators - Test Smarter With the Latest Enhancements to LabVIEW NXG - Germany’s broadcaster RTL II relies on monitoring and multiviewer solution from Rohde & Schwarz - Qualcomm to Appeal European Commission Decision Regarding Modem Chip Agreement - Potentially life-saving ‘health monitor’ technology designed by University of Sussex physicists - Semiconductor Shipments Forecast to Exceed 1 Trillion Devices in 2018 - Samsung Electronics Advances SATA Lineup with 860 PRO and 860 EVO Solid State Drives Powered by V-NAND - Samsung Electronics Starts Producing Industry’s First 16-Gigabit GDDR6 for Advanced Graphics Systems - Researching Electrochemistry Live - Alexander Foltin appointed Head of Investor Relations; Dr. Jürgen Rebel assumes responsibility for Embedded Security Solutions within the Chip Card & Security Division - BAE Systems to provide U.S. Navy with modernized Mk 45 guns - Value of Semiconductor Industry M&A Deals Slows Dramatically in 2017 - Boeing Unveils New Unmanned Cargo Air Vehicle Prototype - Intel Delivers Best-in-Class Depth Sensing for Makers, Educators and Developers with Intel RealSense D400 Depth Camera Series - CES 2018: Catalyst of Innovation 5G, smart cities, AI, IoT, AR and VR, shine at annual innovation event - Slow 'hot electrons' could improve solar cell efficiency - Troubleshooting made easier with augmented reality - Evonik and Siemens to generate high-value specialty chemicals from carbon dioxide and eco-electricity - New-Tech Europe Magazine | Jan 2018 - IBM Cloud now connected to BT's 'Cloud of Clouds' - Imec and Holst Centre introduce EEG Headset for emotion detection - TE Connectivity in exclusive negotiations to acquire ABB’s entrelec® terminal block business - Samsung Starts Producing 8-Gigabyte High Bandwidth Memory-2 with Highest Data Transmission Speed - Cypress Introduces the Industry’s Most Advanced Automotive Touchscreen Controller - Vicor Releases First 20 Amp 24V Cool-Power ZVS Buck - congatec partners with AMD for long-time support of  AMD Geode processors - First fully integrated SVID and PVID enabled Voltage Regulator with highest efficiency and smallest solution size - Dc Centrifugal Blowers Ideal for High Back Pressure Applications - Timing-Architects becomes a part of Vector Informatik - ams extends digital multispectral offerings with AS7265x compact 18-channel chipset - NXP, LG Electronics and HELLA Collaborate on Automotive Vision Platform - Plessey demonstrates microLED-based AR and VR HUD Concept to industry leaders during CES 2018 - Belden Expands Portfolio of Versatile Automation Tools to Meet Increasing IIoT Connectivity Demands - Manchester scientists develop graphene sensors that could revolutionise the Internet of Things - FRAMOS® Becomes a Corporate Member of Embedded Vision Alliance™ - MX008961 Molex Remote Access Remote Access Enables Real-Time Condition Monitoring and Predictive Maintenance - What role will supercapacitors play in the design of future energy systems? - 5G - It’s Not Here Yet, but Closer Than You Think The race to define 5G may be ending, but the process to design and deploy 5G technology is just beginning - Earth Observation with Smaller Satellites – and Ground Stations - Selecting The Best Pin Material and Plating Option For My Connector - Enabling Ultimate Fidelity with Advanced Motion Control: An Engineer’s Perspective - Farnell element14 adds product configurator from Samtec - Meet the Cruise AV: the First Production-Ready Car With No Steering Wheel or Pedals - Dassault Systèmes Signs Strategic Cooperation Agreement with China Aerospace Science and Technology Corporation - Change in the Infineon Technologies AG Supervisory Board - Engineers make wearable sensors for plants, enabling measurements of water use in crops - Artificial Vision Revolution at CES: OrCam Next Generation Assistive Technology Optimized by ON Semiconductor Image Sensors - Mobileye and Spain’s Road Safety Authority DGT (Directorate-General of Traffic) Collaborate to Enhance Road Safety and Prepare for an Autonomous Future - 3D image sensor: Infineon enables easy smartphone unlock by face recognition - Micron and Intel Announce Update to NAND Memory Joint Development Program - Dallas picks Ericsson for smart cities traffic solution - New 8th Gen Intel Core Processors with Radeon RX Vega M Graphics Offer 3x Boost in Frames per Second in Devices as Thin as 17 mm - The first automated led foil production in the world starts in Finland - TI revolutionizes automotive headlight systems with new high-resolution DLP® technology - ON Semiconductor and ConvenientPower Systems Announce Strategic Collaboration in Automotive Wireless Charging  - HARMAN and Samsung Unveil the Future of Connectivity and Autonomous Driving at CES 2018 - Nuheara's Live IQ, the world’s first high performance “true wireless” ANC earbud, is powered by ams’ best in-class ANC technology - Nokia to provide Telenor with optical backbone in Norway and Sweden - Cypress Brings Superior Infotainment Experience to Connected Cars - Qualcomm and Ford Collaborate on C-V2X Global Initiative to Improve Vehicle Safety, Traffic Efficiency and Support for Autonomous Driving - AFRL, American Semiconductor create flexible system-on-chip for ‘internet-of-things - Intel CEO Brian Krzanich erster Passagier des Volocopters - Autotalks and STMicroelectronics Show World's First Mass-Market-Ready 2nd -Generation V2X Solution during CES 2018 - Ficosa closes its first contract for rotary shift-by-wire system - Verizon, Qualcomm, and Ericsson collaborate to trial latest Massive MIMO advancements, on the path to 5G - Fueling the future at CES®: Infineon enables flexible wireless charging for automotive and consumer applications - Rohde & Schwarz offers market's first independently certified eCall test solution - Intel Responds to Security Research Findings - STMicroelectronics and USound Deliver First Advanced MEMS Silicon Micro-Speakers - Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content - ON Semiconductor Introduces Scalable Image Sensor Platform for ADAS and Autonomous Driving to Speed and Simplify Design and Implementation - Arrow Accelerates IoT Leadership Position with eInfochips Acquisition - Gemalto launches the first biometric EMV card for contactless payments - Fabless IC Company Sales Top $100 Billion for First Time Ever - VTT to sell its testing, inspection and certification operations to Eurofins Scientific Group - WORLD RECORD OF DRONE ENDURANCE! HYBRiX multicopter: 4 hours 40 min flight - by Quaternium - Physicists design $100 handheld muon detector - New technique allows rapid screening for new types of solar cells - Atomically thin perovskites boost for future electronics - LETI AND CLOUDNET IT-SOLUTIONS DEMONSTRATE NEW MULTICARRIER WAVEFORM FOR RURAL AND MARITIME BROADBAND RADIO - Specim’s hyperspectral camera detects counterfeit medicine and traces of blood - Siemens honors 14 researchers who account for 1,300 inventions - Harwin Bestows Digi-Key with Global Distribution Accolade - Agendia and Bluebee Partner to Bring New NGS-Based MammaPrint® BluePrint® Breast Cancer Kit to Market - Samsung Now Mass Producing Industry’s First 2nd-generation, 10-Nanometer Class DRAM - Global mobile industry leaders achieve multi-band 5G NR interoperability - World Record: Quantum Computer with 46 Qubits simulated - 4Q DRAM Sales Put Exclamation Point On An Amazing Year of Growth - Anritsu Upgrades Signal Quality Analyzer High-Speed Interface Measurement Functions - The Industry’s First Dual-Mode Battery Charge ICs - ams launches NFC smart sensor IC for traceable, accurate and disposable wireless temperature loggers - Female Power Contacts for 2mm Pitch Connectors - Intel Unveils Industry’s First FPGA Integrated with High Bandwidth Memory Built for Acceleration - Decrease Time to Market and Cost for the NewSpace Market by Using Radiation-Tolerant Solutions Based on COTS Devices C - TE Connectivity offers first pluggable one-cable solution for power, signal and data for small servo motors—the Intercontec M12 Motor Connector - STMicroelectronics’ Single-Chip Balun for sub-1GHz Radio Practically Makes Antenna-Matching/Filtering Circuitry Disappear - Ericsson extends fixed wireless and Sky Muster™ satellite operations partnership with NBN Co - Siemens wins a contract for the turnkey construction of a power plant in Tatarstan - Anritsu offers World’s First LTE Category M Turnkey Measurement Solution for Lowering Costs of Mass Produced NB-IoT Devices - Nistec has executed placement of the smallest electronic component in the world of a width of an eighth of a millimetre. - Thales and Gemalto create a world leader in digital security - TIM achieves record speed in 5G demo with Ericsson - Guenter Weinberger new CEO of TDK-Micronas GmbH - Kenneth Holmberg, a friction researcher at VTT, wins the highest international award in the field - Huawei Technologies Honors ON Semiconductor with Three Awards - Trainees in Thyrnau Organize Donations for Earthquake Victims in Mexico - Samsung Starts Producing First 512-Gigabyte Universal Flash Storage for Next-Generation Mobile Devices - Industry’s first zero-drift, nanopower amplifier combines ultra-high precision with the lowest power consumption - Tiny 500W PSU from XP Power meets latest medical and IT standards - Introducing the New Intel Pentium® Silver and Intel Celeron® Processors: Performance and Connectivity at Amazing Value - VTT develops device for the simultaneous measurement of several gases reducing indoor air quality - New silicon structure opens the gate to quantum computers - Toshiba Memory Corporation Unveils Embedded NAND Flash Memory Products for Automotive Applications Compliant with UFS Ver. 2.1 - Advantest and SJ Semiconductor Corp. Enter Volume Purchase Agreement for T5830 Memory Testers - Streamline Portable Consumer Designs with Maxim’s MAX14748 15W USB Type-C Charger - Vector signal generator from Rohde & Schwarz achieves extremely high pulse rates in PDW streaming applications - Murata introduces power line inductor for automotive high-speed PoC interface applications - Gemalto research reveals hardware technology companies see 11% increase in earnings following shift to software-based revenue models - STMicroelectronics Acquires Atollic, an Embedded-Systems Company Engineering Integrated Development Environments for Arm® -core-based Microcontrollers - LETI DEVELOPS WORLD’S FIRST MICRO-COOLERS FOR CERN PARTICLE DETECTORS - A smart, portable and miniaturized system that can analyze sweat - Vayyar Imaging Announces $45 Million Series C Financing - Microwave still key to boost network capacity - Deutsche Telekom selects Ericsson for 5G-ready network - SiFive Joins Microsemi’s New Mi-V Ecosystem to Accelerate Adoption of RISC-V Open Instruction Set Architecture - Semi-finalists announced for Ericsson Innovation Awards 2018 - Belden appoints Dr. Oliver Kleineberg as Global CTO of Core Networking Business for Industrial IT - New-Tech Europe Magazine | Dec 2017 - Nokia appoints Joerg Erlemeier as Chief Operating Officer and member of the Nokia Group Leadership Team - Earth Observation with Smaller Satellites – and Ground Stations - Imaging with Hyperspectral Sensors: The Optimum Design for your Application - Material could bring optical communication onto silicon chips - Protecting man and machine against damaging residual currents - First white-box testing model finds thousands of errors in self-driving cars - Standardization as a recipe for success - Lab-on-a-Chip technology – a key enabler for life science and diagnostics - The Cloud Comes to You: AT&T to Power Self-Driving Cars, AR/VR and other Future 5G Applications Through Edge Computing - Boosting Cyber Security Competence: Continental Acquires Argus Cyber Security - 10 GbE in real time - Going the distance: LoRa+BLE makes it possible for IoT to go nearly anywhere geographically - Anritsu and Autotalks Collaborate on V2X DSRC Test Solution offering Reduced Test Time and Cost - Automotive and IoT Will Drive IC Growth Through 2021 - Alps Electric Introduces D Series Spring Contacts with Insulation Coating - Better data security for vehicle communication with AURIX™ by Infineon and CycurHSM by ESCRYPT - Lockheed Martin F-35A Icy Runway Testing for Norwegian Drag Chute Underway in Alaska - IBM Unveils Industry’s Most Advanced Server Designed for Artificial Intelligence - GE Additive opens Customer Experience Center in Munich - T-Mobile, Ericsson exceed 1 Gbps with LAA demo - UltraSoC and Percepio partner to offer first complete embedded analytics platform for real-time systems - New highly accurate digital temperature sensor from ams helps designers of cold-storage equipment to meet demanding error budget targets - Time-Saving, Clear and Comprehensible: PREEvision’s Support for Automotive Ethernet - Synopsys and CEA Announce Partnership to Develop Emulation Solutions for Automotive Applications - ams tri-stimulus color sensor provides precise measurements of biologically influential blue light - GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications - Complete Full-Bridge System-in-Package from STMicroelectronics Includes MOSFETs, Gate Drivers, and Protection to Save Space, Simplify Design, and Streamline Assembly - New Bluetooth® Low Energy and Energy Harvesting Sensor Shields Further Extend the Capabilities of ON Semiconductor’s IoT Development Kit - Imec Demonstrates for the First Time Functional Ring Oscillators Based on Stacked Gate-all-Around Silicon Nanowire Transistors - KDDI and Samsung Complete First Successful Demonstration of 5G on a Train Moving at 100km/hour - Automation of factory logistics for European SMEs takes a digital leap - Flex Power Modules launches new 1000-watt high-end DC/DC advanced bus converter - TI's new automotive LED lighting controller puts the power in designers' hands - IAR Systems supports new Amazon Web Services IoT Microcontroller Operating System Amazon FreeRTOS at Launch - Audi relies on Infineon: World’s first series production car with autonomous driving features - IQD Frequency Products becomes part of the Würth Elektronik eiSos Group - Compact Open Frame Ac-Dc Power Supplies Carry IEC 60601-1 4th Edition Approvals for Medical Applications - Automotive-Grade Regulators from Diodes Incorporated Deliver 5V, 8V, or 12V Outputs and Tolerate 60V Battery Transients - NI Announces New IP67 Edge Nodes for the Industrial Internet of Things - Enhances client SSD line-up with the addition of premium XG5-P Series with increased performance and capacity - Samsung Starts Mass Production of its 2nd Generation 10nm FinFET Process Technology - NXP Announces Community-Based Industrial Linux Distribution for Industry 4.0 - Epson Expands Its Robot Lineup - New Automation Systems Can Be Smaller, Smooth, and Silent with Advanced Motion-Control Chip from STMicroelectronics - New M4171 System Reduces Cost of Test and Boosts Productivity While Enabling Remote Access from Anywhere in the World - Biolog Device´s secure fingerprint USB is made possible with Hyperstone´s U9 controller & API software. - SONY® Semiconductor Solutions launches its 3rd Generation Image Sensors, IMX421 and IMX422, for High-Speed Automation - Optimized and cost-efficient design implementation using AT&S X-in-Board technology - Emmanuel Sabonnadiere Named Leti CEO - New SECORA™ Pay brand: one-stop-offering for fast and easy production of payment cards and smart wearables - First 5G Life campus to open in Belgium - Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source - Rethinking the urban house-share: MINI creates the world’s first MINI LIVING building in Shanghai. - Samsung Wins Home Office Contract to Supply Upgrade Emergency Services Network - TI DLP® technology enables next-generation augmented reality head-up displays - Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC - LG AND IDT PARTNER ON WORLD’S FIRST Qi EXTENDED POWER PROFILE SMARTPHONE - Protect IP and deploy secured connected systems with Microchip’s new CryptoAuthentication™ device and Security Design Partner Programme - Maxim Enabling a Healthier World with Wearables for Preventive Health and Fitness Applications - Professor Erkki Oja wins Nokia Foundation Recognition Award for his pioneering work in machine learning, pattern recognition and neurocomputing - Team AFILSOP of the Ilmenau University wins Audi Autonomous Driving Cup 2017 - Rohde & Schwarz delivers 5G NR sub-6 GHz device testing platform - Anritsu NB-IoT Options Reduce Test Software Development Man-Hours by almost 90% - NEW at FRAMOS: Sony® Semiconductor Solutions’ ECX335B OLED Micro Display as super-small, thin, light-weight and fast solution to VR / AR wearables - Battery Research: German–Taiwanese Research Project Launched - Demonstrating LTE capabilities in Ukraine - Osram’s new LED chip factory goes into operation in Kulim - Europe's Mobility as a Service turned into roadmap; account taken of rural areas’ special features - Melexis expands temperature sensor portfolio with innovative miniature FIR sensor - A new way to store thermal energy - Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017 - Samsung acknowledges Infineon for outstanding quality - EPFL takes part in Switzerland's first-ever Digital Day - Intel Introduces Portfolio of Commercial 5G New Radio Modems, Extends LTE Roadmap with Intel XMM 7660 Modem - Analog Devices’ Integrated Precision Solution Enables Safer and Up to 50% More Efficient Battery Manufacturing - ON Semiconductor Receives Lifestyle Category Award in Super Manufacturing Parts Grand Prize 2017 - Elastic polymer with piezo-effect A rubber power plant - Hyperstone U8 inside TERZ KALIBER-XS, IP67 M12 USB Flash Drives. - Raspberry Pi in Collaboration with element14 Community Launch Major New Cooking-Based Design Challenge: “Pi Chef” - Samsung Introduces Chip-on-Board LED Packages Optimized for Commercial Lighting - Würth Elektronik eiSos extends STAR-TEC snap ferrite family Thick Cables Elegantly Interference-Suppressed - Intel and Micron Increase 3D XPoint Manufacturing Capacity with IM Flash Fab Expansion - Improve response time to critical system events on CAN networks with new 8-bit MCU with Core Independent Peripherals - Ultra-Compact 3 W Wall Plug Adapters Meet DoE Level VI and CoC Tier 2 Efficiency Standards - Will Samsung’s 2017 Semi Capex Deliver Knockout Blow to Competition? - Toshiba Electronic Devices & Storage Corporation Releases 1.5A LDO Regulators in Industry’s Smallest Package for Mobile Applications - Automotive Electronic Systems Growth Strongest Through 2021 - Nokia Bell Labs, Inria launch next phase of long-standing partnership to solve future network challenges and the role of machines in automating and augmenting human existence - Huawei and Gemalto team up to accelerate NarrowBand IoT deployments - TactoTek and Quin GmbH Partner to Create Luxury Natural Wood Trim with Integrated Touch and Lighting Functions for Car Interiors - Qualcomm Board of Directors Unanimously Rejects Broadcom’s Unsolicited Proposal - Imec expands strategic partnership with Western Digital - SC17: Intel Boasts Record-Breaking Top500 Position with Fastest Ramp of a New Xeon Processor on List - European Partners to Establish Nanopharmaceutical Pilot Line - Next-Generation Smart Objects Can Do More and Consume Less with New STM32L4+ Microcontrollers Series from STMicroelectronics - NI Announces Industry’s First PXI Chassis With 58 W of Power and Cooling per Slot - Helping DARPA test space technologies to protect against emerging threats - Imec designs and fabricates world-first miniature neural probe for simultaneous recording of multiple brain regions at neuronal resolution - Ericsson to gear up RCS & RDS (Digi) network for 5G and IoT - STMicroelectronics Showcases Advanced Robot Demo and Latest Solutions for Embedded Systems at Embedded Technology 2017 - Imec and Panasonic introduce innovative nanocomposite electrolyte for next-generation batteries - VTT's solution enables compact devices for telecommunications and security camera applications at even higher frequencies - Electrocomponents appoints Debbie Lentz as President Global Supply Chain - Advanced Wireless-Charging Chip from STMicroelectronics Enables Faster Charging of Smartphones and Tablets - F-35A Lightning II airframe completes third life testing in unique facility - Synopsys to Enhance Software Integrity Platform with Acquisition of Black Duck Software - New-TechEurope Magazine | November 2017 | Digital Edition - First white-box testing model finds thousands of errors in self-driving cars - Qualcomm Signs Memoranda of Understanding with Xiaomi, OPPO and vivo as Part of a Bilateral Trade Mission - Ericsson Broadcast and Media Services becomes Red Bee Media - Texas Instruments offers 25 functions for 25 cents with new MSP430™ microcontrollers - Analog Devices’ Industrial Inertial Measurement Units Improve Navigation and Reliability in Autonomous Machines - Intersil Delivers Space Industry’s First Rad-Hard and Rad-Tolerant Quad Power Supply Sequencers - Latest single-wire serial EEPROM from Microchip enables remote identification - Industrial IoT gets out of the box with 4zerobox! - Nokia and Vodacom collaborate to shape the future of 5G in South Africa - Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations at EMEA Headquarters in Ireland - International Allies Receive F-35 Full Mission Simulators In-country pilot and maintenance training ramps up - Infineon introduces a five output digital voltage regulator in a QFN package - Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion - GE and Green Investment Group to Deliver 650 MW of Onshore Wind to Sweden - Researchers develop flexible, stretchable photonic devices - New PCap04 smart capacitive sensing front end from ams enables optimization for speed, resolution or power - Latest 1/4-Inch 1.0 Mp CMOS Global Shutter Image Sensor Delivers High Performance Imaging for All Light Conditions in a New Smaller Package - Swisscom offers Gigabit LTE with Radio Dot System - NXP and Chongqing Establish Center for Automotive Electronics Applications Development in China - Cypress Technology Helps Denso’s Latest Automotive Stereo Vision Sensor Improve Vehicle Safety - Blazing-Fast Gaming with Intel’s First Client Optane SSD - TowerJazz and Yuanchen Microelectronics Announce Partnership for Backside Illumination (BSI) Manufacturing in Changchun, China - Carnegie Technologies Acquires SmartSwitch From Chemring Technology Solutions Combining Forces to Deliver the Most Comprehensive Mobile Wi-Fi Experience Solution - Integrated technologies to recover metal and plastic from electronic waste - Long range anti-ship missile sensor production begins - congatec virtualizes robust COM Express Type 7 Server-on-Module - HEITEC Emphasizes Industry Expertise Top-of-the-range chassis systems - New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with BSI Pixel Technology to Satisfy Challenging Security and Surveillance Applications - Würth Elektronik eiSos Supplies Wireless Power Coil for Semtech’s LinkCharge® LP Multi-Device Wireless Charging Solution - USB Smart Hub ICs Enable Smartphone-Connected Automotive Infotainment - ams launches NFC Sensor Interface for Industrial IoT - 2” x 4” Open Frame Ac-Dc Power Supplies Offer High Densities up to 30 W/in3 - Amphenol Aerospace Secures License to Supply VITA-46 Connectors - The R&S MNT100 RF interference locator from Rohde & Schwarz introduces expert interference hunting in mobile networks - Imec partners in European initiative to develop Organs-on-Chip - Optoelectronics, Sensors/Actuators and Discretes Climb - Sussex physicists have breakthrough on brittle smartphone screens - Opening ceremony of external unit of Technical Support Center - Analog Devices Establishes Strategic Relationship With China Mobile IoT - SmarTone, Ericsson trial FDD Massive MIMO - VTT-originated Spectral Engines develops a portable drug screening device for police officers - Samsung Addresses IoT Data Security at the Chip Level with New Hardware/Software Turn-Key Solution - STMicroelectronics Launches Open Development Platform for Secure Car-Connectivity Applications - OMC launches new small-footprint SMA Tx/Rx housings - New dual-band Wi-Fi radio module with Bluetooth functionality from Panasonic enables high data rates and low-power operation - NI Announces New PXI FlexRIO Architecture With Xilinx Kintex UltraScale Technology - STMicroelectronics Announces Class-Leading Water-Resistant Pressure Sensor and First Design Win in High-Performance Wearables from Samsung - ON Semiconductor Introduces World’s First Highly Scalable Family of Next-Generation Automotive Image Sensors - MTS selects Ericsson to prepare network for 5G and IoT - VW is building an electric racecar to try and break a record - Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10 FPGA - BMW Brilliance Automotive opens battery factory in Shenyang - Life Sciences start-up scoops top prize at White City innovation awards - Everysight and Qualcomm Announce Reshaping of the Cycling Experience with Raptor AR Smartglasses - NXP Introduces Industry’s First Automotive-Qualified Bluetooth 5-Ready Wireless Microcontrollers with integrated CAN-FD - UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman - 3-D printer makes first wearable 'battery' - Material could bring optical communication onto silicon chips - Competitiveness from digitalisation: VTT and Hydroline to develop new service business from hydraulic cylinders - Second River Class Offshore Patrol Vessel Named in Glasgow - Chemicals and Process Consortium lead Innovation Audit - Samsung Electronics Partners with TÜV SÜD to Introduce Collaborative Testing Program for its Automotive LED Components - STMicroelectronics’ STM32H7 Series MCU Leverages the New Platform Security Architecture from Arm to Boost Protection for Connected, Smart Devices - TI enables designers to achieve a new low in standby power - NXP and Metanoia Collaborate on Broadband Access Solutions - LETI COORDINATING EUROPEAN PROJECT TO IMPROVE DRIVETRAINS FOR ELECTRIC VEHICLES TO BOOST PERFORMANCE AND CUT COSTS - Mouser Electronics Signs Agreement with Pycom to Distribute IoT Modules and Dev Boards - Intel Capital Fuels Innovation with $60 Million of New Investments in 15 Data-Focused Startups - Ericsson and Magyar Telekom demonstrate first 5G link in Hungary - NXP Unveils Breakthrough Innovations for Payment Cards - Hitachi Automotive Systems' ADAS ECU Used in Nissan Motor's Upgraded Note - IC Insights Raises 2017 IC Market Forecast to +22% - Teledyne e2v welcome Lord Callanan and senior representatives of the Space Industry to discuss the pending UK Space Industry Bill - Metal Backshells with Built-In Shielding Ensure Ongoing Electrical & Mechanical Integrity - Panasonic augments its Metallized Polypropylene Film Capacitors portfolio for industrial and infrastructure use - Toshiba Electronic Devices & Storage Corporation Adds Second-Generation 650V SiC Schottky Barrier Diodes in DPAK Surface-Mount Type Package - IC Makers Maximize 300mm, 200mm Wafer Capacity - 15 Millions more for Heliatek - GoFly Launches Competition to Bring Personal Flying Devices to the Masses - Stella Vie wins World Solar Challenge 2017 - NXP Announces New Automotive Processing Platform that Brings Future Vehicles to Market Faster - E.ON completes ‘UK-first’ battery installation at Blackburn Meadows biomass power plant - Intel and Mobileye Offer Formula to Prove Safety of Autonomous Vehicles - Samsung Completes Qualification of 8nm LPP Process - LG AND QUALCOMM TO JOINTLY RESEARCH AND DEVELOP NEXT-GEN CONNECTIVTY SOLUTIONS FOR CARS - Analog Devices’ Wideband RF Power and Return Loss Measurement System Offers a Smaller Form Factor and Faster Time to Market - Würth Elektronik eiSos presents WE-DPC HV Power Choke - High Density Ac-Dc Power Supplies Housed in Low Profile, Open Frame Packages - ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids - 42V, Dual 4A (IOUT), Synchronous Step-Down Silent Switcher 2 Delivers 94% Efficiency at 2MHz & Ultralow EMI Emissions - Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution - STMicroelectronics’ Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats - Verizon, Qualcomm and Novatel Wireless Announce Collaboration to Expedite Trials and Wide-scale Commercial Deployment of 5G NR mmWave Technology - New Nokia FTTx solutions give operators greater flexibility and choice to meet ultra-broadband demand - Siemens showcases digitalization applications for machine and plant builders - NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module - ams audio chips offer world-class noise-cancelling performance in two new wireless headphones from trend-setter FIIL - Qualcomm Technologies Extends RF Front End Portfolio to Deliver Modem-to-Antenna Solution for 600 MHz Bands - Hitachi Launches the Systems to Automatically Generate Optimized Production Schedules and 3D Work Instructions as a Solution Core for the IoT Platform "Lumada" - Delta’s Smart and Energy-Efficient Solutions for EV Charging and Energy Storage Showcased at eMove360° Europe 2017 - Nokia demonstrates first PON solution with integrated wireless drop alternative - The Swiss Team has won the Solar Decathlon competition - Next Generation Advanced Instrumentation and Defense Applications Enabled by Analog Devices’ High-Speed A/D Converter - Samsung’s New Image Sensors Bring Fast and Slim Attributes to Mobile Applications - Intel FPGAs Power Acceleration-as-a-Service for Alibaba Cloud - Infineon partners with Smart Wires to shape up existing grids for renewables - Samsung Develops X-Ray Detector Material with Low Radiation Exposure - Laird Brings Bluetooth v4.2 Dual-Mode Connectivity to Updated Line of HCI Modules - Kionix's New KX220 Analog Accelerometers for the Industrial Market - Intersil Unveils First USB-C Buck-Boost Voltage Regulator - Slash system power usage with TI's new fully integrated switch and sensor monitors - NI Technology Improves Safety and Reliability Test for ADAS and Autonomous Vehicles - New automotive-grade magnetic position sensors from ams feature PSI5 interface - XP Power launches 15 W and 20 W DC-DC converters for cost sensitive applications - ON Semiconductor brings 5 Megapixel CMOS backside illuminated image sensor at high speed for Surveillance - AVX: New Antenna PowerGuard Products Provide Reliable ESD Protection in Capacitance-Sensitive Applications - 40VIN, 2A Silent Switcher µModule Regulator in 6.25mm x 4mm BGA Package - Microsoft, GE sign agreement on new wind project in Ireland - CPI invests in STEM activities to inspire the UK’s next generation of scientists and engineers. - R-PHY vs R-MACPHY debate is over: Nokia leapfrogs competition with cable industry's first virtualized Distributed Access Architecture - Microsoft Ventures announces Innovate.AI, a global search for startups shaping the future of AI - Intel Delivers 17-Qubit Superconducting Chip with Advanced Packaging to QuTech - From hearing aids and pacemakers to prostheses: Highly miniaturized and extremely reliable thanks to innovative PCB technology from AT&S - 170 years of Siemens: from an inner courtyard to the cloud - Würth Elektronik eiSos and Audi use Electric Power to drive into the Future - Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices - ON Semiconductor’s Low Power Imaging SoCs for Automotive Camera Applications Reduce Solution Size by More than 30% - Panasonic Develops 3D LiDAR Sensor Enabling 3D Detection of Distances with Wide Angle of View - Robotics MSc next step for University of Plymouth graduate mentored by Plessey CEO - Daimler invests around 600 million euros into commercial vehicle business in Brazil - Reduce Risk and Time to Market with Microchip’s MPLAB® Mindi™ Analog Simulator with SPICE and SIMPLIS Environments - Lockheed Martin Delivering Next-Generation Apache Sensor Systems Under New U.S. Army Contract - New solutions from Rohde & Schwarz for automotive radar echo generation and radome measurements at EuMW 2017 - Teledyne e2v sensors to equip the LSST- one of the world’s most powerful survey telescopes - Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System - 8,000th Hybrid electric drive system produced for transit buses - Qualcomm Signs 3G/4G Patent License Agreement with General Mobile - 25A µModule Regulator Supports N+1 Redundancy Ensuring Power Availability under Fault Conditions - Panasonic Industry Europe Repositioned to Provide Solutions-based Competence Service for European Customers - ams awards EMEA distribution franchise to EBV to support rapid growth in demand for smart sensor solutions - Ronnie Leten proposed as new Chairman of the Board in Ericsson. Kurt Jofs proposed as new member of the Board - Vicor introduces ChiP DCM family with ±1% regulation - Fast-moving magnetic particles could enable new form of data storage - BMW Group lays the foundation for expansion of its Research and Innovation Centre (FIZ) - The World-record 53.3 Tb/s Optical Switching Capacity for Data-center Networks - STMicroelectronics’ Software Kit for Bluetooth® Mesh Networking Accelerates Arrival of Connected Smart-Lighting and Automation Products - Dassault Systèmes to Acquire Exa Corporation - Telia, Ericsson and Intel First to Make 5G Real in Europe - Arrow Electronics signs SensiEDGE - GE Healthcare opens its first European 3D printing and design center - Monthly Semiconductor Sales Reach $35 Billion Globally for First Time in August - XP Power adds RF power supplies with acquisition of Comdel - NI Trend Watch 2018 Explores the Trends Driving the Future Faster - Oliver Hoffmann takes over as the new Head of Technical Development at Audi Sport - Imec Leverages the Power of Silicon Fabrication to Create Innovative Neural Probe Demonstrator with Unprecedented Electrode Density - Silent Switcher, 42VIN, 2.5A µModule Regulator in 6.25mm x 6.25mm BGA Package - Murata introduces the world's first 15 uH inductor in 0402 size for smartphones - Infineon launches the sixth generation of CoolSiC™ Schottky diodes 650 V for fast switching - Microsemi Announces New Serval-T Ethernet Switch Product Family Enabling Nanosecond Accurate 1588 Solution in a Single Device - NXP Announces the Industry’s First Comprehensive, Secure, Smart Energy Dual-band Solution for Smart Homes and Cities - Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar - Belden Extends Reach and Reliability of Genius Bus and Modbus Plus Networks - Eltek launches the Flatpack2 SHE, a Super High Efficient power conversion module with the new game changing CoolGaN™ technology from Infineon at its core - Dc Axial Fans Deliver Improved Life and Performance with Advanced Bearing System - STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks - Cypress and Arrow Electronics Team Up to Provide Ubiquitous IoT Connectivity - Pure-Play Foundries Boosting Their Presence in China - Google Clips Captures and Curates Life’s Meaningful Moments Autonomously with Intel’s Movidius VPU Inside - BAE Systems to support the UK's new aircraft carriers - Imec Reports Micro-Optomechanical Pressure Sensor Advancing Pressure Monitoring in Biomedical Applications - Electrocomponents moves to the heart of digital innovation in London - IFA 2017 Provides a Huge Boost for Industry and Retail - The Autonomous Factory: Inertial Sensors Conquer IoMT Challenges - Easy to Integrate BLE module from AMBER wireless for smart IoT solutions - New-Tech Magazine | Oct 2017 | Digital Edition - IFS extends leadership in Service Management with the acquisition of WorkWave - Vintage Cloud Brings Steenbeck Digitizer to Broadcast India for the First Time Enables valuable film archive to be preserved, made more accessible, monetised - For a secured digital energy infrastructure: Infineon, IBM, GreenCom Networks and icentic join forces Joint publication from Infineon, IBM, GreenCom and icentic - German broadcaster SWR selects Jordi’s ADAM-System for massive digital archive migration with Rohde & Schwarz - Reduce Your System-Level Design Verification Effort Using PSpice and MATLAB Integration - VTT upgrades pilot environment for 3D printing of metals: powders a step towards the future of product development - “Personal thermostat” startup heats up for commercialization - Power Transistor Growth Returns After Volatile Period - New High Resolution Audio SoC Supports a Variety of Sound Sources - Qualcomm Invents New, Smart Single-Use Biometric Patches - 500 new European companies from space - Google and HTC Announce US$1.1 Billion Cooperation Agreement - TowerJazz and Crocus Expand Presence in Magnetic Sensors Market through Successful Licensing of Crocus’ IP and Volume Manufacturing by TowerJazz - Renewable energy to cause major disruption to UK utilities by 2030 - Lattice’s Low Power, Small Form Factor ECP5 FPGA Enables Ximmerse VR/AR Tracking Platform - New relay from TE Connectivity is small, yet powerful - Enable CAN Flexible Data Rate (CAN FD) in new and existing designs using Microchip’s unique external CAN FD controller - ON Semiconductor Introduces World’s Most Compact Sigfox Verified Solution with its First RF System-in-Package for Low Power IoT Designs - Intel Unveils the 8th Gen Intel Core Processor Family for Desktop, Featuring Intel’s Best Gaming Processor Ever - Tektronix PAM4 Optical Analysis Solution for Real-time Oscilloscopes Streamlines Validation Challenges - 150°C rated 1206-inch chip ferrite beads for automotive power lines - AMBER wireless presents its design kit for Raspberry Pi - Samsung Starts Producing Industry’s First Universal Flash Storage For Next-Generation Automotive Applications - Cypress Enables Next-generation Portable and Battery-operated IoT Devices with a New Ultra-low Power Wi-Fi and Bluetooth Combo Solution - TI introduces the most accurate single-chip ultrasonic sensing microcontrollers for smart water meters - Siemens and Alstom join forces to create a European Champion in Mobility - Automated driving testing on European roads: Research project L3Pilot kicks off - Vicor Introduces New 700V K of 1/16 Bus Converter - Würth Elektronik eiSos strengthens international logistics - Multiplication of Warehouse Capacity in France - A solar cell you can put in the wash - Ericsson enables voice calls for wearables - Toshiba Opens New European Retail Innovation Experience Theatre - Imagination’s new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices - Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP - Nokia reaffirms commitments made to the French government following the acquisition of Alcatel-Lucent - Fifth major rail order for Siemens in Bangkok - Electric Mobility Startup Kreisel Electric Relies on Dassault Systèmes to Accelerate Its Business Growth - OTX Plc announces several closings under its $1.3 million equity placing through London based private equity firm Charles Street Securities. - ABB to acquire GE Industrial Solutions - ASUS Announces ZenFone 4 Family in Europe - Future-Proof IoT Security Today - Infineon Technologies to sell Newport manufacturing site to Neptune 6 Ltd. - NXP Awarded Excellence in Quality for 2017 by Cisco - ISELED Alliance welcomes Valeo as a new member - Vicor Extends 48V Cool-Power ZVS Buck Regulators Family - LETI DEVELOPS PROOF OF CONCEPT TO TEST WIRELESS SYSTEMS IN AIRCRAFT - Unique DC/DC converter combines true fixed frequency and ultra-fast transient response with integrated compensation - 100 years of light and lasers at Imperial illuminated in day of celebration - FRAMOS Solutions Now Include Intel’s® RealSense™ Technology Product Line – Making Machines Truly See and Think - Teledyne e2v presents a vision of the key role that sensors will play in smart cities - Finnish technology will plunge into Saturn's atmosphere onboard Cassini - Leading-Edge Paves the Way For Pure-Play Foundry Growth - NXP S32V Processor for Vision and Machine Learning Applications Now Available - BAE Systems unveils latest wearable display technology at DSEI - Europe’s largest innovation platform STARTUP AUTOBAHN launches its third 100-day program in Stuttgart - CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography - NXP Launches New Java Card-based Operating System to Expand Multi-Application Services in the Secure Identification Market - 600 V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives - Unique DC/DC converter combines true fixed frequency and ultra-fast transient response with integrated compensation - Mini-IO adopted as an International Electrotechnical Commission standard - Renesas Electronics and Cogent Embedded Collaborate to Make 3D Surround View Parking Assist System Standard in All New Cars - Toshiba Electronic Devices & Storage Corporation to Unveil Low Voltage 5GHz Receiver for Next-Generation Wireless LAN - Belden Introduces New Products to Enhance Productivity at SPS/IPC/Drives 2017 - Increase software power-measurement accuracy to 99 percent in Windows 10 Devices with new power-monitoring IC from Microchip - Maxim's CAN Transceiver Eliminates Installation Errors and Improves Reliability for HVAC and Building Automation Systems - Samsung Introduces Highly Advanced, Enhanced Chip-Scale LED Packages for Spotlights and High-Bay Applications - CPI Appoints Jennie Younger as New Non-Executive Chairman - ams further expands Singapore manufacturing capacity to address global demand for optical sensor solutions - BAE Systems awards multimillion euro contract to Konstrukta-Defence,a.s in Slovak Republic - DNA Finland chooses Ericsson for metadata - SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology - Tactical hotspot to help shape the future of the UK Army - Epson and MERCEDES AMG PETRONAS Motorsport Create Glow-in-the-Dark Pit Stop - Valmet Goes Digital with Dassault Systèmes to Unify Operations Across 30 Countries - Bulgaria Sat selects Ericsson to enable high-quality UHDTV across the Balkans - ESA awards Teledyne e2v a 42 M€ contract to provide highly sensitive light detectors for the PLATO planet-hunting spacecraft - Flexible Transformer for Switched-mode Power Supplies - TowerJazz Announces Release of its Advanced 5V 65nm CMOS and Low Voltage Power Process Addressing LED Lighting, Analog Switch, DC/DC Converter and Load Switch Applications - BrainChip Introduces World’s First Commercial Hardware Acceleration of Neuromorphic Computing - UltraSoC expands to address embedded analytics market opportunity - Rafiah Ibrahim recognized as Female CEO of the Year - Self-assembling nanoparticle arrays can switch between a mirror and a window - Mobileye and Munich Re, US Announce Collaboration to Reduce Automotive Collisions - New congatec modules with 10 GbE bandwidth raise the bar for embedded edge computing - Osram presents innovative SMARTRIX modules - Enjoy Customized Home Security With The New Honeywell Lyric™ C2 Wi-Fi Security Camera - New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package - 42V Multitopology DC/DC Controller with 15μA IQ Provides Five Converter Topologies at Up to 10A Output Current - Industrial resolvers for servo motors from TE Connectivity provide precision in difficult conditions - T-Mobile, Nokia, and Qualcomm Reach Record 1.175 Gbps Download Speeds in Advanced LTE Lab Trial - The Finnish Kaitotek makes network measurement tool developed by VTT available to industry - IEC/EN 60127-6 Edition 2 - SCHURTER is ready - Vodafone and IBM Join Together to Offer Easy Route to Cloud for Enterprises - “Peel-and-go” printable structures fold themselves - DONG Energy awarded contract to build the world’s biggest offshore wind farm - Mena solar farms to power Europe underway - NXP Launches World’s First Scalable, Single-Chip Secure Vehicle-to-X Platform - The Adversarial Relationship of the DRAM User and Producer Continues - Ovum launches new Forecaster product and expands research services and staff - Nextchip License CEVA Imaging and Vision Platform for ADAS Vision System - Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System - IBM Offers Free Cybersecurity Training to Military Veterans - Xilinx, Arm, Cadence, and TSMC Announce World's First CCIX Silicon Demonstration Vehicle in 7nm Process Technology - OnKöl remote patient monitoring uses Gemalto IoT connectivity to support 'age in place' individuals - KDDI and Samsung Break Track Record in High-Speed 5G Mobility Test - IBM and MIT to pursue joint research in artificial intelligence, establish new MIT–IBM Watson AI Lab - Infineon strengthens its expertise in voice-controlled human machine interface with strategic investment in XMOS Infineon strengthens its expertise in voice-controlled human machine interface with strategic investment in XMOS - Dynamic power scaling - Considering EMC Emissions Early in the Design Process - Compact linear motion with high linear force: Portescap 20DBM miniature can stack linear actuator provides exceptional performance - Tektronix Unveils Comprehensive OTT Monitoring Solution Spanning Ingest to Delivery - Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects - Compound Semiconductor Applications Catapult appoints CEO - Rugged 50Ohm Multiport Coaxial Connectors & Pre-Assembled Cables - Low-voltage 64-Megabit Serial Quad I/O™ SuperFlash® memory from Microchip improves power consumption in battery-powered devices - Nexperia boosts protection portfolio with three new miniature, high-performance TVS diode families - The Industry’s First Dual-Mode LPWA (Low Power Wide Area) Compliant Wireless Communication LSI - 150V Synchronous Buck-Boost Controller Eliminates Surge Protection Devices & Delivers Up to 99% Efficiency - Rohde & Schwarz T&M equipment for power electronics at EPEʹ17 ECCE in Warsaw - Quickly Develop Quality Power Supplies with Maxim’s EE-Sim® DC-DC Converter Tool - Renesas Synergy™ Platform Strengthens Security and Expands IoT Device-to-Cloud Connectivity - 58VIN, 24W, Inverting µModule Regulator Is EN55022 Class B Compliant - XP Power releases compact, high-efficiency 750W AC-DC power supplies with industrial and medical approvals - Anritsu to Introduce the MP1900A New Generation Signal Quality Analyzer at ECOC 2017 in Gothenburg - Most of 2017 Capital Spending Will Go to Foundry and Flash Memory - Lam Research Completes Acquisition of Coventor, a Leader in Simulation and Modeling Solutions - Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications - Rimac Automobili Accelerates its Next Electric Super Sports Car with Dassault Systèmes - Collaboration Invite in Biologics and Bioprocessing - LeddarTech Leads the Charge in Solid-State LiDAR for Autonomous Driving with US$101 Million Series C Financing - Rohde & Schwarz Cybersecurity’s Deep Packet Inspection Software Now Detects Bitcoin Transactions in Network Traffic - Hiveonline wins Ericsson Garage Startup Challenge - Imec Reports World-Class Low-Power IP Blocks for 5G - Electrolytic Capacitor Lifetime in Power Supplies - reVISION: Accelerates your Surveillance Application - Nokia puts operators on path to 5G by boosting 4G - Fuel Cells for Business Continuity - 3D systems-on-chip: a clever partition-ing of circuits to improve area, cost, power and performance - Industry Lessons: Until Power Is Better Understood, BA Won’t Be an Isolated Incident - New-Tech Europe Magazine | Aug 2017 - New-Tech Europe Magazine | Sep 2017 - The Growing Impact of Compliance in the RF/Microwave Supply Base - Power sequencing verification made easier with an 8-channel oscilloscope - TEMPERATURE SENSORS - NOW YOU SEE THEM, NOW YOU DON’T - Shaping Smarter Cities: More Than Meets the Eye: Augmented Reality in Medical Applications - Using chip memory more efficiently - Green light for ultra-fine display colours - congatec presents its roadmap to bring 10 GbE to the industrial fields - Smart Data Analytics: BMW Group relies on intelligent use of production data for efficient processes and premium quality - Carving diamonds for optical components - Communications policing is the new community policing - Mouser-Sponsored Vaillante Rebellion Team Eyes the Lead in Mexico - Samsung Electronics Shapes Life’s New Normal at IFA 2017 - STMicroelectronics Boosts Its Ecosystem with Partner Program That Connects Customers with Qualified Third Parties - T-Mobile lays 5G foundation with expanded 600 MHz rollout - Nano Dimension Technologies Ltd. Signs Agreement with First Customer, Jabil, for Commercial 3D Printer - Composite 38999 connectors from Aerco save weight without compromising performance - LETI LAUNCHES EMULATOR SERVICE TO BOOST ROI AND SPEED TIME TO MARKET FOR EUROPEAN CHIPMAKERS - Samsung's New, Enhanced Wearables – Gear Sport, Gear Fit2 Pro, Gear IconX – Combine the Best in Smart Living, Fitness and Health - Renesas Electronics Delivers 8.48 MP CMOS Image Sensor for 4K Network Security Cameras - NXP and Changan Automobile to Cooperate on Infotainment and Future Vehicle Technologies - Qualcomm Brings Fast, Exceptional Connectivity to Samsung Premium QLED TVs - Consortium to develop automated continuous purification - Sony Introduces the IMX420/428 as the First Imaging Sensors that Features its 3rd Generation CMOS Global Shutter Mode - FROM DELICATE CHORDS TO DEAFENING THUNDER, LG V30 DELIVERS TAILORED HI-FI - Vicor’s Power-on-Package Enables Higher Performance for Artificial Intelligence Processors - Intersil Introduces High-Speed RS-485 Transceivers with Highest Reinforced Isolation - Intel Unveils Neural Compute Engine in Movidius Myriad X VPU to Unleash AI at the Edge - Honeywell Backs Scuderia Ferrari In Championship Hunt At Midpoint Of F1 Season - Ericsson and partners showcase first-of-its-kind CBRS demonstration - VTT acquires a new test system for the production of silicon photonics - Orbotech Announces Multi-Million-Dollar Deal with Unimicron Germany for Automotive, Renewable Energy and Industrial Manufacturing - Tektronix Helps Content Creators Solve Critical Challenges Capturing 4K/UHD, WCG, HDR Content - Intel Xeon Scalable Processors Accelerate Creation and Innovation in Next-Generation Workstations - SCHURTER is IATF 16469 Certified - Littelfuse To Acquire IXYS Corporation - Silego Announces Shipping More Than 3 Billion Configurable Mixed-signal ICs - Global skills shortage puts IoT development at risk, says Inmarsat - 20th Century Fox, Panasonic and Samsung Forge New Partnership to Deliver the Best Possible Viewing Experience with HDR10+ Technology - Drones relay RFID signals for inventory control - NASA Technologist Develops Self-Calibrating, Hybrid Space Magnetometer - Qualcomm Announces, President, Derek Aberle, to Leave Company as of December 31, 2017 - Magewell Expands Eco Capture Family of Compact, Power-Efficient M.2 Capture Cards - NI Announces New PXI Remote Control and Bus Extension Modules for High-Throughput Applications - CoolMOS™ P7 in SOT-223 combining performance and ease of use with a cost-effective package solution - 8th Gen Intel Core - Verizon, Ericsson, and Qualcomm Eclipse Previous Record with Gigabit LTE Speeds Reaching 1.07 Gbps in Lab Trial - Samsung’s Bixby Voice Capabilities Now Available in Over 200 Countries Globally - VTT and Fläkt Woods have developed an intelligent flow sensor for demand - controlled ventilation - Mouser-Sponsored Formula E Racing Ends Electrifying Season - Qualcomm Snapdragon 835 Mobile Platform Delivers Superior Connectivity, Graphics, and 360 Video Immersion on Samsung Galaxy Note8 - Analog Devices’ Monitoring Initiative Aims to Improve Crop Quality and Yields and Boost Profitability of Local Farmers - Defined spacing between PCBs! - More colors despite a smaller footprint: ROHM Introduces Ultra-Compact Low Profile 2-Color Chip LEDs - Efficacy to Improve Premium Indoor Lighting - Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017 - Osram acquires leading U.S. software platform provider - Next-generation radiation-hardened computer for space - The fascination of pure music: 3D sound in the new Audi A8 - Samsung Electronics Launches ‘Relúmĭno’ Visual Aid Application for the Visually Impaired - Nokia selected by Telia and Telenor to manage TT radio network in Denmark - WSTS has published the Q2 2017 semiconductor market figures - MediaTek selects MIPS for LTE modems - Microchip Extends Custom Programming Service to Include AVR® and SAM Microcontrollers - TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China - Using a camera to spot and track drones - From Lancashire to Texas: 10% production milestone achieved for F-35 Lightning II fighter jets - Qualcomm Bolsters Position in Artificial Intelligence Research, Outlines its Vision for the Future - IoT Testing - The Big Challenge Why, What & How - Fast track to improved power supply reliability - Hints and tips on the use of cooling fans for power supplies - Anritsu selects Ubi-Tech (3R) Ltd as Strategic Training Partner for the UK and Ireland - Selecting the Right Wireless Power Coils - Microchip unveils next-generation In-Circuit Debugger (ICD) with unparalleled speed and flexibility - Ultra-Wideband 3GHz to 20GHz Mixer Supports DC to 6GHz IF & 0dBm LO Drive in a Tiny 3mm x 2mm Package - Rohde & Schwarz Mobile Network Testing pioneers NB-IoT field measurements - TE’s HDC connectors for Servo and Spindle motors - Siemens builds eHighway in Germany - Intel and Microsoft Collaborate to Deliver Industry-First Enterprise Blockchain Service - TowerJazz Announces DENSO Corporation utilized its Advanced 0.18um SiGe Technology to Develop a 24GHz Rear and Side Radar Sensor - Qualcomm First to Announce Depth-Sensing Camera Technology Designed for Android Ecosystem - Cypress Streamlines Wireless Design for Smart Home Applications with Addition of iCloud Support to IoT Development Platform - BYU 3D PRINTS FIRST OF ITS KIND SUB 100 MICRON MICROFLUIDIC CHIP - Coretronic acquires British image processing company, Calibre - Industry leaders to form consortium for network and computing infrastructure of automotive big data - DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs - Researchers use polystyrene to make next-generation of solar panels even cheaper - San Francisco-Based CellSavers Rebrands as Puls and Raises $25 Million to Expand its Instant Services for Smart Devices - Flexible batteries power the future of wearable technology - ORBIT TO EXPAND MULTI-PURPOSE AIRBORNE SATCOM TERMINAL DEVELOPMENT TO INCLUDE HELICOPTERS - HSBC and IBM develop cognitive intelligence solution to digitise global trade - VTT to develop intelligent transport systems in cooperation with ITS Russia - Tiny terahertz laser could be used for imaging, chemical detection - Rohde & Schwarz at DSEI 2017: system solutions for armed forces - Phoenix Contact PCB connectors with new SKEDD direct-to-board technology plug in any position, no tools required - now available through TTI, Inc. - Panasonic introduces the industry's thinnest push-button type switch - Toshiba Memory Corporation Unveils Single Package NVMe™ Client SSD Utilizing 64-Layer, 3D Flash Memory - UltraSoC delivers industry’s first debug and analytics solution for ARM’s AMBA 5 CHI Issue B coherency architecture - Small, Black and Snappy - Intel Unveils Full Intel Core X-series Processor Family Specs; 14- to 18-Core Processors Available Starting in September - Extend Battery Life of USB Type-C™ Devices with Maxim’s Flexible Buck Converter - Toshiba Announces Next Generation Client SSD with 64-Layer 3D Flash Memory - Expanded beam fibre optic cable assembly for connections in the toughest environments - Low Noise Encapsulated Medical Power Supply from Gresham Power Electronic - Printed Organic Photovoltaics: S+L Selbstklebeprodukte and OPVIUS sign co-operation - Reaching Gigabit milestones with Ericsson - Volvo Cars and Geely agree on technology sharing and the formation of LYNK & CO - 57 multiple-unit regional trains from Siemens for Deutsche Bahn - BAE Systems unveils Innovative Multiple-object Tracking Radar for test ranges - Imec Reports Record Conversion Efficiency of 23.9 Percent on a 4cm2 Perovskite/Silicon Solar Module - LG Extends OLED Leadership Expertise from TVs to Mobile Devices with Next Flagship Mobile Device - A furious end of the racing season, a major step forward for eMobility - IKEA helps Homeowners to cut electricity bills by up to 70 percent with new Solar Battery Storage - Intel Kick-Starts Mobileye Integration with Plans to Build Fleet of 100 L4 Autonomous Test Cars - Nokia Bell Labs leads project to develop next generation 5G platform-as-a-service for 5G era - GE Renewable Energy books $100+MM deal for Hydro Pumped Storage Project in Israel - Teledyne e2v sensors will play a vital role in ESA’s FLEX satellite mission to study plant health and stress from space - Acquisition Expected to Accelerate the Future of Autonomous Driving - DENSO licenses Imagination’s newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing - Microsemi Collaboration Enables Mellanox and Other Industry Leaders to Deliver Innovative NVMe-oF Architectures - Power Monitoring and Switching System Unlocks Unutilized Power in Data Centers - NEXT MAJOR SMARTPHONE FROM LG TO FEATURE FIRST-EVER OLED FULLVISION DISPLAY - Intel Further Delivers on Storage Transformation with New SSD Form Factor and Innovative Designs - Renesas Electronics’ R-Car SoC Accelerates Development of In-Vehicle Infotainment Applications with Support of Automotive Grade Linux Platform - Hybrid drones carry heavier payloads for greater distances - Dassault Systèmes Enhances its Marine & Offshore Portfolio on the 3DEXPERIENCE Platform - Full steam ahead for new power plant at Portsmouth Naval Base - Continental awards ROHM Semiconductor ”Supplier of the Year 2016 - Siemens signs framework contract for 100 locomotives with Deutsche Bahn - Mercedes-AMG Petronas Motorsport announces new partnership with NetJets - Harriett Baldwin MP: 'Eurofighter Typhoon is world’s most powerful and reliable swing-role combat aircraft' - Rohde & Schwarz to present monitoring and multiviewer solution at IBC 2017 IP Showcase - TI introduces most affordable way to get started with DLP® Pico™ display technology - Epson Shipping Samples of Six New 16-bit MCUs in the S1C17M2 Series - Belden Introduces Cables to Meet New European Standard for Use in Transportation Industry - New Medical Wall Plug Power Adapters Comply with IEC 60601-1 4th Edition Standards - New space-saving Alpha Wire Micro Coaxial cable makes routing in medical and imaging devices easier – now at Aerco - TE Connectivity Launches DiBO+ Industrial Electric Vehicle Charging Cable Assembly - Latest TE Connectivity Micro Motor Connectors combine power and brake in compact IP67 form factor for harsh industrial applications - now available through TTI, Inc. - AlphaWire’s new ThermoThin Hook-Up Wire delivers outstanding high temperature performance, in an ultra-thin package – now available at Aerco - Microchip Launches Two New SAM Microcontroller Families with Extensive Connectivity Interface Options - NI Announces Industry’s First Remote Control Solution for PXI Systems with Thunderbolt™ 3 - Significant Mid-Year Revision to 2017 IC Market Forecast - Sierraware makes Global Platform compliant Trusted Execution Environment (TEE) available for MIPS-based devices - A new era for Arduino begins today - Mouser-Sponsored Formula E Racing Team Heads to Montreal - Telefónica launches 'out of the box' mobile connectivity for consumer devices with latest Gemalto cloud service - Dassault Systèmes and No Magic Establish Partnership to Boost Systems Engineering Solutions based on the 3DEXPERIENCE Platform - Aalto-1 satellite sends first image - the camera developed by VTT - BMW Group invests €200 million in the future of Plant Leipzig - Osram invests in LiDAR expert LeddarTech Inc. - Nokia to expand development and deployment of 5G FIRST as industry interest grows - Sindelfingen and Pforzheim: New hydrogen filling stations for southwestern Germany - The Solar Car for Everyone – SONO MOTORS Presented the Sion - Skills gap could act as a brake on IoT innovation in the energy sector, finds Inmarsat - Merus Audio Appoints Mark Thomas Director of Sales – North America - Analog Devices Joins University of Michigan’s Mcity Initiative for Advancing Connected and Autonomous Vehicles - Revenue growth driven by industrial applications and power supplies. Growing semiconductor content per vehicle keeps Automotive business buoyant - Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on ARM to Datacenters - Trillium Announces Acquisition of CanBusHack, Inc. - Samsung’s New LTE Modem Technology Supports Industry-First 6CA, Delivering Fast and Seamless Mobile Communication Experiences - Audi driver Lucas di Grassi is Formula E Champion - New-Tech Europe Magazine | July 2017 - Choose the Right Battery Fuel Gauge for Fast Time-to-Market and Maximum Run-Time - reVISION Stack: Accelerating your Embedded Vision development - Testing MIPI interfaces with an oscilloscope - VxWorks 653 Multi-core Edition Update: Why COTS Certification Evidence Matters - NXP and Amazon Web Services Launch Cooperation in IoT - Intel Inside New Audi Autonomous Car System - ABB wins $30 million order to support integration of offshore wind energy in the UK - Value of Semiconductor Industry M&A Deals Slows Dramatically in 1H17 - Arqiva and Samsung Kick off UK’s First 5G Fixed Wireless Access Trial - BAE Systems engineers develop Bluetooth-enabled sensors to detect health of military bridging systems - Boeing and Dassault Systèmes Announce Extended Partnership - A new window will open Toshiba’s Visconti™4 Image Recognition Processor Powers DENSO’s Front-Camera-Based Active Safety System - Bloodhound land speed record project inspires global uptake of STEM subjects and races towards 1000mph with Oracle as new Cloud partner - MAX77650 and MAX77651 with single inductor multi-output regulator and charger are optimized for small Li-ion batteries - Murata’s DC-DC converters feature high isolation for industrial power installations - Gemalto's remote subscription management solution helps Lenovo customers be always connected - Ericsson Garage launches Startup Challenge 2017 - Bosch and Daimler demonstrate driverless parking in real-life traffic: World premiere in the multi-storey car park of the Mercedes Benz Museum - Catherine Estrampes appointed President & CEO of GE Healthcare Europe - NI Announces Multiple Antenna UE Support for Its MIMO Application Framework to Further 5G Research - Molex ValuSeal IP65 Wire-to-Wire Connectors, Now Available at Mouser Electronics - Advantest’s New Massively Parallel Test Fixture Extends the T6391 System’s Capabilities to Include Chip-on-Film Testing of Display Driver ICs - 20V, 20A Monolithic Synchronous Silent Switcher®2 Buck Regulator Reduces EMI & Enables High Power Density Applications - Infineon introduces packaged MEMS microphones with a 70 dB signal-to-noise ratio - Maxim's Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications - OptiMOS™ Linear FET combines a low RDS(on) with a large Safe Operating Area - VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications - Largest European innovation platform brings the best mobility startups to the automotive hub of Stuttgart - Mouser Signs Global Distribution Deal with InvenSense, Bolsters MEMS Sensor Selection - ASSCON’s new vapor phase soldering representative in Austria — Vienna-based Stepan GmbH now provides support and sales - Nexperia supports Engineers of the Future with sponsorship of University Robotics & AI team - BAE Systems expands teaming in Italy for highly mobile armored vehicle - Hitachi Automotive Systems' ADAS ECU Used in Nissan Motor's Partially Redesigned X-Trail - Hitachi Automotive Systems' Lightweight, Compact and Highly Reliable Lithium-Ion Battery Module has been Chosen for Suzuki's New "Swift" Vehicles with Hybrid Technology - Mavenir, the leader in accelerating and redefining network transformation for Service Providers, announces a new R&D and 5G Innovation centre of excellence in Ra'anana, Israel focused on 5G Network and Services solutions - Nauto Raises $159M Series B Led by SoftBank and Greylock Partners - TTI achieves top marks in TDK's European Distribution Awards - ABB acquires KEYMILE’s Communication Networks Business - 3D imaging of surface chemistry in confinement - Intel Democratizes Deep Learning Application Development with Launch of Movidius Neural Compute Stick - Rohde & Schwarz and MediaTek present world’s first test solution for A-BeiDou location based services (LBS) - NAO sets out to conquer new markets with the Zora solution - STMicroelectronics Completes Deployment of Low-Layer Software for All STM32 MCUs - Paragon Software Releases NTFS USB Plugin for Android TV - 105V, 2.3A Synchronous Step-Down Regulator Delivers 96% Efficiency with Ultralow EMI/EMC Emissions - The new and inexpensive 2.5 A appliance inlet of the type 2570 in various versions - Plessey extends LED portfolio with high performance MIDION™ mid-power LEDs Targeting all general lighting applications - Highly Integrated 36V Buck Battery Charger Provides Seamless Backup Power - AMBER wireless integrates bonding function in its AMB2621 Bluetooth Smart Module - TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support - ams launches smallest available XYZ tri-stimulus sensor for True Color consumer applications - STMicroelectronics’ ESD-Clamping Diodes in 0201 Package Bring Industry-Best Performance Protection to Tiny Smart Objects - Eight19 secures £1.3m funding - Meet Louis Vuitton’s luxury smartwatch for tech-savvy travelers, powered by Snapdragon Wear - BCD Microelectronics LTd. is now called BCD-Atlantik Ltd. - Grant awarded to launch UK's first maritime autonomous systems testing service - Murata partners with STMicro to add SigFox connectivity to its LoRaWAN module enabling “Best of Both Worlds” capability - Silicon Labs’ Bluetooth Mesh Solution Helps IoT Developers Cut Time to Market by Six Months - Chelsea Football Club appoints Ericsson as Connected Venue Partner - Cratus Leverages Thinfilm’s NFC Technology to Deliver IoT-Focused Supply Chain Solution - Mouser Electronics Wins TDK's European Distribution Award - Rohde & Schwarz ATC voice over IP communications systems selected by NATS for London City Airport Digital Tower - 2H17 DRAM, NAND ASP Growth to Cool, But Yearly Growth Strong - Samsung Increases Production of Industry’s Fastest DRAM ─ 8GB HBM2, to Address Rapidly Growing Market Demand - Murata receives two Bosch “Partners In Success” Global Supplier Awards for 2017 - MOST150 Technology to Control the Infotainment System on Volvo Cars’ Second-Generation XC60 SUV - Launch of First Croatian Point of Presence Marks Hurricane Electric’s Latest Move in European Expansion - Finding leaks while they’re easy to fix - Ultra-high-contrast digital sensing - Honored for outstanding quality: Infineon receives Bosch Global Supplier Award - Rohde & Schwarz storage solution brings more efficiency to Swiss technology service provider tpc - Intel Joins New Lab to Help Build the Future - Samsung Debuts World’s First Cinema LED Display - Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project - Semi Content in Electronic Systems Forecast to Set New Record in 2017 - New £60 million automotive facility to propel UK jobs and investment - New Siemens technology to enhance mobile signal reception in the Rhein-Ruhr Express - Emmanuel Ligner named President and CEO of GE Healthcare Life Sciences - Providing Electronic Warfare suite for U.S. Special Operations Command C-130s - Wearable device reveals consumer emotions - Audi is researching the use of time in the robot car - Create More Reliable and Cost-Effective LED Lighting Applications with Microchip’s Sequential Linear LED Driver - Intersil Ships Automotive Industry’s First Full HD LCD Video Processor - RS Components adds new RJ45 industrial connector solutions to extensive Phoenix Contact portfolio - Industry’s Lowest Power Zero-Drift Op Amp Consumes only 1.3μA - Toshiba Memory Corporation Develops World's First 3D Flash Memory with TSV Technology - maXTouch added to SCHURTER portfolio - 36V, 2A Monolithic Synchronous Step-Down LED Driver with Silent Switcher Topology Minimizes EMI Concerns - TE Connectivity’s Micro Motor Connectors for Servo Motors Answer Calls for More Compact, Cost-Effective and Reliable Solutions - Wurth Electronics Midcom Introduces New LLC Resonant Half-Bridge Series - EconoPIM™ 3 with increased current rating of 150 A - Suspension of Inotera’s Fab Disrupts DRAM Market; TrendForce Forecasts 5.5% Reduction in Global Production Capacity in July and Further Price Increases - Avnet Abacus Extends Distribution Agreement with Panasonic to Include Wireless Technologies for Internet of Things Development - Panasonic Completes Acquisition of Additional Shares of Ficosa, a Global Tier 1 Automotive Parts & Systems Supplier - ams wins Innovation Gold Award at Sensors Expo for its single wire communication interface - CPI Selected to Support FLEXTRANS Success - Growing Demand Drives TactoTek Expansion - Imec demonstrates Electrically Functional 5nm Solution for Back-End-of-Line - Nano Dimension Successfully Completes Recruiting New Applicants to its Beta Program - Intel Unveils Powerful Intel Xeon Scalable Processors, Bringing Next-Generation Business and Consumer Experiences to Life - Rohde & Schwarz equips the German Federal Armed Forces with state-of-the-art software defined radio systems - Siemens and AES join forces to create Fluence, a new global energy storage technology company - ASU engineer receives NSF early-career award for work that may someday put your phone not in your pocket but on your sleeve - IBM and Citizen-Scientists Poised to Contribute Equivalent of up to $200 Million for Climate & Environmental Research - First battery-free cellphone makes calls by harvesting ambient power - New Ruggedized Capacitor from New Yorker Electronics is Designed for Long Life in Harsh Conditions - Using chip memory more efficiently - Siemens partners with Singapore to establish its first fully-integrated Digitalization Hub - Ralf Steinmetz Joins Eleven Engineering as Sales Rep - Europe - RS Components teams up with ‘Kids Invent Stuff’ supporting engagement of young children in invention and engineering - Mercedes-Benz Vans: milestone in key technology: Mercedes-Benz Düsseldorf plant to become competence centre for Sprinter with electric drive - Advanced Energy Acquires Excelsys Technologies,Strengtheing its Spesialty power portolio - TTI, Inc. Acquires Symmetry Electronics - Small Beacons, big Impact - Why Lufthansa Industry Solutions relies on BLE-Beacon technology from ecom‏ - Industry’s First CAN Flexible Data-rate and CAN Partial Networking Transceiver Family Including Automotive Grade 0 Qualified Parts - Lattice Semiconductor Delivers New Machine Learning and Sensor-to-Cloud Security Solutions for Intelligence at the Edge - New high-performance sensor interface solution from ams enables medical, industrial and security CT scanners to render sharper and more detailed images - 3 W Isolated Dc-Dc Converter Series Delivers 4:1 Input Range in Compact, SMT Package - SONY Launches Highly Sensitive 4/3" CMOS Sensor for 4K Surveillance - ams extends magnetic position sensors portfolio with automotive-grade and ISO26262 safety-compliant dual die integrated circuits - 42V, 2A/3A Peak (IOUT), Synchronous Step-Down Silent Switcher® 2 Delivers 93% Efficiency at 2MHz & Ultralow EMI/EMC Emissions - TE Connectivity HDC Thermoplastic Locking Levers Significantly Reduce Cost for Industrial Applications - Internet of Things (IoT) Integration Market worth 3,301.7 Million USD by 2022 - Mouser Electronics Named e-Commerce Distributor of the Year, Europe, by Vishay Intertechnology - Intelsat and Gilat Unveil Mobile Reach Solar 3G Solution for Mobile Network Operators that Need to Expand in Remote Areas - Nokia and Xiaomi sign business cooperation and patent agreements - OLAF helps partners seize over one million counterfeit semiconductors in major Joint Customs Operation - NXP and Widex Bring Industry’s Most Power-efficient, Wireless Audio Streaming Hearing Aids to Marke - Clarke Energy Deploys GE’s myPlant* Asset Performance Management Solution on More than 170 Jenbacher Gas Engines in France - Daimler builds battery factory in Beijing - New 3-D chip combines computing and data storage Advance points toward new generation of computers for coming superstorm of data. - Volvo Cars to go all electric - THE FUNDAMENTALS OF SECURE BOOT AND SECURE DOWNLOAD: HOW TO PROTECT FIRMWARE AND DATA WITHIN EMBEDDED DEVICES - He Who Goes First...Loses - Autonomous Is the New Mobile: Linley on Cars - SMART HEALTH - DIAGNOSTICS Photonics-on-chip allows doctors to dream of ultra-small spectrometers, cytometers and microscopes - Copper vs. Fiber: Which Cable Do You Need? - ZDF relies on Rohde & Schwarz and the Fraunhofer HHI for the transition to DVB-T2 - Samsung Electronics Begins Mass Production at New Semiconductor Plant in Pyeongtaek, South Korea - Ecosystem for Optimizing Energy Efficiency in Factory Production Systems - Measuring Ultra-Low Power in Wireless Sensor Node Applications Using the Digit Graphical Sampling Multimeter - 60GHz technology opens door to WiGig® and 5G applications - Simplifying Sub-GHz IoT - Taking the Risk Out of SW-Driven Networking SoCs - Next-gen MCUs enable better design techniques, add functionality and use less power - 5G - It’s Not Here Yet, but Closer Than You Think The race to define 5G may be ending, but the process to design and deploy 5G technology is just beginning - Stack based solutions for image processing at the Edge and Cloud - A Perspective on the Definition of Value in the RF Supply Chain - Hardware-based trust provides key to IoT security - German Federal President’s first official visit to Baden-Württemberg: President Steinmeier at the Mercedes-Benz Rastatt plant - Manufacturing contract for Type 26 Global Combat Ship awarded to BAE Systems - Siemens and FC Bayern Munich forge global partnership - Rohde & Schwarz Test and Measurement Division under new leadership - UK Power facility upgraded to meet increased demand and enhance regional offering - ARIANE 5 LAUNCH PROVES RELIABILITY AND FLIES NEW FAIRING - Cypress and Arrow Electronic Announce IoT Development Platform Designed to Bring World-Class Wireless Connectivity to a Broad Range of Applications - NXP Brings Better Fan Experience to 2017 FIFA Confederations Cup with Secure Contactless Ticketing and Communication - Honeywell Powers First Connected Helicopter Flight Around The World - LG TO SUPPLY NEXT GENERATION ADAS CAMERAS TO PREMIUM GERMAN AUTOMAKER - ON Semiconductor And PowerSphyr Announce Agreement To Accelerate Development Of Universally Compatible Wireless Power Solution - LETI AND FRAUNHOFER TEAM UP TO STRENGTHEN MICROELECTRONICS INNOVATION IN FRANCE AND GERMANY - Picosun’s ALD solutions enable novel high-speed memories - Litigation Against Western Digital Corporation - Informational and educational activities about passive components - Nonstop CMOS Image Sensor Sales Records Seen Through 2021 - Nation’s flagship takes to sea for the first time - Mobike and Gemalto collaborate to bring IoT connectivity to bike-sharing services beyond China - SES and MDA Announce First Satellite Life Extension Agreement - UltraSoC announces industry’s first processor trace support for RISC-V - LG Display Unveils World’s First 77-inch Flexible and Transparent OLED Display - Samsung Begins Mass Production of First Exynos-branded IoT Solution, the Exynos i T200 - VTT's miniature hyperspectral camera launched to space in Aalto-1 satellite - Autotalks Extends Round D to $40 Million with the Inclusion of the Mirai Creation Investment Fund, Toyota’s Investment Arm - Samsung Introduces Image Sensor Brand ‘ISOCELL’ at 2017 MWC Shanghai - Munich-Allach plant wins order for 500th electric Vectron locomotive - 20V, 4MHz, Synchronous Dual 6A Step-Down Regulator in a Compact 4mm x 5mm QFN - STMicroelectronics Launches Robust USB Type-C™ Controllers with Internal Protection to Save Space and Enhance Operation Safety - TI GaN power design drives 200-V AC servo drives and robotics with 99-percent efficiency - New High-Performance Low-Power Turnkey Pedometer Solution with Embedded Functionality - Infineon simplifies speed measuring sensor designs with TLE4922 sensor and “Speed Sensor 2Go” kit - New MCU software eliminates an FPGA to achieve a sub-1 microsecond current loop in industrial systems - New high-performance sensor interface solution from ams enables medical, industrial and security CT scanners to render sharper and more detailed images - Intel Takes Another Major Step in Memory Leadership - Analog Devices’ Versatile 50 Mbps RS-485 Transceiver Series Protects Communication in Harsh Environments - Qualcomm Announces Advanced Fingerprint Scanning and Authentication Technology - Nokia and Infracapital to bring high-speed fiber broadband service to underserved regions of Poland - GE awarded technology order for South Eastern Europe’s largest gas project in five years - ARM CEO Simon Segars Joins SoftBank Group Board of Directors - BAE Systems graduate named one of the UK's top 50 women engineers - Dassault Systèmes and Airbus APWorks Collaborate to Advance the Use of Additive Manufacturing for Serial Production - Nokia and Infracapital to bring high-speed fiber broadband service to underserved regions of Poland - The future of coastal water boating is solar electric - DuPont and TactoTek Collaborate to Support Growing In-Mold Electronics Market - Five new MIL-COTS parts help simplify designs and optimize SWaP-C attributes - Alliance Memory Introduces New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs; Provides New Memory Chip Source in Face of Market Shortages - ROHM and A*STAR’S IME To Develop Artificial Intelligence Chip For Predictive Maintenance In Smart Factories - 72V Fixed-Ratio DC/DC Controller Eliminates Power Inductor & Delivers 500W in Non-Isolated Intermediate Bus Converter Applications - 60V Low IQ Synchronous Step-Down Controller Operates at Up to 2.25MHz for High Power Density - Broadcom Delivers High Performance Data Plane Programmability with new Trident 3 Generation of 10/25/100G Ethernet Switches - Latest PIC32 family increases performance while reducing power consumption - Ericsson’s award-winning advanced bus converter upgraded to include burst-mode capability for peak power demand - 750mA, 42VIN Synchronous Step-Down DC/DC Converter Delivers 93% Efficiency at 2MHz from a 2mm x 2mm DFN Package - Wind River Teaming with Nation’s Largest Transportation Proving Grounds, Ohio State University, and Central Ohio Region to Develop, Test Smart Connected and Autonomous Technologies - Bosch plans €1 billion investment in German chip production - Melexis announces availability of highly integrated Time-of-Flight 3D vision solution - GE Renewable Energy and Fina Enerji Sign Ten-year Full Service Agreement in Turkey - Samsung Achieves 220 Lumens per Watt with New Mid-Power LED Package - Air Pollution Monitoring Solution by Intel and Bosch Provides Intelligent Data to Help Manage Air Quality - 7 of the Top 10 Smartphone Suppliers Headquartered in China - Würth Elektronik eiSos hosts customers and partners at the Formula E event in Berlin - Airbus signs strategic partnership with ONERA and DLR - Nokia Bell Labs first to show use of ultra-low latency 10G PON for mobile fronthaul - Infineon extends industry-leading smart power switches with PROFET™+2 and High Current PROFET™ for improved energy efficiency and miniaturization - LETI SIGMAFUSIONTM SOLUTION FOR AUTONOMOUS VEHICLES EMBEDDED IN AURIXTM PLATFORM OF INFINEON - First Intel Core X-Series Processors Pre-Orders Begin, Available Starting June 26 - GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family - Cellphone IC Sales Will Top Total Personal Computing in 2017 - Infineon receives “Supplier of the Year Award” from DENSO - How Wearable Health Technology is Changing the Face of Healthcare - INTERCONNECT DESIGN CONSIDERATIONS FOR INDUSTRIAL APPLICATIONS - Making the Impossible Possible and the Common Easy - Let the Past Show You the Way to the Future - Vision C5 DSP for Standalone Neural Network Processing - Industry in Transition: Enabling the Trusted Digital Enterprise - Going batteryless: How to create the next generation of industrial and IoT devices - Analog Devices Reaches LTC Integration Milestone; Announces Senior Executive Team - Samsung Ramps up 64-Layer V-NAND Memory Production to Accommodate Expanding Line-up of High-Performance Flash Storage Solutions - Fascination awakened for future technology: E-mobility - Maxim’s Automotive LED Controller Eliminates Trade-Off Between Fast Response Time and Low EMI for Exterior Lighting and Improved Safety Applications - One Company’s Vision for Electric Trucks, Delivery Drones — and a Hybrid Flying Car - High power density discrete IGBT in TO-247PLUS package - Surface-Mount Intelligent Low-Power Modules from STMicroelectronics Save Space in Energy-Efficient Motor Drives - 2.7V to 38V/500mA Low Noise Buck-Boost Charge Pump Saves Space and Reduces EMI - Vishay Intertechnology IR Receivers in TVCastSMD Package Offer High Remote Control Performance for Flat-Panel TVs and Monitors - TE Connectivity Introduces D-3000 First Mate Last Break Dynamic Series Connector - New Line of Compact, Encapsulated Ac-Dc Power Supplies Ranging From 6 W to 20 W - Microchip extends eXtreme Low Power PIC32MM microcontroller family - Wireless Gecko SoC Portfolio Supports Full Bluetooth 5 Connectivity and Expands Memory Options - IKEA to learn from space journey to Mars - Ultra-fast optical data transfer using solitons on a photonic chip - European mobile operators brace for end of roaming charges - Finland has the world’s most energy-saving supermarket – half of the energy it consumes is solar in origin - Leti Announces Two New Tools for Improving Transportation Comfort, Safety and Efficiency - GE Unveils New Advanced Applications, Edge to Cloud Analytics and Robotics to Advance Digital Industrial Transformation for Customers - Growing demand for precision weapons prompts order for additional BAE Systems laser-guided rockets - New system allows optical “deep learning” - Imec World-First to Develop 200V and 650V dispersion free normally-off/e-mode Power Devices on 200mm/8-inch Si Wafers - ARM, Enea, Marvell and PicoCluster announce world’s most compact OPNFV Pharos Lab - Microsemi Unveils Industry’s Lowest Power Cost-Optimized FPGA Product Family for Access Networks, Wireless Infrastructure, Defense and Industry 4.0 Markets - Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology - Rohde & Schwarz forges new paths in the monitoring of the battery life of wireless devices - Cypress 802.11ac Wireless Connectivity Solution Enables Robust Multiplayer User Experience for Nintendo Switch™ - New Wireless Gecko SoCs Help Developers Tackle Multiprotocol IoT Design Challenges - Raspberry Pi Selects Cypress’ Wireless Connectivity Solution for Industry-Leading IoT Boards - BeagleBone Black Wireless computer board now available from RS Components - Linear Technology Demonstrates Breakthrough Wireless Battery Management System in BMW i3 at Hannover Messe - Microchip Unveils the SAM R30 System in Package for Wirelessly Connected Designs - Analog Devices’ MEMS Accelerometers Provide Low Power Vibration Measurements, Enabling Wireless Condition Monitoring - NI Lowers Cost of Wireless Device Production Test With Updates to the Wireless Test System - Analog Devices Lays Foundation for 4G to 5G Migration with Expanded RadioVerse™ Wireless Technology and Design Ecosystem - Liquid tin-sulfur compound shows thermoelectric potential - Start of production at the Mercedes-Benz plant in Kassel: The first intelligent truck axle - QTC force sensors in gaming mouse give a more precise, intuitive HMI experience - Redefining the Game: Samsung Introduces First HDR QLED Gaming Monitors - Maxim’s Dual IO-Link® Master Transceiver Ensures Robust Communications with 50% Lower Power for Industry 4.0 Applications - New Multipath Fading Simulator for Satellite Link Emulator IZT C3040 with precise and flexible simulation of signal reflections in satellite and terrestrial networks - Power-Blox uses swarm power to create intelligent autonomous energy grids - Belden Compliant with Mandatory New EU Radio Equipment Directive - Rohde & Schwarz will present its cutting-edge portfolio at the 2017 Paris Air Show - ON Semiconductor Wins Innovation for Supply Chain Award from Global Smartphone Leader vivo - New concept Hawk demonstrator aircraft takes to the skies - Preventing cyber-attacks in rescue services: security ‘made in Germany’ protects respirator - Samsung Electronics and Celeno Collaborate to Power New Gateways and Set-Top Boxes - ‘SnotBots’ and Intel AI Technology Part of Mission to Save the World’s Oceans - Rohde & Schwarz and Analog Devices reinforce their long-term relationship - NOKIA and Skyguide modernize the mission-critical network supporting Switzerland's air traffic control system - Tektronix Breaks Innovation Barrier AGAIN By Redefining Mid-Range Oscilloscopes - Cypress Enables USB-C Proliferation in Notebook and Desktop PCs with Market’s First Two-port USB-C Controller with Thunderbolt™ 3 Support - 150V Fast High Side Protected N-Channel MOSFET Driver Provides 100% Duty Cycle Capability - Long-Term Internet of Things Semiconductor Forecast Reduced - Analog Devices and X-Microwave Simplify RF, Microwave and Millimeter-wave Design and Evaluation - New Cool-Power ZVS Buck Regulator extends Vicor’s 48V Direct to point of Load product family - Wurth Electronics Midcom Introduces New Low-Profile Gate Drive Transformers - G+D Mobile Security, Murata, and STMicroelectronics Bring Flexible and Efficient Security Solutions to a Wide Range of IoT Devices - Marvell Introduces Industry’s First 2.5 and 5 Gbps Octal Ethernet Transceiver - New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communication - ON Semiconductor Improves Imaging Performance for High Resolution Industrial Applications - Engineers design drones that can stay aloft for five days - Intel Predicts Autonomous Driving Will Spur New ‘Passenger Economy’ Worth $7 Trillion - Qualcomm Announces Flagship Companies to Build Windows 10 PCs Powered by Snapdragon - Samsung Galaxy S8 / Galaxy S8+ Becomes World's First Mobile Phones Certified to ANSI/UL 110, Standard for Sustainability for Mobile Phones - Nokia announces first mixed reality livestream of neurosurgical procedure with Helsinki University Hospital using OZO Live - Hitachi reaches 1,260 m/min, the World's Fastest*1 Speed with Ultra-High-Speed Elevator - Finnish 5G test networks are piloting the digital business and service models of the future - Extracting Insight from the Data Deluge Is a Hard-to-Do Must-Do - Harwin launches SYCAMORE Contact; ultra-reliable, durable three-point SMT contact for high volume, advanced automated assembly - TransformTECH, a joint executive education program from EPFL and IMD - MOVINT moves in to the GXP suite - NI Announces Baseband Model of Second-Generation Vector Signal Transceiver to Address the Most Demanding Transceiver Test Applications - New-Tech Europe Magazine | June 2017 - Controlling graphics without a controller - Security and Reliability Design for SSD in IoT Era - DEVICE MANAGEMENT IN THE INTERNET OF THINGS - Why It Matters and How to Achieve It - Innovation in cellular communications: making smart meters even smarter - Power plants could cut a third of their emissions by using solar energy - New-Tech Europe Magazine | May 2017 edition - RS Components supports University of Edinburgh Hyperloop team in SpaceX Pod Competition - PragmatIC Named Future Planet ‘Company of the Year’ - NVIDIA Launches Revolutionary Volta GPU Platform, Fueling Next Era of AI and High Performance Computing - Plessey CEO mentors University of Plymouth student as part of Tamar Engineering Project - Envision a World with Thunderbolt 3 Everywhere - VTT participates in developing new 5G technology and business opportunities based on smart light pole networks - Half of firms expect AI to transform their industry - NXP Secures Electronic ID Cards and Passports in Ecuador - Graphene and Quantum Dots put in motion a CMOS-integrated camera that can see the invisible - Minima Processor has collected already 5,5 million Euros with two‐stage seed funding - Sci-Tech Daresbury and IBM Research Collaborative Campus at Hartree Centre Receives Royal Seal of Approval - EDA pioneer Alberto Sangiovanni-Vincentelli joins UltraSoC advisory board - New Intel Core X-Series Processors: Scale, Accessibility and Performance Go Extreme - Compact, Lightweight Industrial Hardware - Microchip introduces the industry’s first MCU with integrated 2D GPU and DDR2 memory for groundbreaking graphics capabilities - CUI Further Expands Thermal Management Portfolio with New Line of Heat Sinks - Microsemi Delivers AcuEdge Development Kit for Amazon Alexa Voice Service - Rohde & Schwarz introduces high-end analog RF and microwave signal generator with industry-leading phase noise performance and highest output power - Renesas Electronics Delivers R9J02G012 Controller That Enables Device-to-Device Authentication in Support of Safer USB Power Delivery Ecosystem - NXP Turns up the Volume with Industry’s First 12-Volt Smart Amplifier to Deliver Rich, Elevated Sound in Mobile and Portable Devices - ams broadens smart lighting management offerings with standalone solution for color stability and lumen maintenance - TI enables the widest bandwidth and lowest phase noise for next-generation high-speed systems - Cypress Streamlines the Design of Next-Generation USB-C Power Adapters and Chargers with New, Highly-Integrated Controller - Imec Presents Highly Accurate Model for Energy Yield Prediction of Photovoltaic Modules - “Billion Dollar Capex Club” Forecast to Swell to 15 Companies in 2017 - Climeworks Makes History With World-First Commercial CO2 Capture Plant - BMW Group launches BMW CarData: new and innovative services for customers, safely and transparently - ADI Co-founder and Chairman Ray Stata Accepts IEEE Award Recognizing Analog Devices for Innovation and Industry Leadership - Silicon Labs Wins Prestigious Somfy Supplier Innovation Award - Strategic partnership between TDK-Micronas and CGS facilitates new Hall sensor production line programmer - UltraSoC attracts fresh investment as technology industry recognizes huge potential for embedded intelligence - Britain installs world’s biggest wind turbines near Liverpool - Analog Devices’ CEO Vincent Roche to Deliver Keynote at Symposium Launching SENSE.nano Center of Excellence at MIT’s Nanotechnology and Nanoscience Research Center - Rohde & Schwarz acquires Motama technology - ams to expand manufacturing in Singapore to meet growing demand for leading edge sensor solutions - Daimler lays foundation for one of the biggest and most modern battery factories in the world - TI introduces the industry's smallest gate driver and power MOSFET solution for motor control - Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs - Tektronix Raises the Standard for Isolated Measurements Tektronix Enhances its IsoVu Portfolio by Offering Products with a Large Differential Voltage Range and High Input Impedance - Microchip’s Wi-Fi® SDK with Apple HomeKit Support Now Available - Teledyne e2v delivers first space-grade commercial processors to Thales Alenia Space for use in a European satellite mission - Ultra-Wideband 3GHz to 20GHz Mixer with Integrated LO Buffer Offers 23.9dBm IIP3 in a Tiny 3mm x 2mm Package - Harwin extends 1.25mm micro signal high-reliability connector range - Analog Devices’ Small Isolated Gate Drivers Deliver Solutions for Next Generation Power Switch Technology - 18-Year-Old Engineer Constructs Fuel-Efficient, Stable ‘Flying Wing’ Aircraft Prototype - Renault reinforces its development in connected vehicles, with the planned acquisition of Intel's French embedded software R&D activity - Siemens Opera Contest chooses first winner in France - Software developed at EPFL used to control a flotilla of satellites - TI unveils the world's most precise single-chip millimeter wave sensor portfolio available today - Battery-free implantable medical device draws energy directly from human body - Strategic partnership between TDK-Micronas and CGS facilitates new Hall sensor production line programmer - 2017 Automotive IC Market on Pace for Record Year - SK Telecom and Samsung Win “Infrastructure Innovation Award” at Global Telecoms Business(GTB) Telecoms Innovation Summit - Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles - Intel and Honeywell Collaborate to Make the Shipping and Logistics Industry Smarter - Check-Cap and GE Healthcare Achieve Development Milestone in High-volume X-Ray Capsule Manufacturing Collaboration - Forestalia Selects GE Renewable Energy to Provide 1,200 MW of Wind Power in the Largest European Auction to Date - Microelectronics for connected production: Infineon launches “Productive4.0” research project in Dresden - ON Semiconductor’s Board Elects Alan Campbell as Chairman of the Board - Karamba Security Closes $12 Million Series B Funding To Accelerate Growth in Autonomous Vehicle Security Market - ON Semiconductor's Advanced Synchronous Rectifier Controller Brings Best-In-Class Simplicity, Reliability and Efficiency to LLC-based Power Supply Designs - Littelfuse Introduces Surface Mount PPTC Devices to Prevent Charging Cables from Overheating - Bel Power Solutions Introduces First-Ever AC-DC Power Supply Using Transphorm GaN FETs - PCIM 2017: ROHM Unveils Its 3rd Generation of IGBT - XP Power delivers wide input 6W and 8W DC-DC Converters in an ultra-compact DIP-16 package - Wurth Electronics Midcom Transformers Approved for Use with SHDSL- 1 Channel, 2 Channel, and 4 Channel Applications - Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard - Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection - Gemalto empowers smartphone-based digital vehicle key Securely lock/unlock and start your car using your smartphone - Celebrating 60-Year Commitment to Enabling Space Missions, Microsemi Continues to Provide Customers Innovative Solutions for Growing Space Market - Teledyne e2v sensors to enable the world’s largest telescope in search for exoplanets and to study far distant galaxies - Cypress Expands Long-term Collaboration with Bosch Automotive into Next Generation ADAS Platforms with High-reliability NOR Flash Memories - Maxim’s Himalaya Step-Down DC-DC Converters Enable Rapid Compliance of Safety Standards for Industrial Applications MAX17572 and MAX17574 reduce power dissipation by 40% and solution size by 50% - GE Expands Board-Level Power Conversion Capabilities with Next-Generation DLynx* II Digital, Non-Isolated DC-DC Voltage Converters - European collaboration on Internet of Things - BMW Group, Intel and Mobileye Announce Delphi as a Development Partner and System Integrator for their Autonomous Driving Platform - Samsung Accelerates the Next Generation of IoT with New and Advanced SAMSUNG ARTIK™ Platform Products for Interoperability, Enhanced Security, and Connected Services - VTT's autonomous cars take to public roads and start communicating with each other - Nokia, Finnish State Security Networks Group and Telia Finland trial prioritization of public safety traffic over LTE networks - Tektronix Offers Industry's Fastest Compliance Testing Across All Data Rates for DisplayPort 1.4, Type-C and New HBR3 Automated Transmitter Test Lowers Test Times to Under 7 hours for Data Rates up to HBR2 and Under 11 hours for HBR3 - 1200V SiC Schottky Diodes from Littelfuse Are First Products from New Platform, Offer Lower Switching Losses, Higher Efficiency - New PIC32 Family of 32-Bit Microcontrollers Optimized for Motor Control and General Purpose Applications - 1st Intel Extreme Masters in Australia Draws 8 Million Viewers - Intel Shows 1.59x Performance Improvement in Upcoming Intel Xeon Processor Scalable Famil - GE Supports Power Grids of the Future with Europe’s First MVDC Link - Sensor/Actuator Sales Take Off As Price Erosion Eases - Sensors from TT Electronics offer accuracy and longevity for critical applications - Würth Elektronik eiSos expands its terminal series with REDCUBE PLUG for currents up to 120 A - 300 W Medical Ac-Dc Power Supply Series Complies with 4th Edition EMC Standards - Intersil Introduces Smallest Footprint and Highest Efficiency PMIC for Application Processors, GPUs, FPGAs and System Power - Infineon starts volume production of first full-SiC-module, announces additional devices for its CoolSiC™ family at PCIM - Intel is Inventing the Future at the Bay Area Maker Faire - IBM names Bill Kelleher as Chief Executive of IBM in the UK & Ireland - New ams Foundry Ecosystem provides solutions for ASIC design service, testing and fabrication - STMicroelectronics’ New MDmesh™ MOSFETs with Fast-Recovery Diode Enhance Power Density of High-Efficiency Converters - 1000 km range thanks to a new battery concept - Microsoft Outlines Hardware Architecture for Deep Learning on Intel FPGAs - Vicor Expands High Voltage Bus Converter Family with New K=1/16, 384VDC – 24VDC in a ChiP Package - Rohde & Schwarz oscilloscopes with integrated generator facilitate debugging and deliver automated compliance test - Printing bricks from moondust using the sun's heat - Imagination announces first PowerVR Series8XT IP core based on new Furian GPU architecture - Leti announces EU "New Deal" Project to create nanotherapy that specifically targets inflammatory bowel diseases - NXP Introduces RAIN RFID Solutions with Higher Security for Emerging Inventory Management and Smart City Applications - Intel at AUVSI XPONENTIAL 2017: Intel Takes Flight with New Capabilities and Solution - Making 3-D printing as simple as printing on paper - Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking - Heat-resistant capacitors: Stability at up to 300 degrees - Allegro MicroSystems, LLC Announces New High Current Integrated DC Motor Driver IC - Vicor Expands High Voltage Bus Converter Family with New K=1/16, 384VDC-24VDC in a ChiP Package - Toshiba Adds 60V and 100V Products to High Current Photorelays with S-VSON4, the Industry's Smallest Packag - STMicroelectronics Delivers New STM32L4 MCUs with On-Chip Digital Filter, Supported by Extended Development Ecosystem - Rohde & Schwarz provides quick and easy DVB-S2 and DVB-S2X satellite transmission tests - IBM Inventors Patent Invention for Transferring Packages between Aerial Drones - X-FAB and Exagan Successfully Produce First GaN-on-Silicon Devices on 200-mm Wafers - BMW Group and Hamburg announce strategic partnership to provide electro-mobility options all across the city of Hamburg - PragmatIC to establish billion-unit production capacity - Ficosa and Idneo select 10 start-ups to present projects at Automobile Barcelona - Polluted air can generate power - One-man operated video capturing solution from AZilPix captures live events from all angles – in broadcast quality and at reduced cost - Xilinx Spartan-7 FPGAs Now in Production - Ericsson introduces Dynamic Orchestration - Nokia joins 'Smart Tampere' initiative to help bring smart city services to one of Finland's largest municipalities - Advantest Europe and Nash Technologies Develop Long-term Partnership for Application Engineering Services - Ericsson introduces duo of isolated eighth-brick DC/DC converters delivering world-leading efficiency - Qualcomm Snapdragon 660 and 630 Mobile Platforms Drive Advanced Photography, Enhanced Gaming, Integrated Connectivity and Machine Learning - Oracle Announces EU Region Expansion in Germany - EUROCONTROL integrates Rohde & Schwarz ATC direction finding technology into its deployment of an advanced safety technology system - Finland's first 5G development environment opens to businesses - New-Tech Europe | April 2017 | Digital Edition - Microsemi and Synopsys Extend 20-Year OEM Relationship and Collaborate on New PolarFire FPGAs to Deliver Customized Synthesis Support - Moon rover Audi lunar quattro featured in “Alien: Covenant” - Microsoft Announces New Surface Laptop – Powered by 7th Gen Intel Core - Samsung Pay Continues Rapid Global Growth with Four Market Expansions - An incredible solution to one of the most immediate world challenges - Small, Fast, Ready for Design-In: Latest 2nd Gen SONY CMOS GS Sensors Accelerate Machine Vision - New family of maXTouch® touchscreen controllers designed for large-screen automotive HMI designs - High Gain Wideband RF Power Amplifier ICs - For More Robust Mounting - ON Semiconductor’s Python 2000 and 5000 Sensors, Now With LGA Packages - Low Power Open Frame Ac-Dc Power Supplies Housed in Compact, Board Mount Package - STMicroelectronics Works with Hilscher to Provide Scalable Multi-Protocol Industrial Ethernet Platform - Intel Launches Cloud-Inspired 3D NAND SSDs for Data Centers - Analog Devices’ Wideband RF Synthesizers Feature System Size Reduction, Design Versatility, and Excellent Performance to 13.6 GHz - Teledyne e2v launches new OctoPlus line scan cameras for Optical Coherence Tomography - Soft sensors for smart textiles - Wireless power could enable ingestible electronics - Open Access Pilot Line for Hybrid Printed Electronics - Two's company when it comes to 3D mapping - X-ray vision for crash tests - Siemens to acquire a leading software provider for public transportation, mobility and logistics - Hitachi Enters the Lift Market in Europe with acquisition of UK-based Temple Lifts - NXP Acquires Freescale, Becomes Top MCU Supplier in 2016 - BMW Group relying on innovation capabilities of German production locations for electro-mobility expansion - Samsung Poised to Become World’s Largest Semi Supplier in 2Q17 - Google’s Project Sunroof expands to 7 million homes in Germany - Nokia Home Analytics enables Swiss service provider to deliver a superior home Wi-Fi customer experience - Lilium celebrates successful flight tests and introduces 5-seater VTOL jet - Remote sensing performed by flying robots - Thinfilm Readies for Industrial IoT Market Through Key Partnerships with Socket Mobile, Famoco, and SpringCard - Siemens signs agreements with Uganda and Sudan - Intel Unveils Latest Autonomous Driving Lab in Silicon Valley - Above-average seasonal revenue growth and higher earnings driven by strong demand in Automotive, Industrial and Power Supply - BAE Systems teams with Czech Republic’s Ray Service to support Swedish Mjölner Mortar Program - Ultrahaptics Announces B Round Investment of £17.9M - Global Semiconductor Sales in March Up 18.1 Percent Year-to-Year - Increased investment in cable assembly facility wins Harwin new business in space and avionics sector - Micron Appoints Sanjay Mehrotra as President and Chief Executive Officer - Control of molecular motion by metal-plated 3D-printed plastic pieces - BAE Systems lauches Audacious - the fourth state-of-the-art Astute submarine - AI-based smartphone application can predict user’s health risks - Analog Devices’ 28-Nanometer D/A Converter Sets New Performance Benchmarks for Next Wave Wideband Software Defined Systems - Premier Farnell announces global franchise agreement with Dialog Semiconductor - NXP Delivers eDL and Vehicle Registration Smartcards to Algeria - Augmented reality increases maintenance reliability at a space station - Fujitsu Develops Circuit Technology to Improve Energy Efficiency of Hardware Used for Deep Learning - Now included in Vivado 2017.1 HLx Design and System Editions, Partial Reconfiguration enables dynamic field updates & increased systems integration - Small, energy-saving and easy to integrate - Analog Devices MEMS Accelerometers Deliver Compelling Noise Performance for Condition Monitoring Applications - Intel Optane Memory Now Available – Boosts Speed for Gaming, Web Browsing and More - Smartphone and Tablet App from STMicroelectronics Brings New Features for Selecting and Designing with Operational Amplifiers - NAB 2017: Rohde & Schwarz presents the first transmitter for the fourth generation HD Radio standard - 65V, 8A (IOUT), Synchronous Step-Down Silent Switcher 2 Delivers 94% Efficiency at 2MHz & Ultralow EMI/EMC Emissions - Murata introduces RF submodule for Wi-Fi - Making Batteries From Waste Glass Bottles - Italian Technical High School Turns to Tektronix TekSmartLab to Improve Experience for Instructors, Students - GE Completes Acquisition of LM Wind Power - 5G enables precision road weather services and provides robot cars with the ability to hear - Hitachi New London Office for Co-creation of Digital Solutions in Europe - Intel Sets up Research Program with Carnegie Mellon to Improve Online Video as Virtual Reality and 360-Degree Tech Multiply - Ivanka Trump visits Siemens training center in Berlin - A new sensor increases smartwatch battery life five times - Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution - VTT and Aalto University collaborate to develop novel textile fibres - Delft, Aachen and Jülich join forces to build scalable quantum technologies - BMW Group subsidiary Designworks collaborates with Shell to improve the customer experience in hydrogen refuelling - Televisa Selects Ericsson for HD delivery - NAB 2017: R&S CLIPSTER complete mastering solution from Rohde & Schwarz excels in UHD and HDR - Leti announces EU/South Korean project for world's first 5G-system prototype - Analog Devices Opens State-of-the-Art R&D Facility in Ottawa, Canada, to Develop Highly Integrated Radio Technology for Wireless Customers - 42V, 6A (IOUT), Synchronous Step-Down Silent Switcher 2 Delivers 95% Efficiency at 2MHz & Ultralow EMI/EMC Emissions - The Industry's First DC/DC Converter Capable of DC Fan Motor Speed Control - New Tektronix Arbitrary Waveform Generator Meets Demanding Signal Generation Needs in Advanced Research, Radar/EW Design New AWG5200 Provides Industry's Best Available 16-bit Vertical Resolution AWG, Combining High Signal Fidelity and Scalability with Low Cost - 300 W Ac-Dc Power Supply Series Offers High Efficiency in a 3” x 5” Package - Littelfuse Introduces Three New Series of PolySwitch AEC-Q200 Qualified Resettable PPTC Devices for Automotive Applications - Buffered 18-Bit Octal ADC with Picoamp Inputs Shrinks Solution Size - Ultra slim DIN rail power supplies target industrial applications - NXP and Amazon Work Together to Bring More Alexa Experiences to the Smart Home - Academic Teams designed a Hyperloop pods reaching 1,200 km/h in an Elon Musk’s SpaceX competition - Digital key shapes future car connectivity - Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8 Percent Front-Side Efficiency - SK Hynix Inc. Introduces Industry’s Highest 72-Layer 3D NAND Flash - Würth Elektronik eiSos and IDT sponsor the Wireless Power Contest - State of the art technology: 3D measuring technology for maximum precision in the BMW M4 DTM. - BAE Systems awarded £1.4billion contract for new submarine - Space Fabric' Links Fashion and Engineering - Texas Instruments and NASA launch virtual scavenger hunt with out-of-this-world prizes - Polycom Awarded Prestigious ISO 27001 Certification - STMicroelectronics Showcases its IoT Development Ecosystem and Long-Range Connectivity Solutions at TECHNO-FRONTIER 2017 - Nokia and Elisa successfully trial first 10-gigabit network in Finland - Intel Announces Two New Film Collaborations at VRLA - Indoor temperatures in buildings of the future will automatically adjust to user needs - DDR4 Set to Account for Largest Share of DRAM Market by Architecture - ON Semiconductor Extends Leading Image Sensor Portfolio for Sub-Lux Imaging Applications - NXP HOLDS POLE POSITION AS LEADING VENDOR OF OE AUTOMOTIVE SEMICONDUCTORS IN 2016 - Conrad Business Supplies adds high quality pan-European PCB service - Expansion of the Executive Board of Wuerth Elektronik eiSos GmbH & Co. KG - Prince of Wales given Royal welcome by BAE Systems - GEHealthcare acquires Asymptote for complete, digitally-enabled cryogenic cold chain technology supporting safe manufacture and delivery of cellular therapies - Steam train hits 100mph in UK in 50-year first - Ficosa, first Spanish company of the automotive industry with most European patents in 2016 - NXP and China Ministry of Industry and Information Technology’s Subsidiary CAICT Sign Strategic Cooperation Agreement on Smart Connected Cars - NI and AT&T Collaborate on One of the World’s Fastest mmWave Channel Sounders for 5G - StrongIRFET™ MOSFET in new package for battery powered applications - Alliance Memory Launches New Line of 1Gb, 2Gb, and 4Gb Mobile LPDDR2 SDRAMs to Increase Battery Life in Portable Electronics - Vishay Intertechnology 30 V MOSFET Increases Power Density and Efficiency for Mobile Devices and Consumer Electronics - Rohde & Schwarz presents the world's first server-based exciter for ATSC 3.0 - SMT inductors from TT Electronics are robust for demanding automotive applications - ICsense becomes part of TDK group - Renesas Electronics Unveils the Renesas Autonomy™, Open, Innovative and Trusted Platform to Further Extend its Commitment to ADAS and Automated Driving - WYCT FM to Install First Rohde & Schwarz R&S THR9 High-power Transmitter with HD Radio Option in US - Infineon joins the 5G Automotive Association to contribute to connected automated driving - Broadcasters Turn to Tektronix to Navigate Through Critical Video Industry Transitions - BAE Systems selected by U.S. Army to design next-generation space and missile defense technologies - Intel Technology to Redefine Cricket Fan and Player Experiences for the Upcoming ICC Champions Trophy 2017 - Ultrahaptics awarded ISO9001:2015 certification - Avnet at Embedded world 2017 - EMBEDDED WORLD 2017 - Volkswagen Invests $180 Million in a Chinese AI Startup - Vishay Intertechnology Automotive Grade Proximity and Ambient Light Sensor Provides Design Flexibility for Gesture Applications - New Alliance Memory 512Mb SDRAMs in 54-Pin TSOP II Package Provide Pin-for-Pin Replacements for Discontinued Micron Technology Devices - Cost-efficient monitoring and multiviewing solution from Rohde & Schwarz for broadcast and streaming media - Maxim’s PMIC Reduces Solution Size By 50% for Wearable Medical and Fitness Applications - New Intel Xeon Processor E3-1200 v6 Product Family Delivers Essential Performance and Visuals for Professionals - Tektronix Boosts PRISM Platform Capabilities for Monitoring Hybrid IP/SDI Infrastructure - Next-Generation Automotive Door-Zone Controllers from STMicroelectronics Bring Power Management and Failsafe Circuitry On-Chip - New logic level MOSFETs in PQFN package deliver high power density - Intersil Fills Out 12V Synchronous Buck Regulator Portfolio - Cognex Introduces the In-Sight Laser Profiler for Highly Accurate Part Dimension Verification - High Performance 5.1 Megapixel Imaging Solution for High-End Security Camera Applications - Semiconductor Industry Sets Out Research Needed to Advance Emerging Technologies, Unleash Next-Generation Semiconductors - New technology could offer cheaper, faster food testing - Honeywell Introduces New Lightweight Satellite Communications System for Cockpit Safety - ON Semiconductor Demonstrates Advanced Technologies for Automotive Systems at SAE World Congress - Leti Announces EU/South Korean Project for World’s First 5G-system Prototype - Valens Raises $60M to Boost Growth, Innovation in Automotive Industry - CES 2017 Innovation Award honoree FIIL selects ams noise-cancelling technology for its stylish Diva Pro headphones - Intel Movidius Helps Bring Artificial Intelligence to Video Surveillance Cameras - Optoelectronics, Sensors/Actuators, and Discretes Move Toward Normal Growth Rates - Samsung and Rakuten Wuaki Expand 4K HDR Content Availability in Europe - ABB to acquire B&R - LG COMMENCES GLOBAL ROLLOUT OF HIGHLY ANTICIPATED, HIGHLY PRAISED G6 SMARTPHONE - Fossil Group Uses Dassault Systèmes’ “My Collection” Industry Solution Experience to Expand its Global Business - Automatic control of microgrids for more efficient power management - BAE Systems signs CV90 vehicle support contracts with Estonia - Industry 4.0 Let’s look at the big picture - Driving a single-phase BLDC motor - Designing for an Automotive Environment - Microsemi’s New Smart Storage I/O Controllers Unlock Flash Performance in Data Center Servers - Photonics PPP Annual Meeting - LED light glasses help top athletes be successful - Important Considerations when Selecting a Fan for Forced Air Cooling - Reflectionless Filters Improve System IP3 in Up-converter and Down-converter Configurations - Eye measurements on HDMI signals with the R&S VT-B2380 TMDS time domain analyzer - SMART MOBILITY - PRIVACY AND SECURITY - Simplify and Improve The Performance of Ultrasonic Medical Imaging Systems Using a Multi-Channel Digital Demodulator - smart to launch the fascinating forsea concept car: Finding Nemo - NXP and GCL Technologies Deliver Industry’s First Fully Integrated and Status-Aware IoT and NFC Solution for Wine and Spirits Closures to Promote and Protect Brands in the Multi-Billion Industry - Rohde & Schwarz first test system selected by Qualcomm to characterize 5G RF transceiver - An Investment Round for Rail Vision: Outstanding $ 2M Investment Commitments at a Market Cap of $ 20M - Israel Secondary Fund Closes $100 Million Fund - Ericsson completes Indonesia's first 5G demonstration - Epson Wins Prestigious Red Dot Award for Moverio BT-300 Smart Glasses - MaxLinear to Acquire Exar in All-Cash Transaction - A computed tomography scanner for objects - Maximize Battery Run-Times with Maxim’s High Accuracy, Low Quiescent Current Fuel Gauge - Samsung DeX Enables Productivity for Mobile Workers by Extending the Smartphone to a Desktop Environment - Innovative Tyre Management System technology to enable intelligent tyres that reduce carbon emissions and improve safety - F-35 Lightning II's UK arrival moves closer with contract award - Renesas Electronics Completes the Initial Span of Microcontrollers in its Industry-First Renesas Synergy™ Platform by Adding Three New MCU Groups - Siemens closes Mentor Graphics acquisition - Analog Devices Acquires Broadband GaAs and GaN Amplifier Expert OneTree Microdevices to Enable Complete Cable Infrastructure Solutions - Haptics specialist Ultrahaptics launches Academic Program to grow research network - DesignSpark PCB tool from RS Components racks up 100,000 users via educational network licence - Würth Elektronik eiSos Honors Digi-Key with the Global Distribution Award - NXP Announces Availability of MAC57D5xx Linux and FreeRTOS Software Enablement Package - New Intel Xeon Processor E3-1200 v6 Product Family Delivers Essential Performance and Visuals for Professionals - Qualcomm Snapdragon 835 Mobile Platform Powers Gigabit LTE and Immersive Experiences on Samsung Galaxy S8 - IC Insights More Than Doubles its 2017 IC Market Growth Forecast - Pilots begin flights in new F-35 Lightning II simulator in preparation for trials on carrier - Discover New Possibilities with the Samsung Galaxy S8 and S8＋: Smartphones Without Limits - Samsung's New Gear 360 Introduces True 4K Video and 360-Degree Content Capture - Analog Devices’ +48V Hot Swap Controller with Digital Power Monitoring Provides Superior Plug-in Board Protection and Minimizes Downtime - ADL Embedded Solutions Inc. Announces New ADLMES9200 Rugged Chassis System - The First and Only Long-Term Stable Metal-Oxide Gas Sensor - Rohde & Schwarz presents an easy-to-use EMI test software - ams launches AS7225 tunable-white lighting smart system sensor - New Single-Chip Digitally Enhanced Power Analog Solution is Ideal for DC-DC Power Conversion - ON Semiconductor Introduces Industry’s First 100 V Bridge Power Stage Module for Half-Bridge and Full-Bridge DC-DC Converters - Toshiba’s New Car Audio System Regulator IC Handles All Power Requirements - STMicroelectronics’ Chips Stand Guard in Haltian’s Trackerphone for Children and Seniors - Highly Accurate Programmable Hall-Effect Sensor - Emission-free delivery vehicles for the courier service: Strategic partnership: Hermes to deploy 1500 Mercedes-Benz Sprinter and Vito with electric drive - NXP Expands IoT Leadership with Real-time NFC Authentication and Sensing Across Secure Healthcare and Retail - Spark Racing Technology to develop Formula E Season 5 car - Teledyne Completes Acquisition of e2v - Flexible electronic devices with roll-to-roll overmolding technology - Siemens driving digital transformation with $10 billion investment in U.S. software companies since 2007 - DS Automobiles Transforms the Showroom with Immersive Virtual Reality - Alstom’s hydrogen train Coradia iLint first successful run at 80 km/h - “Virtual batteries” could lead to cheaper, cleaner power - Bushwhacking into Unexplored Transistor Territories - Light intelligence for everyone: Research on lighting systems of the future, for Smart Home, Smart City, Smart Factory, and Smart Art - Nano Dimension Supplies 3D Printer to International Defense Solutions Provider - LG Selects Highly Integrated Cypress USB-C Solution for Ultra-Lightweight Notebook - Holst Centre and partners deliver functional surfaces for intuitive automotive and consumer user experiences - Development of image-analysis technology with AI for real-time people-detection and tracking - STMicroelectronics Makes STM8 Microcontrollers Even Easier and Faster to Design with New Graphical Configurato - TowerJazz and TPSCo Release Enhanced up to 200V 180nm BCD on SOI Power Management Process - Samsung, Smartlink and Ingenico Introduce the “Contactless Companion Platform” To Enable “Digital Cash for Everyone” - Analog Devices’ Integrated, Isolated Power Controller Series Reduces Design Complexity and Improves System Reliability - Epson to Launch Low-TCO SCARA Robots - SoftBank and Ericsson to demonstrate 5G 28GHz - Nokia completes first pre-standard 600MHz LTE call using commercially-available hardware - Samsung Joins Esteemed Watch Community at Baselworld 2017 - Imec demonstrates 896Gb/s silicon photonics transceiver - Leading European pilot facilities for industrial biotechnology join forces to improve Europe’s innovation capacity - REMUS become Official Technology Partner of Mercedes-AMG Motorsport DTM Team - Leti presented advances in propagation modeling and antenna design at EuCAP in Paris - Fusible resistors from TT Electronics save PCB space - Industry’s smallest regulated and isolated 9 W DC-DC converters offer 4:1 input range - Toward printable, sensor-laden “skin” for robots - Reinforced isolator with integrated power offers industry's highest efficiency, lowest emissions - Microsoft announces patent license agreement with Toyota, enhancing connected car experience for consumers - Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution - TDK-Micronas and Endrich expand their distribution partnership - Organic electronics can use power from socket - Vishay Intertechnology High Speed PIN Photodiode Delivers Precise Signal Detection, Enables Slim Sensor Designs for Wearables - Next generation of Mercedes-Benz compact cars: Mercedes-Benz continues to produce at Valmet Automotive - Tektronix Introduces Optical Modules with Industry's Highest Sensitivity, Lowest Noise - Ficosa and Panasonic strengthen capital and business alliance to lead the automobile transformation - China's Geely opens UK plant for electric London taxis - 30 W and 40 W Desktop Power Adapters Comply with DoE Level VI and CoC Tier 2 Standards - NXP Accelerates Automotive Software Design with the New S32K Microcontroller Platform Launch - Allegro MicroSystems, LLC Announces New Three-Phase BLDC Controller and MOSFET Driver IC - First 1000Base-T1 compliance test solution in the R&S RTO oscilloscope supports automotive industry - u-blox introduces the most secure Wi-Fi modules for industrial markets - NXP Announces ARM Cortex-M4-based MCU with Industry’s Largest Embedded SRAM Memory, Optimized for Portable Devices - Non-contacting rotary encoder for space-restricted installation: Contelec’s compact and durable Vert-X 05E available from Variohm EuroSensor - New Yorker Electronics Features Mil-Spec Wet Tantalum Capacitor with Extended Capacitance Range - Accelerate product expansion and maximize software investment with the new SimpleLink™ MCU platform - OriginGPS Launches World's Smallest GNSS Module - Telit Introduces New Family of Industry’s Smallest GNSS Modules with Integrated Antenna - Marvell Introduces Groundbreaking Modular Approach to 10GbE and 25GbE Deployment in the Data Center - Congatec further standardizes interface setup for SMARC 2.0 - ETAS and Lynx Software Technologies collaborate to deliver safe and secure platform technology to support the needs of next generation connected and autonomous vehicles   - Liquid fuel for future computers - BBC Creative selects Ericsson for post-production and media management services - NVIDIA and Bosch Announce AI Self-Driving Car Computer - ams signs agreement to acquire VCSEL technology leader Princeton Optronics - Wurth Electronics Smart Transformer Selector Now Interacts with STMicroelectronics’ eDesignSuite - Tektronix Provides Raspberry Pi with Measurement Solutions to Test and Develop Current and Next Generation High Speed Interfaces - Smart Grid Demonstration Project in Poland to improve power system protection in case of high penetration of renewable energy - FocalSpec Oy receives funding of €3.5 million - Qualcomm 205 Mobile Platform Brings 4G Connectivity to More People in More Places - BAE Systems contracts Czech firm VOP CZ for military vehicle components - TowerJazz Announces H5: a Leading 300GHz SiGe Technology Optimized for 400GbE Communications - Intel Introduces the World’s Most Responsive Data Center Solid State Drive - U.S. Companies Still Hold Largest Share of Fabless Company IC Sales - Industry's first multiphase bidirectional current controller from TI - STMicroelectronics Launches Tiny 2.6A Brushed DC Motor Driver for Portable, Battery-Powered IoT Devices - Engineers design “tree-on-a-chip” - Analog Devices’ New Active Learning Modules Focus on Improving Analog and Radio Frequency Engineering Education - Arrow Electronics is Celebrating at Embedded World 2017 - Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up - One-stop shop for industrial electronics developers - Development of a compact sensor that identifies the source of electromagnetic interference to prevent malfunction in component for autonomous operation - Mitsubishi Electric Develops Technologies for Automated Mapping and Extraction of Transitions in Mapping Landscape for High-precision 3D Maps Essential in Autonomous Driving - Nano Dimension Delivers 3D Printer to One of the 10 Largest PCB Manufacturers in the World - Samsung Introduces New Lifestyle TVs at Global Launch Event in Paris - R&S RTO oscilloscope offers new test options for fast serial interfaces up to 5 Gbit/s - NXP Unveils Advanced TSN-Enabled SoC for Industrial IoT - Analog Devices’ Ultralow Power Accelerometer Enables Remote IoT Edge Nodes to Monitor Asset Health - Rohde & Schwarz introduces a modular probe system for precision measurements up to 9 GHz - Merger of Siemens Wind Power and Gamesa receives antitrust clearance - Ultra Low Power MCU Enables 10 Times System-Level Power Savings and Floating-Point Operation in IoT Applications - Renesas Electronics Europe extends Synergy™ Platform Ecosystem by adding Amazon Web Service IoT Connectivity - NXP Delivers Increased Safety, Reliability and Scalability to Industrial Applications with New i.MX 8X Processors - The Industry’s First MCUs with Built-In LCD Driver Optimized for Data Loggers - RS Components celebrates ‘Pi Day’ with Raspberry Pi prize draw - Intersil Unveils Highly Integrated Multi-Cell Battery Pack Monitor - New modules in 62 mm package enable higher power density - Maxim’s nanoPower Boost Regulator Delivers Industry’s Longest Battery Life and Smallest Solution Size for Wearable and Consumer IoT Designs - Out-of-the-Box Solutions from ON Semiconductor Enable Engineers to Accelerate Cloud-Based IoT Development Projects - Cypress Unveils PSoC 6, the Industry's Lowest Power, Most Flexible MCU Architecture, Setting a New Standard for Battery-powered, Secure IoT Devices - GE Healthcare Expands Digital Maternal-Infant Care Offerings with Acquisition of Monica Healthcare - Comprehensive Portfolio of Advanced Gigabit Ethernet Products Offers Ease of Design - Renesas Electronics Accelerates Industrial Networking Application Development with RZ/N Series of Microprocessors - Nokia provides LG CNS with a mission-critical communications network to support railway operations on Malaysia's first mass rapid transit line - Toshiba Expands Line-up of New-generation Transistor Arrays - Rohde & Schwarz brings its RF expertise to the entry class with the new R&S FPC1000 spectrum analyzer - Rohde & Schwarz introduces industry's first entry-level oscilloscope with 10-bit vertical resolution and touchscreen - New ams 3.5mm jack interface lets smart active noise cancellation (ANC) headsets run battery-free - Lighting the path to production for connected buildings with mbed OS 5.4 - Intel Acquisition of Mobileye - Semiconductor Shipments Dominated by Opto-Sensor-Discrete Devices - Alibaba Collaborating with Intel on an FPGA-based Solution to Help Customers Accelerate Business Applications - NXP Launches the World’s Smallest Single-chip SoC with Integrated Microcontroller for Drones, Robots, Power Tools, DC Fan and Healthcare Applications - Cypress and Arrow Electronics Expand Collaboration to Deliver Leading IoT Solutions - New tinyAVR® MCUs Increase System Throughput While Lowering Power Consumption in Embedded Applications - Eutelsat and STMicroelectronics Announce Low-Cost, Low-Power System-on-Chip for Interactive Satellite Terminals - NXP Taps into FD-SOI Technology to Enable the Industry’s Lowest Power General Purpose Applications Processors - Environmentally friendly, almost electricity-free solar cooling – also serves as a heat pump - Value and performance: powerful T&M equipment from Rohde & Schwarz at embedded world 2017 - Xilinx Expands into Wide Range of Vision-Guided Machine Learning Applications with reVISION - Toward “valleytronic” devices for data storage or computer logic systems - ON Semiconductor Establishes Advanced Sensor Design Center in Europe - STMicroelectronics Announces Volume Production of Industry-Unique Satellite Demodulator with Lead Customer Newtec - Rohde & Schwarz is the first manufacturer to offer NB-IoT and eMTC protocol conformance test cases in a single instrument - Bidirectional Electronic Circuit Breaker Provides Comprehensive Protection Against Current & Voltage Faults - New PIC18 family offers a versatile array of core independent peripherals to simplify complex designs - Wurth Electronics Power Inductors and Capacitors Featured in Monolithic Power Systems, Inc. Module Solutions - Vishay Intertechnology Native Top-View IR Receivers in Through-Hole Package Save Space in Consumer Products - Tektronix Showcases the Latest in Optical Test Innovation for Datacenter Networking at OFC 2017 - ON Semiconductor Image Sensor Enhances Patient Safety for Digital Radiography - Microchip Simplifies the Development of Smart, Connected and Secure Solutions with a Hardware Cryptography-Enabled Microcontroller - TI introduces industry's first 4-20mA DAC with integrated buck/boost converter that operates off of a single-supply - SMI Eye Tracking Enables Foveated Rendering on Mobile Virtual Reality Platform at GDC - Cadence Launches Xcelium Parallel Simulator, the Industry’s First Production-Proven Parallel Simulator - Eleven Companies Forecast to Account for 78% of Semi Capex in 2017 - Swatch Group creates the world’s smallest Bluetooth chip - 3-D printing with cellulose - Micron Outlines Vision for IoT and Industrial Computing in Nuremberg - Panasonic develops solar car roof for Prius - IBM Building First Universal Quantum Computers for Business and Science - European Semiconductor Sales up 4.8% year-on-year - German companies and research institutes optimize security solutions for Industrie 4.0 and connected high-value goods - Microsoft shakes up server market with news it plans to run with ARM - LETI ANNOUNCES BACKSIDE SHIELD THAT PROTECTS MICROCHIPS FROM PHYSICAL ATTACKS - New-Tech Europe | March 2017 | Digital Edition - Making Hardware Design Great Again in 2017 - Part Deux - The Changing Landscape of Frequency Mixing Components - Considerations for Advanced Driver Awareness Systems why use an All Programmable SoC - Ambient Automotive LED Lighting Maximizes the Driving Experience - ENABLING MOBILE INTERFACE BRIDGING IN ADAS AND INFOTAINMENT APPLICATIONS - LED Dimming Engine: An 8-bit MCU-based solution for a Switched-Mode Dimmable LED driver - Residual Current Devices in a Digital World - CAN WE TRUST THE INTERNET OF THINGS? - Selecting High Linearity MMIC Amplifiers for use with Complex Digital Waveforms - Real-time radar target generation - DFKI and Hitachi jointly develop AI technology for human activity recognition of workers using wearable devices - New approach for matching production and consumption of renewable electricity promotes large-scale integration of solar and wind power - Analog Devices Announces Final Regulatory Approval and Closing Date for Acquisition of Linear Technology Corporation - Ayla Networks and Develco Products Join Forces to Create IoT Gateways for Smart Home, Smart Lighting and Smart Energy Management Markets - Siemens celebrates major milestone in Egypt megaproject - Precise technique tracks dopamine in the brain - Finavia selects Rohde & Schwarz to modernize Finland’s air traffic control radio communications - Maxim’s Defibrillation and ESD Protection Device Safeguards Medical Applications with 100x Less Leakage Current - Rail-to-Rail Op Amps Feature Precision & Power Efficiency - NI Releases NI-RFmx 2.2 Measurement Software for 4.5G Test - Vicor introduces the first in a new family of 20 Amp 48V Cool-Power ZVS Buck Regulators - Integrated MOSFET voltage regulator for high-density applications reduces component count - ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected Health & Wellness - Avnet and AT&T Team to Lower Barriers to Development of IoT Solutions - Qualcomm Technologies and Mercedes AMG Petronas Motorsport begin testing faster Wi-Fi telemetry - ZTE launches world's first 5G-ready smartphone - The Future of VR is Here: Qualcomm and Leap Motion Work Together To Demonstrate Natural Interaction for Mobile VR - Flemish Government increases financial support of imec - £229 million of industrial strategy investment in science, research and innovation - UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates - Strategy TRANSFORM 2025+: Volkswagen launches programme for key future technologies - New material made from fiber-reinforced hydrogels is 5 times tougher than steel - Microchip debuts advanced motor-control tool with auto-tuning and self-commissioning capability - Ficosa creates Onboard Ventures, an open innovation initiative to promote start-ups - ON Semiconductor Unveils Innovative Modular Automotive Imaging Platform - Singtel and Ericsson pave the way for consumer connected device solutions at Mobile World Congress 2017 - Jio and Samsung Win “Best Mobile Innovation for Emerging Markets” at Global Mobile Awards 2017 - New technology offers fast peptide synthesis - Scientists develop spectacles for X-ray lasers - Ficosa presents the latest technology in connected and autonomous car at MWC 2017 - CEVA's Bluetooth® 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices - Unique test solution from Rohde & Schwarz analyzes IP security mechanisms in IoT and mobile devices - iNyx - World's most advanced bed (indiegogo) - Imec Presents Patterning Solutions for N5-equivalent Metal Layers - Enabling mass IoT connectivity as ARM partners ship 100 billion chips - Ficosa, first Spanish company to join 5G Automotive Association - Occipital and Inuitive present new integrated solution for AR/VR/MR headsets and robotics - STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices - Samsung and Deutsche Telekom Successfully Demonstrate 5G Guaranteed Latency at Mobile World Congress 2017 - Renesas Electronics Completes Acquisition of Intersil Combination Creates the World’s Leading Embedded Solution Provider - Infineon RF solutions for fast, efficient and reliable 5G - NXP Joins Auto-ISAC to Collaborate on Security Challenges of Connected Cars - Semico Research white paper describes how companies could double SoC profitability through post-silicon debug - Mobile ID turns smartphone into connected ID card - ARM invests in the future of IoT connectivity - CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity - NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment - New research shows perception of STEM subjects is improving - UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates - DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development - Qualcomm Showcases 5G Leadership with its First 3GPP-based 5G New Radio Connection - UCF and NASA Study Using Martian Soil to Build Human Habitats - Faurecia Ventures Investment Pushes TactoTek Funding Over 20 Million USD Mark - Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars - Crowd sourcing for automated driving: BMW Group and Mobileye agree to generate new kind of sensor data - STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications - Vicor introduces two new DCMs in a ChiP Package - ALTAIR INTRODUCES THE ALT1250, THE MOST ADVANCED AND INTEGRATED NARROWBAND CAT-M1 AND NB1 CELLULAR IOT CHIP - Rohde & Schwarz is the first to add IEEE 802.11ac signaling to its radio communication tester - Analog Devices Offers Industry’s First Intrinsically Safe Digital Isolation Certification to Enable Design in Hazardous Areas - New High Performance Optical Sensor for Heart Rate Monitoring Ideal for Wearables - Samsung Introduces Second Generation Chip-on-Board LED Packages for Spotlights and Other Directional Lighting - Analog Devices Extends Autonomous Driving Leadership with Drive360TM 28nm CMOS RADAR Technology Platform - Samsung Launches Premium Exynos 9 Series Processor Built on the World’s First 10nm FinFET Process Technology - Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity - Rohde & Schwarz showcases its comprehensive portfolio for innovative air traffic management - First Joint Live Demonstration of Gigabit LTE Using Aggregation of Licensed and Unlicensed Spectrum with a Commercial Modem Chipset with AT&T, Ericsson, Orange and Qualcomm - NXP Launches Multi-Standard Programmable Family of System on Chip Solutions - PV Nano Cell Signs LOI for the $10M Acquisition of Digital Printer Manufacturer, DigiFlex - Blu Wireless Technology secures backing from ARM - Qualcomm Announces the First Commercially Sampling Tri-mode System-on-Chip with Bluetooth Low Energy 5, Dual band Wi-Fi, 802.15.4 Connectivity for IoT Devices - Latest PIC® MCU Family Brings Ease of Design with More Core Independent Peripherals - CommAgility Announces Acquisition by Wireless Telecom Group - STMicroelectronics and Airbiquity to Demonstrate Secure Over-the-Air Software Updates for Automotive Processors - Researchers devise efficient power converter for internet of things - Gamification motivates consumers to reduce power consumption peaks – pilot sites in Helsinki, Nice and Vienna - £25m specialist apprentice training facility investment - Mobileye Completes Installation of Collision Avoidance Technology Across 4,500 New York City For-Hire Vehicles - DDING MULTIMEDIA OT and ERCOM Partner to Introduce Cryptosmart SIM-Powered, the Best Solution to Encrypt Mobile Communications on SAMSUNG Consumer Devices - New resource for optical chips - EPFL leads 14-million-euro EU projects in optomechanical technologies - Vishay Intertechnology Extends Capacitance Range of MIL-PRF-39006/33-Qualified Wet Tantalum Capacitor - Jonsson School Engineers Shrink Microscope to Dime-sized Device - Renesas Electronics Becomes First Semiconductor Supplier to Join Civil Infrastructure Platform Project to Accelerate Smart Industrial Devices - New STM32 Boards from STMicroelectronics Support Cost-Effective and Ultra-Low-Power LPWAN Evaluation for Long-Range IoT Connectivity - Six-Legged Robots Faster Than Nature-Inspired Gait - Siemens to secure long-term competitiveness of mechanical drives unit - Intel Continues to Drive Semiconductor Industry R&D Spending - Analog Devices Selects Arrow Electronics as Strategic Global Distribution Channel Partner - First 5G Network end-to-end demonstration by Ericsson - NXP Wins Prestigious Automotive Innovation Award with Radar - Leading EU consortium aims to assist photonics companies to enter key Life Sciences markets. - Kodak Signs ARCHOS as European Tablet Brand Licensee - News SSS Doubles Its Value Added Services Offering - TomTom Telematics surpasses 700,000-vehicle milestone - Versatile Accelerometer from STMicroelectronics Delivers Class-Leading Resolution and Low Power in Tiny Footprint - Samsung Electronics Showcases the Future of Customer Engagement with New QLED Signage at ISE 2017 - Dutch startup solution impacts datacentres - Qualcomm Announces First End-to-End 802.11ax Wi-Fi Portfolio - ON Semiconductor Image Sensor Powers Academy Award Winning ALEXA Camera from ARRI - Intel Introduces Versatile New FPGA for Industrial and Automotive Markets - World's first 5G federated network slicing grants global reach - Swarm data paves way for autonomous driving: Volkswagen and Mobileye sign agreement - Next step in the Mercedes-Benz electric offensive: Mercedes-Benz Untertürkheim plant prepares for electric mobility - Frequency combs: on-chip integration on track - Nano Dimension, in Collaboration with the Israeli Ministry of Defense, Receives Grant to Develop 3D Printing of Ceramic Materials, Designated for the Aerospace and Aviation Sectors - Corephotonics Collaborates with Samsung Electro-Mechanics to Bring New Era of Imaging to Smartphones - Vishay Intertechnology Minimold IR Receivers in Pin-in-Paste Side-View Holder Lower Assembly Costs and Increase Reliability - Industry’s First ‘zigbee PRO with Green Power Certified Platform’ Unveiled by Microchip - ADL Embedded Solutions, Inc. Announces ADLEPC-1500 Full-Featured, Ultra-Compact 3.4” x 3.2” Embedded PC - Ultra-low power e-paper displays pivotal in streamlining service automation - Ametherm Glass-Encapsulated Thermistors Deliver Long-Term Stability and Reliability for Automotive and Industrial Applications - Murata adds 90A, PMBus™ compliant PoLs for FPGA & processor power - Allegro MicroSystems announces second generation automotive three-phase isolator MOSFET driver IC - UK Minister for Defence Procurement shows support to Indo-UK Advanced Hawk - STMicroelectronics’ MCU Finder for PC Connects Conveniently to STM32 and STM8 Design Resources Directly on Developer’s Desktop - TI unveils industry's smallest 12-V, 10-A DC/DC step-down power solution - Aluminium of Greece collaborates with GE to drive efficiency using Predix*-based first-of-their-kind digital smelter solutions - The school with the largest solar facade in the world - NXP Unveils Secure Platform Solution for the IoT - Nokia lays key 5G foundation with world's first 5GTF connection - Stanford researchers pioneer world’s first affordable urea battery - Using a Complementary Waveform Generator - Power Efficient Design for Wearable Electronics - Improper Power Sequencing in Op Amps: Analyzing the Risks - Rohde & Schwarz mobile network testing has signed an agreement with Samsung that grants preferential RF access and support to current and upcoming Samsung devices - Intersil Announces Industry’s Smallest Isolated RS-485 Transceiver - Hitachi Rail Italy wins a contract worth 106 million Euros for additional 15 “Leonardo” metro trains from Azienda Trasporti Milanesi - New VR-Ready IEM-Certified PCs Let eSports Enthusiasts Game Like the Pros - FORD INVESTS IN ARGO AI, A NEW ARTIFICIAL INTELLIGENCE COMPANY, IN DRIVE FOR AUTONOMOUS VEHICLE LEADERSHIP - Nokia and Three UK to deploy world's first next-generation cloud native core network - R&S Scope Rider A multitalent for debugging in the field - Solving Power Capacity Challenges with Software Defined Power - Discrete vs. Integrated Solutions for Sensor Conditioning - Augmenting Touchless Gesture Recognition with Haptic Feedback - Interplay Between Chip and Digital Technologies Crucial for the Internet of Things - Contactless Connectivity Unshackles Robotic Systems - New research reveals business disconnect in defending against cyber attacks - Research for DC power grids: Technological basis set for high performance electronic circuit breakers - EMBEDDED WORLD 2017 - IBM Invites Cities Worldwide to Compete for Grants to Help Address Their Toughest Challenges - VTT and CWC receive the first 5G equipment in Finland - Industrial maintenance is becoming knowledge work - GE Inaugurates Redhill (Stafford) Manufacturing Facility, UK - Achieve true precision with the industry’s first zero-drift, zero-crossover operational amplifier - New Yorker Electronics Expands on Lighting Division Lineup with New SMD Terminal Block Connectors - 3MHz Chopper Op Amps from STMicroelectronics Feature Rail-to-Rail Input and Output in Tiny Footprint - 560V No-Opto Flyback Regulator Delivers Up to 15 Watts in High Voltage Spacing TSSOP Package - 40A Scalable µModule Regulator Protects Load by Tripping Upstream Power Source - Handheld oscilloscope from Rohde & Schwarz now offers the functionality of eight test instruments - Vishay Intertechnology VY1 Compact Series Ceramic Disc Capacitors Now Qualified to Biased 85/85 Accelerated Life Test for Increased Reliability - Vicor introduces two new DCMs in a VIA Package - Tiny LDOs from STMicroelectronics Deliver Class-Leading Quiet Power for Precision Sensing - Toshiba Launches 8TB HDD for NAS Applications - NI Upgrades Oscilloscope and Function Generator Performance for VirtualBench All-in-One Instrument - LETI ANNOUNCES PROJECT TO ADAPT OBSTACLE-DETECTION TECHNOLOGY USED IN AUTONOMOUS CARS FOR MULTIPLE USES - Qualcomm and TDK Announce Launch of Joint Venture - Austrian Centre of Industrial Biotechnology and GE Healthcare establish a cell line engineering collaboration - IBM & Ericsson announce research advance for 5G communications networks - Keysight and Ixia to Combine to Accelerate Growth and Create a Powerful Innovation Engine -   IC Market Growth Limited by Narrow Window of Global GDP Expansion - Imec, Holst Centre and ROHM Present Breakthrough Solution for Ultra Low Power Internet of Things radios - Wave of the future: Terahertz chips a new way of seeing through matter - New design tools bring large-area LED products on the market with speed, quality and lower costs - askLorandt: Innovative service at Wuerth Elektronik eiSos - LG and Google partner to develop first android wear 2.0 watches - Nokia announces its intention to acquire Comptel to advance its software strategy; launches a recommended cash tender offer for all the shares and option rights in Comptel - Intel Drones Light Up Lady Gaga Performance During Pepsi Zero Sugar Super Bowl LI Halftime - Intel Supports American Innovation with $7 Billion Investment in Next-Generation Semiconductor Factory in Arizona - Turkey's first digital power plant powered by GE & GAMA Energy - Rohde & Schwarz presents first video board supporting both SDI and video over IP - New-Tech Europe | Feb 2017 | Digital Edition - CES 2017 - Circuit Protection a vital consideration for the machine builder - Towards avionics safety certification on multi-core processor architectures - The Changing Landscape of Frequency Mixing Components - The Perfect EMC Connector Design Solution? - Autonomous vehicles break through to the mainstream - DK low energy IoT trends - Security for IoT Is a Requirement, Not a Choice - AS9100 Transition Drives Technical Excellence - The Internet of Experience - Designing efficient industrial systems - Stepper Motors Use Closed-Loop Technology To Step Into Servo Applications - UK Air Traffic Control provider NATS selects Rohde & Schwarz for Second Voice System - Nokia, Alphabet's Access Group and Qualcomm showcase first live demo of a private LTE network over CBRS shared spectrum providing a 360° race car experience - NXP Identifies Top Trends in Access Management and Secure Identification for the Hospitality Market in 2017 - Hitachi Automotive Systems and Honda Sign MoU Aiming to Establish a Joint Venture Company for Electric Vehicle Motors - Rohde & Schwarz is named official supplier for the 67th Berlinale - Willow Technologies Announces Distribution with LSIS - A commuter's dream: Entrepreneurs race to develop flying car - Amkor Technology to Acquire NANIUM - 300MHz to 6GHz Dual Wideband Mixer with Programmable Gain Amplifiers Enables 5G Wireless Access - Tektronix Introduces Industry's First Comprehensive Receiver Testing Solution for MIPI D-PHY v2.0 Supports Testing Requirements for Such Advanced Applications as Autonomous Driving Systems, In-Vehicle Infotainment, High-End Smartphones - Rohde & Schwarz introduces powerful 6 GHz lab oscilloscope for multi-domain applications - STMicroelectronics Boosts Feature Integration, Efficiency, and Flexibility of Next-Generation Intelligent Power Modules up to 100W - The World’s Smallest Reflector-Type High Brightness 3-Color LED Compact, high ESD resistance design provides greater design flexibility in matrix applications - congatec now entirely supports the Windows 10 IoT editions congatec’s latest OS implementation further simplifies development of IoT-connected devices - Vishay Intertechnology Introduces New Series of Sulfur-Resistant Long Side Termination Thick Film Chip Resistors Devices Combine Advanced Sulfur Resistance With High Power Ratings to 2.0 W for Automotive and Industrial Applications - 60V I²C Battery Monitor Measures State of Charge Parameters with 1% Accuracy - Reflective optical sensor provides robust reliability and versatility along with market leading ambient light immunity - Proximal Flow Sensors Now Available for Neonatal Applications - Wind Satellite Heads for Final Testing - CPI to launch new facility to realise opportunities in the Internet of Things - With or without a driver, vehicles are able to cooperate - Ericsson, Qualcomm, and NETGEAR launch Telstras World-First Commercial Gigabit LTE Network with 150Mbps Upload Speeds - Five More Cities Join Bloomberg Philanthropies and the Aspen Institute’s Global Initiative on Autonomous Vehicles - Without Technology, China’s “MIC 2025” Results for ICs Likely to Fall Woefully Short of its Goals - TrackNet Joins LoRa Alliance to Support Continued Development of Global Roaming - Solid State Supplies announces distribution agreement with AAEON Technology Inc. - Ericsson and DNA to boost mobile broadband in sparsely populated areas in Finland - Demanding production program and focus on future technologies: Mercedes-Benz plant Bremen creates 150 new jobs - NXP Supports the Philippines with eGovernment Solutions - Nokia and Sky enhance on-demand video services in the UK - Electric Vehicle Charging Interface Initiative Welcomes STMicroelectronics - Honeywell To Provide Largest Oleflex™ Unit In Europe For Borealis AG - Jim Hagemann Snabe proposed as new Chairman of Siemens' Supervisory Board - Nokia and Orange Group collaborate to shape the future of 5G services - Product Design: ROHM LAPIS ML7345 a new solution for KNX RF Multi Secure - Rohde & Schwarz introduces a probe with both a large offset range and a DC voltmeter for power integrity measurements - Proven and Improved - SDP800 Series Differential Pressure Sensors - Vishay Intertechnology Introduces New Series of Sulfur-Resistant Long Side Termination Thick Film Chip Resistors - Cypress Offers Enhanced Security, Reliability and Performance for Automotive, Industrial and IoT Applications with New FL-L NOR Flash Memories - Fourth-Generation 600 V E Series Power MOSFET Lowers Conduction and Switching Losses, Increases Efficiency - MIT Hyperloop MIT is one of 30 student teams testing high-speed concept pods as part of a SpaceX Hyperloop competition. - BAE Systems signs Heads of Agreement for a future contract with Turkish Aerospace Industries for TF-X Programme - TOSHIBA ADDS 7TH GENERATION INTEL PROCESSORS TO MOBILE SOLUTIONS PORTFOLIO - 0.33-inch full-HD DLP® Pico™ chipset from Texas Instruments is industry's smallest 1080p display solution with unmatched brightness capabilities - NXP Shareholders Approve All Items Proposed Relating To Qualcomm’s Tender Offer - Swedish solar energy expert Midsummer’s client now produces lightweight flexible solar modules with conversion efficiency at 14 per cent - Optimizing Virtual Reality: Understanding Multiview - Elmo expands production in the EU - TI technology extends flight time and battery life of quadcopters and industrial drones - Hundreds of Xilinx Space Grade FPGAs Deployed in Launch of Iridium NEXT Satellites - Ricoh launches 4A PWM step-down DCDC converter for industrial, automotive and consumer applications - New time-to-digital converter from ams offers industry-best combination of speed, precision and power - An Idea to Connect Vertically with the Deep Sea - Infineon joins CharIN to support global standards in electric mobility - Toshiba Launches Car Audio Current-Feedback Power Amplifier IC with Built-In Full-Time Offset Detection - Würth Elektronik eiSos presents the WE-TPB HV series of power line chokes - Oracle Expands Startup Accelerator Program to Further Promote Global Cloud Innovation - Jussi Ollila to start as Senior Vice President of Communications at VTT - ams announces completion of transaction to acquire Heptagon and related capital increase - Finnish biopharmaceutical company Desentum closes financial round totalling nearly EUR 2 Million - CPI and Haydale collaborate on Smart Filter project - NXP Identifies Top Three Global Trends in Electronic Passports - CSEM And Sensifree Announce Research Partnership - Intel Security Survey Reveals New Family Challenges as Connected Lifestyle Grows - New discovery: nanometric imprinting on fiber - Imec Introduces New Snapshot Multispectral Image Sensor that Combines Color and Near-Infrared Imaging - New “Hydrogen Council” launches in Davos. - 2015-2016 Deals Dominate Semiconductor M&A Ranking - Analog Devices’ Expanded Series of A2B Transceivers Significantly Improves Bus-bandwidth Utilization - Nokia signs EUR 30 million network expansion and modernization deal with Bangladesh's Teletalk - Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding - New sensors can detect single protein molecules Modified carbon nanotubes could be used to track protein production by individual cells - STM32 and STM8 Microcontrollers from STMicroelectronics Drive the Smart Revolution, with Over One Million Developer Kits Delivered - Wurth Electronics Midcom Announces New Design Contest - Aerospace and Defense Mobilize Insatiable Bandwidth Applications - Automotive Security: A Hacker's Eye View - Digi-key and the European Electronic Market - New-Tech Europe | Jan 2017 | Digital Edition - Analog Devices Announces Changes to Membership of Board of Directors - Landmark Study on Impact of 5G Mobile Technology Released - Now drivers can hear ambulances no matter how loud their music is playing - Multiphase 60V Synchronous Boost Controller Provides up to 97% Efficiency with Input & Output Protection - Analog Devices’ RadioVerse™ Technology and Design Ecosystem Earns Industry Accolades for Breakthrough Wideband RF Transceiver - Murata introduces DMH supercapacitor featuring world’s lowest profile of 0.4mm - High-Temperature Silicon Power Switches from STMicroelectronics Enhance Reliability in Motorcycles and Industrial Applications - Intersil Battery Charger Extends Backup Battery Life of Automotive eCall Systems - 700 V CoolMOS™ P7 family from Infineon for quasi resonant flyback topologies - Highly Integrated Capacitive-Digital Converter Delivers Superior Gesture Sensing and Enhanced Touch Performance to Automotive and Industrial Systems - Archer SIL - Single Row options for 1.27mm pitch M50 range - SOLARWINDOW TECHNOLOGIES DEVELOPS ELECTRICITY-GENERATING FLEXIBLE GLASS - Technique enables adaptable 3-D printing Once fabricated, objects can be altered by adding new polymers. - Directed energy atmospheric lens could revolutionise future battlefields - Intel Unveils New Intel Responsive Retail Platform and Plans for $100 Million Investment at NRF 2017 - ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology AS7262 and AS7263 six-channel digital multispectral sensor ICs bring the lab to the sample to enable a revolution in consumer and industrial spectral analysis applications - Facebook's first startup incubator will be in Paris - TomTom acquires Autonomos, a Berlin-based autonomous driving start-up - Rohde & Schwarz protects AirPower, Europe's largest air show, against threats from drones with R&S ARDRONIS - IFS completes the acquisition of Mxi Technologies Ltd - STAM research: Technology for the masses - printed organic electronics review wins best paper award - The most innovative country in the world takes top spot again - Nano Dimension Targets IoT Market - Technological Breakthrough: 3D Printing of Rigid PCB Series Combined with Flexible Conductive Connectors in a Single Print - Arrow Electronics and CUI Inc Enter into Worldwide Distribution Agreement - Samsung’s Exynos Processors Selected to Revolutionize Audi’s Next-Generation In-Vehicle Infotainment - Poland has chosen nine startups for the European final of StartUp Europe Awards! - Using microfluidics to improve genetics research - Digital Light Engine technology to illuminate F-22 Head-Up Display - Honeywell, Intel to Jointly Develop Internet of Things Solutions for Retailers and Logistics Providers - Class-Leading Low On-resistance N-Channel MOSFETs for Load Switching - The Industry’s First Automotive Chipsets That Support Functional Safety in High Resolution Displays Expanded lineup compatible with functional safety measures for speedometers, side mirrors, and other vehicle systems - Alternative solar cells ramp up efficiency and stability - Imperial researchers collaborate on project to supply solar power to UK trains - EU Awards €7.7 Million to NanoPack Project to Introduce Nanotechnology-Based Antimicrobial Packaging to Enhance Food Safety and Reduce Waste - Pure-Play Foundry Market Surges 11% in 2016 to Reach $50 Billion! - EU Funding for Formulators - BAE Systems’ Artisan 3D radar system passes sea-based acceptance trials - TT Electronics’ sensors heading for Mars in 2020! - Harwin increases design choices and production flexibility with extensions to 1.27mm, 2mm and 2.54mm pitch connector ranges - Renesas Electronics Unveils Automotive Radar Solution to Bolster ADAS and Autonomous Driving Vehicles - ADL Embedded Solutions Inc. Announces New 75mm x 75mm Intel E3800-series Edge-Connect SBC – ADLE3800SEC - Infineon enables compact and cost-effective LED front light applications with LITIX™ LED driver family - New Arduino-Compatible Sensor Evaluation Kit - Milestone in graphene production - IBM Reveals Five Innovations that will Help Change our Lives within Five Years - Wearable sensor device helps visually impaired to sense their environment - Rohde & Schwarz Cybersecurity acquires Web application security specialist DenyAll - First look inside nanoscale catalysts shows defects are useful - ON Semiconductor and Hexius Semiconductor Expand Scope of Analog Functionality for Next Generation Mixed Signal ASICs - Verizon and Cypress Bring Secure Connectivity to Robust Internet of Things Development Platform - NI Debuts Industrial Internet of Things (IoT) Lab to Promote Innovation and Collaboration - ETSI launches new group on Context Information Management for smart city interoperability - Compound eyes for industry and smartphone - Gemalto connects China’s first Internet Car launched by Banma - COTS+ and DSCC parts emerge as alternatives to MIL-STD - Implementing a class D audio amplifier - Comparing CPLD-Based Circuit Board Power Management Architectures - Power Modules - In Search of a Winning Combination - A Sensor-Fusion Approach to First Responder Precision Location/Tracking - New Balance RunIQ Engineered by Intel Delivers Amazing Experiences and Performance Tracking for Runners - TAU leads in European young researcher grants - Intel Unveils Compute Card, a Credit Card-Sized Compute Platform - GE Healthcare to commercialize Rapiscan® outside the US, Canada & Mexico for increased access to heart exams - Memory Market Poised for Strongest Annual Growth Through 2021 - Ericsson and Cisco extend strategic partnership to include new Wi-Fi solutions - NXP and Geely Announce Strategic Partnership for Automotive Research and Development - Piloted driving with artificial intelligence: Audi partnering with top companies in the electronics industry - Maxim Announces Industry's First Remote Tuner Solution with Single Hardware Platform Supporting Worldwide Radio Standards for Automotive Applications - Leading automotive supplier demonstrates Ultrahaptics’ mid air haptics in concept car at CES® 2017 - Renesas Electronics and TTTech Deliver Highly Automated Driving Platform Providing Faster Track to Mass Production - Dassault Systèmes Boosts Experience-Thinking Innovation on the 3DEXPERIENCE Platform with the HTC Vive Business Edition - A Simulation-Based Flow for Broadband GaN Power Amplifier Design - ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones - COM modules with 7th generation Intel Core processors - CSEM ANNOUNCES BLUETOOTH 5-READY SILICON RF IP - Micron Launches Xccela™ Consortium to Promote High-Speed, Low Signal Count Octal Interface Bus and Ecosystem - Researchers Use World's Smallest Diamonds to Make Wires Three Atoms Wide - Microsoft, NXP Semiconductors, IAV and Auto Mobility Partners Showcase Innovations for Safe, Secure and Personalized Automated Driving at CES 2017 - Rohde & Schwarz presents new HLG test solution for latest-generation video consumer electronics - ADL Embedded Solutions Inc. Announces ADLVIS-1660 CoaXPress Solution - 7th Gen Intel Core - NXP Presents the World’s First One-Chip Solution for All Global In-Car Infotainment and Broadcast Standards - congatec presents new COM Express modules with Gen 7 Intel® Core™ processors (codename Kaby Lake) - KWS, Wavin and Total sign a cooperation agreement to develop the PlasticRoad - Building the E-GNSS engine for self-driving car - Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules - STMicroelectronics Peps Up Booming Social-Fitness Scene with Smart Motion Sensors for Better Accuracy, Longer Battery Life, and Faster Time to Market - Intel to Acquire 15 Percent Ownership of HERE - Qualcomm Brings Active Noise Cancelling Technology into Ultra-Small Earbuds and Headphones - First hologram video player to show your beating heart - European Semiconductor Sales up 2.5% in November - STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services - Qorvo® Introduces Multi-Protocol System on Chip for Smarter, More Secure Homes - Faraday Future - ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS - Rollout of Microchip’s MOST150 Technology at Audi Continues with Launch of the Q2 Compact SUV - Qualcomm and ODG Announce the First Augmented Reality Smartglasses Powered by the New Snapdragon 835 Processor - Sweden's launching a battery-powered taxi to help combat pollution - Intel Experts Share Insights on Tech Trends for 2017 and Beyond - IBM UK executive Dr Dave Watson appointed Commander of the Order of the British Empire (CBE) in the New Year 2017 Honours List - Flexible transparent conductor free of reflection and scattering in Nature Communications. - Siemens employees can charge electric vehicles for free - World's first solar panel road opens in Normandy village - Honda and Alphabet Inc.’s Waymo Enter Discussions on Technical Collaboration of Fully Self-driving Automobile Technology - Qualcomm Signs 3G/4G China Patent License Agreement with Gionee - Hitachi Automotive Systems and Clarion Developed a Remote Parking System Using Smartphone that Enables Driverless Parking - New development centre for autonomous driving - element14 launches ‘Safe & Sound’ Wearables Design Challenge - Scientists build bacteria-powered battery on single sheet of paper - Imec Collaborates with Google to Offer Cloud Access to Flemish Startups - More than 150 million Automotive Processors from Texas Instruments drive innovation in the automotive market, enabling a safer and more connected driving experience - Joint News Release - CES 2017: Magna and Innoviz Partner on LiDAR for Autonomous Driving Systems - Huawei selects Rohde & Schwarz for NB-IoT base station testing in line with 3GPP Rel. 13 - 6-Channel Logic/SPI/I²C µModule Isolator Delivers More Than 100mA Via Two Adjustable Power Rails - Toshiba Launches Multi-Function System Power IC for SSD - Renesas Electronics Delivers First Battery Management IC Solutions with Integrated Microcontroller and Large Current Support in Response to Accelerated Adoption of Lithium-Ion Batteries in Industrial Equipment - IR HiRel offers enhanced radiation hardened MOSFET family for mission-critical applications in space - World’s smallest radio receiver has building blocks the size of two atoms - ARM extends HPC offering with acquisition of software tools provider Allinea Software - Intel acquires ESA incubator company - Ericsson, Qualcomm and SK Telecom announce collaboration on 5G NR trials to accelerate wide-scale 5G deployments - Rohde & Schwarz is ready for Bluetooth® 5 - INDIGO ANNOUNCES SUCCESSFUL SERIES A FINANCING ROUND - Customer-oriented Service and acquisitions boost Würth Elektronik eiSos - NXP Introduces MiGLO Platform – Smartest Hearable Solutions on the Market - Total Memory Market Forecast to Increase 10% in 2017 - STMicroelectronics and Valencell Announce Collaboration on Highly Accurate and Powerful Biometric Sensor Platform for Wearables and IoT - ON Semiconductor Demonstrates Complete USB Type-C Solutions for Rapid Charging and High-Speed Data Transfer at CES 2017 - Rohde & Schwarz and Portrait Display release new HDR calibration capabilities - NXP and Huawei Collaborate to Deliver Mobile Transit Capabilities in More Smartphones in China - Unruly Taps IBM Watson To Improve Accuracy of Online Marketing Campaigns - LG’S NEWEST, MOST EXCITING 4K HDR MONITORS COMING TO CES 2017 - Number of IC Manufacturers Using 300mm Wafers Less than Half Using 200mm Wafers - Infineon at CES® 2017: Microelectronics define and enable tomorrow’s consumer trends - Ficosa Germany announces important follow-up order - BMW HoloActive Touch: An innovative operating concept for the interior of the future - ON Semiconductor Gains CES Recognition for Ingenuity in both Internet of Things & Wireless Medical Technology - BMW Group to Start Research with IBM Watson - Winner of the 2 minutes competition announced by Rohde & Schwarz - Nokia to acquire Deepfield to power network and service automation with real-time, big data analytics - A record for EPFL's startups: close to CHF 400 million raised in 2016 - Ilika leads IoT collaboration with Sharp and McLaren Applied Technologies - adidas Makes First 3D Shoe Available for Purchase with Exclusive Drop - Stackable 18-V input, 35-A PMBus converter delivers industry's highest density TI's DC/DC buck converter features remote voltage sensing and supports telemetry - Pagani Huayra BC Supercar Features Microchip’s MOST® Technology - Developing solar power and heat generating windows wins smart initiative award - NXP Extends Product Longevity for Popular High-Performance 8-bit Microcontrollers - Tiny Nano-Power Op Amp from STMicroelectronics Boosts Sensing Accuracy, Consumes Negligible Space and Power - New low-power PIC24 “GA7” microcontroller family now available - Molex CyClone Panel-to-Panel Connector System Rated for 10,000 Mating Cycles - Imec and Holst Centre Introduce World’s First Solid-State Multi-Ion Sensor for Internet-of-Things Applications - Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices - Vishay Intertechnology Three-Phase-Bridge Power Modules Deliver Efficiency and Reliability for Industrial Applications 130 A to 300 A Devices Offer Blocking Voltage to 1800 V and Thermal Resistance Down to 0.23 °C/W in 5-Terminal MTC Package - Qualcomm Intends to Collaborate with Google on Android Things OS to Facilitate Rapid, Scalable, Security-Focused IoT Development - Digi International Honors Digi-Key with 2016 Distributor of the Year Award; Acknowledges Strong Sales and Customer Growth - CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors - Nissha Printing Co., Ltd. Partners with TactoTek to Deliver Injection Molded Structural Electronics (IMSE) Solutions for Automotive and Home Appliances - Nokia and Vodafone trial cloud-based RAN architecture - Oculus Touch Now Available - New iCE40 UltraPlus™ Devices from Lattice Semiconductor Accelerate Customer Innovation in Smartphones and IoT Edge Devices - New-Tech Europe | Dec 2016 | Digital Edition - Volvo Cars appoints Henrik Green as Senior Vice President Research & Development - Dassault Systèmes Acquires Next Limit Dynamics, Developer of XFlow Technology - Hitachi unveils first UK built Intercity Express Train - Printable electronics - Further Improvement of Qubit Lifetime for Quantum Computers - Kickoff for Siemens Campus Erlangen - Netherlands to Cut Renewable Energy Subsidies, Focus on Other Areas - Ceremony marks step towards F-35 arrival at RAF Marham - Qualcomm Collaborates with Microsoft to Support Windows 10 Computing Devices on Next Generation Qualcomm Snapdragon Processors - VR Industry Leaders Come Together to Create New Association - ams’ new High Performance Analog technology A30 offers superior noise performance Enhanced 0.30µm process is ideally suited for ultra-low noise sensing applications and analog read-out ICs for consumer electronics, automotive, medical and IoT devices - LETI SHOWS THE WAY TO FABRICATING CMOS DEVICES FOR 5-NM NODE USING NANOWIRE TECHNOLOGY BRICKS - AIXTRON SE: Tender Offer by Grand Chip Investment GmbH / Prohibition of Acquisition of U.S. Business of AIXTRON by the U.S. President - congatec establishes new subsidiary in France - Five Suppliers Hold 41% of Global Semiconductor Marketshare in 2016 - VOKE, an Intel Company, and NFL to Make Game Highlights Available in Virtual Reality - Part-Time Scientists and Audi lunar quattro ready to head for the Moon - Electric motor from Siemens sets new world climb record - Lin Engineering Partners with CUI to Release a Highly Efficient and Reliable Stepper Motor and Encoder Combo - XP Power’s medical wall mount power supplies meet level VI and Tier 2 standards - Automated USB 3.1 Type-C Test Solution Offers Full Compliance Testing, Deeper Analysis Tektronix Combines Full SigTest Support with DPOJET to Improve Margin Analysis of SuperSpeed USB 3.1 Type-C Designs, Reduce Time to Market - Imec demonstrates record tunneling magnetoresistance for one of the world's smallest perpendicular magnetic tunnel junctions - Nano Dimension Delivers 3D Printer to a Fortune 100 Company - Micron Technology Completes Acquisition of Inotera Memories of Taiwan - Toshiba Launches 1.3A LDO Regulator for Mobile Devices with the Industry’s Leading-class Small Package - Miniature Multi-Sensor Module from STMicroelectronics Jumpstarts IoT and Wearable Designs - Siemens to host Germany-wide young researchers competition - Microsemi Receives “Best Quality Partner Award” from Huawei - Advantest Unveils New Pick-and-Place IC Handler to Improve Efficiency in High-Volume Semiconductor Manufacturing and Device Characterization - Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistor - Industry’s first 2.1-MHz Class-D amplifier transforms automotive audio design - Telefonica prepares for 5G with successful test of Nokia's next-generation fiber technology XGS-PON - Samsung Gear S3 Features Lonely Planet’s Travel App, Guides and Exclusively Designed Watchfaces - Student’s award-winning graphene battery could slash electric-car charging times - New tax rules to support e-commerce and online businesses - A European Defence Action Plan and "Clean Energy for All Europeans" - Semtech LoRa Geolocation Used in Ireland’s Second Busiest Port to Track Shipping Assets - BMW Group, Daimler AG, Ford Motor Company and Volkswagen Group with Audi & Porsche Plan a Joint Venture for Ultra-Fast, High-Power Charging Along Major Highways in Europe - NFU Mutual selects BAE Systems to safeguard against fraud - Swiss firm acquires Mars One private project - Milestone Aviation Names Daniel Rosenthal President and CEO - Maxim Reference Design Speeds Development of Wearable Heart-Rate and Pulse-Oximetry Monitors - Xilinx Launches Developer Zone to Accelerate Embedded Vision Innovation - Vicor introduces seven new DCMs in a ChiP package - Advanced common mode chokes enable streamlined designs - Analog Devices and China Electric Power Research Institute Collaborate to Improve Reliability of Smart Substations - “Winning Program” Industry Solution Experience at the Heart of European Space Launcher Program - STMicroelectronics Boosts Trusted Computing with New Advanced Security Modules - Plextek and CDE create immersive VR training solution for military and air force - BioMensio Ltd is set to develop a novel handheld bio-screening sensor and associated services with €2.5 million funding - Electrocomponents appoints new President of RS Components - LG LEVERAGES DISPLAY EXPERTISE, ENTERS MEDICAL IMAGING MARKET - Microsemi Enhances Software Capabilities for Integrated GNSS Master Portfolio for Mobile Edge Deployments - 40A µModule Regulator with 3D Stacked-Inductor Packaging Enhances Thermal Conduction for Cooler Operation - Samsung Helps Make Homes Smarter This Holiday Season - Tektronix Unveils Complete Solution for Volume, Surface Resistivity Measurements New Software Application Controls Keithley Test Instrumentation, Fixtures, Paving the Way to Faster, More Accurate and Repeatable Material Characterization - Vishay Intertechnology Automotive Grade Low-Profile, High-Current Inductors Feature Integrated E-Shield to Lower Costs and Save Space Available in 2525, 3232, and 4040 Case Sizes, Devices Provide -20 dB Electric Field Reduction at 1 cm - Cooperation between Würth Elektronik eiSos and Modelithics Simulation models for high-frequency inductances - ON Semiconductor to Debut First to Market, Truly Scalable Design Platform for Next Generation Wearable Technology at CES 2017 - Nokia and Elisa deliver first cloud-based Voice over LTE and Voice over Wi-Fi® service in Finland - IoT and Automotive to Drive IC Market Growth Through 2020 - MOST150 Technology Implemented in the New Aston Martin DB11 - SiFive Launches Industry's First Open-Source RISC-V SoC - Intel Extreme Masters Season 11 World Championship Returns to Katowice, Poland - ARM meets Generation Z demand for richer mobile VR and 4K streaming experiences - VTT’s spin off company first in the world to measure shopping intentions in physical stores - 5G THE MICROWAVE PERSPECTIVE - Contactless Connectivity Unshackles Robotic Systems Industrial manufacturing and production may be the first to benefit from a new way of thinking about connections - The Efficiency Trend in Motor Control - Fast Track: How Next-Gen Interconnects Enable High-Speed Data - The xPaaS Revolution and the Rise of BizDevOps - Solving signal integrity problems at very high data rates - Customized electronic ticket solutions simplify daily commute in Russian cities - Great results from testing UPM’s wood-based diesel in buses - SILICON LABS OPENS DOORS FOR SMART HOME ACCESSORY MAKERS WITH NEW SDK SUPPORTING APPLE HOMEKIT -- Bluetooth® Solution for Apple HomeKit Helps Developers Reduce Project Risk and Speed Time to Market -- - Head Quarter film post production relies on R&S CLIPSTER mastering system from Rohde & Schwarz for HDR workflows - IBM Triples Cloud Data Center Capacity in the UK - Security for the Smart Home: Infineon teams up with Chinese appliance manufacturers for solutions - MediaTek UltraCast Brings 4K Streaming to Connected Devices - The consumer of the future will use a mobile phone to monitor his environment - Leti Announces H2020 Project to Develop Si-photonics-based Transceivers for Low-cost, High-speed Data Communications - 100V, 600mA, Synchronous Step-Down Delivers Over 93% Efficiency - Qualcomm and Samsung Collaborate on 10nm Process Technology for the Latest Snapdragon 835 Mobile Processor - ROHM Semiconductor at SPS 2016: Arduino Shield for Easier and Faster Stepper Motor Driver Designs - Infineon complements iMOTION™ Modular Application Design Kit with two power boards - Microsemi Leverages 50 Years of Expertise With Launch of Cost-Effective, High Performance Plastic Packaged PIN Diode Control Devices - New Automotive Chips from STMicroelectronics Bring High-End Graphics, Audio, and Video to Entry and Mid-Range Vehicles - Renishaw and Dassault Systèmes pool expertise for the integrated AM experience - Panasonic Avionics selects Ericsson for 5G-ready core across multiple markets - Ultra-Compact Open Frame Ac-Dc Power Supplies are Ideal for Space-Constrained Applications - Maxim’s DeepCover® Secure Microcontroller Simplifies EMV Contactless Payment Terminals - Vishay Intertechnology Bidirectional 1500 W PAR® TVS Offer High Power Density to Save Board Space and Lower Costs - Codasip and UltraSoC deliver advanced RISC-V SoC analysis and debug - USB µModule Transceiver Protects Systems with 7500VRMS of Galvanic Isolation - ROHM Semiconductor awards Future Electronics as Distributor of the Year - MACOM Announces Definitive Agreement to Acquire AppliedMicro - Siemens celebrates 200th birthday of company founder Werner von Siemens - ALTAIR SEMICONDUCTOR OPENS IOT INNOVATION R&D CENTER IN FINLAND - After a successful fiscal year, Infineon raises its through-cycle target for the Segment Result Margin to 17 percent - New-Tech Europe | Nov 2016 | Digital Edition - Intel Unveils Strategy for State-of-the-Art Artificial Intelligence - Analog Devices Acquires Laser Beam Steering Technology from Vescent Photonics to Enable Mainstream Adoption of Automotive LIDAR Systems - The world’s smallest and lowest power consuming single transceiver solution features low-cost 24 GHz industrial radar chips from Infineon - Maxim's Ultra-Small hSensor Platform Enables Quick and Easy Design for Wearable Health and Fitness Applications - Rolls-Royce and VTT Technical Research Centre form a strategic partnership to develop smart ships - Computers Made of Genetic Material? HZDR researchers conduct electricity using DNA-based nanowires - The world’s smallest and lowest power consuming single transceiver solution features low-cost 24 GHz industrial radar chips from Infineon - Deknudt Mirrors and Group De Keyzer Turn to imec to Develop Innovative, New Mirror with Simultaneous Front and Rear Views - New SCADA decoder protecting M2M communication from malicious code now available from Rohde & Schwarz and CELARE - congatec introduces new Thin Mini-ITX and Pico-ITX boards with Intel's next generation of low-power processors (codename Apollo Lake) 30% more processing power and 45% more graphics performance in 100% industrial-grade congatec quality - congatec strengthens its sales and support organization in the UK and in Scandinavia - Siemens to expand its digital industrial leadership with acquisition of Mentor Graphics - Vishay Intertechnology RGB LED Provides Independent Control of Red, Green, and Blue Chips for Wide Color Range - Wurth Electronics Midcom Reveals New Isolated Buck Transformers for Maxim Integrated’s Converter - 5G subscriptions to reach half a billion in 2022: Ericsson Mobility Report - Future Electronics Announces expanded Worldwide Distribution Agreement for all NXP Semiconductors Products - Qualcomm Announces 5G NR Spectrum Sharing Prototype System - Microsemi Expands Radiation-Tolerant Space Product Portfolio with Highly Integrated LX7720 Motor Controller - Low-Power, Long-Range Radio Chip from STMicroelectronics Extends the Reach of the IoT, Adds Support for Sigfox Global Network - Paris Saint-Germain announces digital experience partnership with Ericsson - Five Top-20 Semiconductor Suppliers to Show Double-Digit Gains in 2016 - 32-bit PIC32MZ EF Microcontroller Portfolio Expanded to Include Extended Temperature Series - 30A, Scalable to 180A, µModule Regulator in 9mm x 15mm BGA Package - DELTA Microelectronics Expands UK Presence, Partners with Solution in Silicon Copenhagen - World’s fastest gas detector to prevent global warming - Xilinx Reconfigurable Acceleration Stack Delivers Fastest Path to 2-6x Compute Efficiency over FPGA Competition - Epson Shipping Samples of a New 16-bit Microcontroller with a Crystal Unit and High-Precision Temperature-Compensated RTC - STMicroelectronics Showcases Smart-Home Demo and Embedded System Solutions at Embedded Technology 2016 - Samsung Electronics to Acquire HARMAN, Accelerating Growth in Automotive and Connected Technologies - IBM Launches Experimental Platform for Embedding Watson into Any Device - Xilinx Unveils Details for New 16nm Virtex UltraScale+ FPGAs with High Bandwidth Memory and CCIX Technology - Smartphone Unit Shipments Forecast to Grow at Single-Digit Rates Through 2020 - Siemens and Bentley Systems Advance Strategic Alliance Including Joint Investment Initiatives - MicroVision and STMicroelectronics to Co-Market MEMS Mirror-based Laser Beam Scanning Solutions - Intersil Expands Single-Chip USB-C Buck-Boost Battery Charger Family - RS Components signs global distribution agreement with Adafruit to supply electronics and computing products for makers and hobbyists - XP Power signs global distribution agreement with RS Components and Allied Electronics - Rohde & Schwarz presents the first over-the-air power measurement solution for 5G and wireless gigabit components - Qualcomm and Preh Sign Commercial Wireless Electric Vehicle Charging License Agreement - Analog Devices Makes MEMS Switch Technology a Commercial Reality - 500 Drones Light Night Sky to Set Record - RS Components introduces high-performance LattePanda Windows-based computer board targeting professional engineers and makers Cost-effective LattePanda from DF Robot offers a full Windows 10 single-board computer and extensive memory options - New light sensor to spot deadly bacteria in minutes - Intersil Announces Industry’s First 6-Phase Bidirectional DC/DC Controller for Automotive 12V-48V Power Supply Systems - 100MHz SPI Isolators Facilitate Faster Data Converters - Wireless Power Design Kit by Würth Elektronik eiSos and ROHM Semiconductor Faster integration of wireless power supply with 15W - Industry’s First Seven-Port USB 3.1 Gen1 SmartHub IC for USB Type-C™ Now Available from Microchip - Industry’s Lowest-Power Vehicle Access Solution for Smart Keys and Wearables - Electronica: VersaSense presents MicroPnP: the world’s first plug-and-play IoT platform for Sensing-as-a-Service based on SmartMesh IP™ from Linear Technology - Components and Services for Electronics of the Future - Semiconductors from Infineon connect the real and the digital worlds - Digi-Key to Give Away InstaLab Kits and e-bikes on Student Day During electronica 2016 in Munich - Rohde & Schwarz demonstrates test solution for remote keyless entry systems for vehicles - Digi-Key to Demonstrate Engineering Tools and Products for IoT Innovation at electronica in Munich - Valens and Daimler Partner to Optimize In-Car Connectivity - Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions - Samsung Pay Launches Partnership with Sberbank - Microchip Launches New Generation of 8-bit AVR® MCUs with Core Independent Peripherals - Semiconductor-free microelectronics are now possible, thanks to metamaterials - 7,000th hybrid-electric system for buses delivered - Driverless-vehicle options now include scooters - Sigfox’s ecosystem delivers the world’s first ultra-low cost modules to fuel the Internet of Things mass market deployment - Faster programs, easier programming New system lets nonexperts optimize programs that run on multiprocessor chips. - ON Semiconductor Launches Advanced, Integrated Solutions for Power Management and Control at Electronica 2016 - TactoTek Joins Linear Technology at Electronica to Highlight Silicon LED Driver Solutions in Injection Molded Structural Electronics - Maxim’s Octal High-Side Switch and Driver Safely Demagnetizes Any Inductive Load for Industry 4.0 Applications - NXP and DAF Trucks Commit to Set New Benchmark in Truck Platooning: 30 Times Faster than Human Reaction Time - Industry’s first global shutter 48Mpixel CMOS image sensor from CMOSIS supports 8k image resolution at 30 frames/s - Vector facilitates analysis and test of sensor protocols PSI5 and SENT - EBV Elektronik and Maxim Integrated Sign EMEA Distribution Agreement - How to Address the Challenges of Serial Link Design and Analysis - Lattice Semiconductor to be Acquired by Canyon Bridge Capital Partners, Inc. for $1.3 Billion - Laser particles could provide sharper images of tissues - Manufacturing of the Type 26 Global Combat Ships to start in summer 2017 - Mobile video viewing up over 200 hours a year since 2012 - Scale from value line to high performance with TI's new unified memory 16-bit microcontrollers (MCUs) - NXP and DAF Trucks Commit to Set New Benchmark in Truck Platooning: 30 Times Faster than Human Reaction Time - NI Provides SDR Technology for DARPA Spectrum Collaboration Challenge - Miniature 2 Watt DC-DC converters for use in medical applications now available - Infineon speeds up in-vehicle communication and makes it secure and reliable with CAN FD transceivers - STMicroelectronics Combines Power and Simplicity in Intelligent Motion-Control Device for Smart Industry and High-End Consumer Electronics - New probe for Rohde & Schwarz oscilloscopes measures voltages in the millivolt range - e2v reveals the world’s first K-band capable Digital-to-Analog Converter - Analog Devices’ High-Resolution, Low-Power SAR ADC Ensures Shorter Test Times and Product Development Cycles - Intel to Acquire VR Startup VOKE for Immersive Sports - Microsemi Announces Aerospace Power Core Module With Integrated FPGA and Hybrid Power Drive Stage - THUNDERBOARD SENSE KIT FROM SILICON LABS INSPIRES IOT DEVELOPERS TO CONNECT EVERYTHING - New Tektronix DisplayPort Type-C Transmitter Test Solution Slashes Compliance Test Times Reduces DisplayPort Compliance Test Time from Up to 16 Hours to Less Than 6 hours - Significantly Faster than Other Competitive Offerings - ON Semiconductor Expands PYTHON Family of CMOS Image Sensors with Compact, SVGA Offering - CUI Introduces High Performance Dc Fan Line to Bolster Thermal Management Portfolio - RS Components signs authorised global distribution agreement with Power Integrations, boosting support for power supply designers - A solid fiscal year for Rohde & Schwarz thanks to innovative strength and even greater customer focus - Nokia finalizes its acquisition of Alcatel-Lucent, ready to seize global connectivity opportunities - Valens and STMicroelectronics Join Forces to Revolutionize In-Car Connectivity - Tesla Just Unveiled the Affordable and Gorgeous-Looking Solar Roof You’ve Been Waiting For - Maxim’s Ultra-Small hSensor Platform Enables Quick and Easy Design for Wearable Health and Fitness Applications - Analog Devices Acquires Innovasic - Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates - High resolution detectors to create safer X-ray diagnosis - e2v advanced CMOS image sensor solutions now available with new state-of-the-art TowerJazz technology - New Aistin Blue Sensor Platform Co-Developed by iProtoXi and ROHM Semiconductor / Kionix - Analog Devices’ RS-485 Transceivers First to Meet Stringent IEC Surge Standards - Automotive Systems Forecast to Show Strongest Growth Through 2020 - IoT promises smarter health - Switching Aircraft Interior Systems to Fibre Optics - Measuring Heart Rate and Blood Oxygen Levels for Portable and Wearable Devices - Meeting Functional Safety Requirements Efficiently Via Electronic Design Tools and Techniques - Single-use flow sensor for proximal measurements in ventilation - Ultrahaptics introduces a Development Kit for evaluation and prototyping of mid-air haptics in touchless gesture controls - Gilat Unveils Revolutionary Small-Cell-Over-Satellite Solution for 3G and 4G Coverage - Nokia conducts Finland's first commercial IoT trial using NB-IoT technology - GE Healthcare enhances single-use manufacturing capabilities with facility expansion and automation - Core Independent Peripherals Now Available on PIC18 Family - e2v image sensors launched aboard PerúSAT-1 Earth Observation Satellite - Intersil Unleashes Industry’s First Digital Multiphase PWM Controllers with AVSBus and Synthetic Current Control - Aquarius Spectrum is Named in the 2016 Global Cleantech 100 Ones to Watch List - TI unveils the industry’s first single-chip 60-V eFuse with reverse polarity protection - Qualcomm and Lumen Sign Commercial Wireless Electric Vehicle Charging License Agreement - ARM meets Generation Z demand for richer mobile VR and 4K streaming experiences 31 October 2016 - Core Independent Peripherals now available on Microchip PIC18 family - Next step in electric offensive: Mercedes-Benz to build first electric car of the new EQ product brand in its Bremen plant - Industry’s First Automotive-Grade LIN System-in-Package Solution Including a Microcontroller with Touch Hardware Support - Philippine Coast Guard relies on Rohde & Schwarz equipment for its new patrol boats - Microsoft introduces Surface Studio and the Windows 10 Creators Update - 12A Ultrathin µModule Regulator Configurable as Quad, Triple, Dual or Single Output Can Be Placed on Backside of PCB - Online prototyping made easy with Infineon Designer - New Wireless Communication LSI Compatible with Smart Meters Worldwide - Advantech and ARM partner on end-to-end IoT Platform, from device to cloud - UltraSoC enhances support for ARM with industry first AMBA 5 CHI NoC monitor - Murata's dedicated starter kits speed design in RFIC circuits - Analog Devices and Dell EMC Collaborate on IoT Solution for Monitoring Real-Time Health and Safety of First Responders in Dangerous Conditions - TI’s new USB Type-C™ and Power Delivery 3.0 devices improve power and data transfer, signal quality, and circuit protection - NI Announces High-Speed, High-Resolution, High-Voltage Oscilloscope - congatec presents new Qseven and COM Express Compact modules based on Intel's new low-power processors (Codename Apollo Lake) - Linear Technology Announces QML Class V Standard Microcircuit Drawings for Popular Radiation Hardened Components - NI Demonstrates Autonomous Vehicle Test Solutions - AURIX™ microcontroller TC3xx family of Infineon fuels automated driving and electromobility - Rohde & Schwarz adds the PiMPro Tower Series PIM analyzer from CCI to its mobile network testing portfolio - ON Semiconductor Imaging Technology Plays Integral Role in World’s First Multi-Aperture Computational Camera - Tektronix Releases New 100G Link Training Tool for Debugging Datacenter Technologies Expanded Analysis Software for DPO70000SX Series Oscilloscopes Helps Engineers Debug Complex 100G Datacenter Interconnects - Microchip Launches Its First Sigfox FCC-certified Long-Range RF Transceiver and Connectivity Development Kits for IoT Applications - e2v’s new CMOS sensors feature the world’s smallest true global shutter - New Intel Atom Processor E3900 Series: Enabling Next Generation of Smart and Connected IoT Devices - Intel Capital Announces $38M of New Investments in 12 Technology Startups to Kick Off Annual Global Summit - Wi-Fi®-enabled e-paper displays offer fast, simple, flexible updating - Ericsson's Board names Börje Ekholm new President and CEO - ARM accelerates secure IoT from chip to cloud - KT and Samsung Succeed in World’s First 5G Connection through End-to-End 5G Networks - NI Partners With IBM and SparkCognition to Advance the Industrial Internet of Things (IIoT) - 3-D-printed structures shrink when heated - SMD resistors from TT Electronics withstand high surge conditions New smaller footprint size saves space on PCBs and assemblies - Under the roof of the TDK Group, Micronas advances the magnetic sensor business - A 10 million euro round of financing for the start up Coorpacademy - Smart Factory Hackathon: Talented data-science specialists develop solutions for the factory of the future - Tektronix Introduces Keithley S540 Power Semiconductor Test System Fully-Automated, High-Speed Wafer-Level Parametric Test Solution Targets the Latest Power Semiconductor Devices Including SiC and GaN up to 3kV - Renesas Electronics, Express Logic, and IAR Systems Collaborate to Extend Renesas Synergy™ Secure IoT Platform Solution Based on the New ARMv8-M Architecture Technology Leaders in Embedded Solution Space Bring Strong Security to IoT; Will Showcase Leading-Edge Technologies at ARM TechCon 2016 - Cadence Reports Third Quarter 2016 Financial Results - Analog Devices Collaborates with ARM to Improve Security and Energy Efficiency for IoT Connected Devices - Nokia enables Globe Telecom's move to Cloud and IoT-ready networks using 4.5G Pro, Carrier SDN, IP and Optical technologies - HaRFest project successfully develops printed energy harvesting device for the next generation of smart packaging - Epilog Technology Improves Diagnosis of Epilepsy using Automated EEG Analysis - Getting Connected to Increase Productivity in Industrial Applications - Considerations In Selecting The Right Contact For Your Interconnect System - Using PXI Modular Instruments and LabVIEW for Secondary Surveillance Radar ATE - Connect more with TI's portfolio of wireless connectivity modules for Industry 4.0 and IoT designs - Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments - New-Tech Europe | Oct 2016 | Special Edition For Electronica 2016 - ams schedules 2017 multi-project wafer starts for analog foundry customers - All Tesla Cars Being Produced Now Have Full Self-Driving Hardware - St. Peter's Square radiates in new LED light - STMicroelectronics Delivers Record Performance and Advanced Secure Services for the IoT with New STM32 Microcontroller Enhancements - Analog Devices and Linear Technology Announce Antitrust Clearances in the United States and Germany - New Power Management IC Optimized for Intel’s  Next-Generation Apollo Lake Chip Architecture - Rohde & Schwarz to present T&M solutions for the latest technologies at electronica 2016 - Würth Elektronik eiSos and Texas Instruments hosted the second INNOposium - New technologies for piloted driving – Audi participating in “Digital Motorway Test Bed” - Stamped Spring Pin Socket for 0.65mm pitch NXP's RCPBGA - WACKER Presents Product and Technology Innovations for Key Industries - Infineon is back on Mars - Tesla and Panasonic to Collaborate on Photovoltaic Cell and Module Production in Buffalo, New York - Qualcomm, Telstra, Ericsson and NETGEAR Announce World’s First Gigabit Class LTE Mobile Device and Gigabit-Ready Network - New memory offering from Microchip offers unlimited endurance with safe data storage at power loss - Samsung Starts Industry’s First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology - New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio - Timing-Architects and Vector join Forces for Multi-core Development - First dual-port CSI-2 quad deserializer hub enables faster, more flexible ADAS applications - Avnet Completes the Acquisition of Premier Farnell plc - HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices - Industry First Intelligent Charge Controller from ON Semiconductor Meets the Exacting Demands of Next Generation Power Banks - ARMOR LAUNCHES PRODUCTION OF FLEXIBLE PHOTOVOLTAIC FILMS - Avery Dennison and NXP lead the industry in more sustainable RFID production - New partnership to help research become a reality - Orange Tree announces Gigabit Ethernet FPGA module with TCP/IP Offload Engine - Tektronix Brings CAN FD Support to Mixed Domain Oscilloscopes - Precision Tactical Grade MEMS IMU Delivers Breakthrough System Level Advancements for Positioning and Navigation Applications - 2016 IC Market Forecast Raised from -2% to +1% - Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package - Efficient 360-500W baseplate-cooled half-brick DC-DC converters - Highly Integrated AFE for Power Quality Monitoring Saves Significant Design Time and Cost Versus Custom Development - Nokia and SK Broadband connect first customers with fastest fiber technology - Bendable electronic paper displays whole colour range - RC-E discrete IGBTs from Infineon allow for drop-in replacement with benchmark for price/performance - FlexEnable and ISORG reveal highest resolution flexible fingerprint sensor - Sensirion and Clarity collaborate on PM2.5 sensor technology - GE Renewable Energy to supply new generators to Mottec hydropower plant in Switzerland - Qualcomm Files Actions Against Meizu in the United States, Germany and France - Nokia Gigabit Smart Build makes ultra-broadband network transformation easier and more predictable - First production site of Mercedes-Benz Cars in Poland: Contract signed in Warsaw: Daimler to build new engine plant in the Polish city of Jawor - Antenova announces Inca – small antenna with high gain at 433MHz - Mentor Graphics Partnership with RTI Enables Secure Embedded Solution for Industrial Internet of Things (IIoT)  - Microsemi Space Solutions On Board Juno Spacecraft - AIRBUS STANDARDIZES ON STRATASYS ADDITIVE MANUFACTURING SOLUTIONS FOR A350 XWB AIRCRAFT SUPPLY CHAIN - TT Electronics’ zero ohm link is perfect for compact designs - Digi-Key Focuses on Interaction, Collaboration at electronica 2016 in Munich - New automotive lighting revolutionizes road safety - Murata to acquire IPDiA, a leader in high performance silicon capacitors - Samsung Mass Produces Industry’s First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology - VTT develops combustion technologies for biomass – aims at negative emissions - Companies Maximizing 300mm, 200mm Wafer Capacity - CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things - Achronix Announces Immediate Availability of Speedcore Embedded FPGA IP for SoC Acceleration - ROHM Semiconductor introduces SiC technology into Formula E - Nokia expands G.fast deployment options, facilitates massive roll-outs for operators - Analog Devices’ Low Power AFE Enables Smaller, Lighter Wearable Health Devices with Longer Battery Life - Toshiba Introduces Single-Chip, Low Pin-Count MCUs for Control of Multiple Motors - Intersil Unveils 14-Channel Programmable Gamma Buffer for Infotainment and ADAS Displays - STMicroelectronics Curbs Analog Appetite for Board Space with Sub-1mm2 Micropower Rail-to-Rail Comparator - TECAT Introduces New Wireless Temperature Measurement and Monitoring System for Automotive Brake Rotors - OptiMOS™ 5 150 V delivers a breakthrough reduction in on-state resistance and reverse recovery charge - XP Power launches world’s smallest 40 Watt AC-DC open frame power supply - Samsung Introduces LED Modules Based on Chip Scale Packaging for Spotlights and Downlights - Ricoh launches 34V / 14A high-efficiency step-down DC/DC converter for automotive applications - Murata introduces DC-DC converter with world’s highest power density - Wurth Electronics Midcom Announces New Micropower Flyback Transformers in Partnership with Linear Technology - congatec presents first COM Express Type 7 modules with Intel Xeon D processors - OptiMOS™ 5 150 V delivers a breakthrough reduction in on-state resistance and reverse recovery charge - Samsung Electronics Introduces World’s First Tizen-Powered Premium Displays - Run All Simulations from a Single Environment - Thinfilm Secures State-of-the-Art Fabrication Facility in Silicon Valley to House New High-Volume, Roll-to-Roll Manufacturing Line - New kind of supercapacitor made without carbon - Infineon strengthens leading position in automated driving through acquisition of Innoluce BV - Nokia joins the UK's pioneering programmable city initiative in Bristol - IAR Systems and VORAGO Technologies enable development of embedded systems in harsh environments - Single Board Computing Platform for Industrial Design - THE NEW RENAULT CONCEPT CAR TREZOR - electronica 2016 – Show Preview - ROHM Semiconductor Introduces Innovative Products and Concepts for Power & Energy Management - Dassault Systèmes Completes CST Acquisition - Lam Research Announces Termination of Proposed Combination With KLA-Tencor - The Netherlands invests in the future of its Patriot Integrated Air and Missile Defense System - Electric mobility: Mercedes-Benz flips the switch: Generation EQ – mobility revisited - Micronas presents a new entry-level sensor solution with advanced diagnostic capabilities - STMicroelectronics Boosts Access to High-Performance Embedded Design with New STM32F7 MCU Lines and Ecosystem Extensions - NXP Introduces Multisensory Automotive eCockpit Platform to Advance Multimedia Experiences in Future Cars - Peregrine Semiconductor’s Rapidly Growing UK Team Moves into Larger Office Facility - Company Provides Both the Silicon and Software Necessary to Secure Important Industry Certification - Samsung to Acquire Viv, the Next Generation Artificial Intelligence Platform - Orange and Ericsson partner for 5G - 100MHz to 40GHz RMS Power Detector Offers 1dB Accuracy & 35dB Dynamic Range - Toshiba Introduces the OCZ TL100 SATA SSD Series - TT Electronics set to revolutionise the soldier wearables market with its auto‑aligning and self‑coupling textile-mounting garment connector - Maximize Productivity for Industry 4.0 Applications with Maxim’s Pocket IO™ PLC Development Platform - STMicroelectronics Extends Automotive ECU Miniaturization by Shrinking in Half Grade-0 Analog ICs - Analog Devices’ MEMS Accelerometers Enable Early Detection of Structural Defects - Renesas Electronics Introduces Low-Power RL78/G11 Microcontrollers to Accelerate Prototyping and Development for Compact Sensor Hub Applications in Industrial, Healthcare and Agricultural Industries - Introducing industry's first fully integrated DDR memory power solution - Economical Open Frame Ac-Dc Power Supplies Deliver up to 280 W in a Compact Package - Intel’s Stratix 10 FPGA: Supporting the Smart and Connected Revolution - Low ohmic value current sensing resistors from TT Electronics reduce design footprint - Qualcomm Is Said to Be in Talks to Buy NXP Semiconductors - LETI TO TACKLE TOMORROW’S RESEARCH STRATEGIES WITH STANFORD SYSTEMX ALLIANCE - UK Government commits £1.3 billion funding for Successor Submarine programme - 3-D-printed robots with shock-absorbing skins - Autotalks was selected by DENSO for a Mass Market V2X System - F-Cell technology from Nokia Bell Labs revolutionizes small cell deployment by cutting wires, costs and time - ABB and Microsoft partner to drive digital industrial transformation - Cypress Semiconductor extends Future Electronics franchise to include IoT product line acquired from Broadcom - HMicro and STMicroelectronics Announce Wearable Wireless Biosensor Platform that Frees Patients from Cables - Juniper Research recognizes Gemalto as an established leader in fast-growing IoT market - HDL Design House Opens New Office in Thessaloniki, Greece - Leti and the Institute for Information of Taiwan (III) have announced an agreement for mutual exploration - NXP Doubles Its Portfolio of MagniV Microcontrollers Serving the Growing Global Automotive Motor Control Market - Faurecia Invests in Canatu and Deepens Ties by Choosing Canatu as Innovation Partner - Silicon Labs Acquires Leading RTOS Company Micrium - Imec and Holst Centre Present the World’s Most Energy-Efficient Biomedical Sensor Hub for Wearable Health Applications - New Design Contest Sponsored by Cypress and Hackster Encourages Developers to Build Innovative Sensing Applications - X-FAB to Acquire Assets of Altis Semiconductor - Paris Fashion Week: Intel Enters European Market with Designer Hussein Chalayan - TTI Europe achieves highest sales growth for Harwin across new and existing customers to win European Sales Excellence Award 2015-2016 - e2v image sensors capture Rosetta’s final moments - VTT’s encryption method takes authentication to a new level – improves privacy protection - e2v wins contract to supply customised image sensors for weather satellites to Leonardo-Finmeccanica - Qualcomm Snapdragon 600E and 410E Designed for Embedded Computing, Internet of Things Applications Now Widely Available - New handheld cognitive electronic warfare technology headed for DARPA - Human Brain Project: Pilot Systems for Interactive Supercomputer Launched - Improve Digital Support of Battery Charging and DC-DC Conversion Applications with New Digitally Enhanced Power Analog Controllers from Microchip - Enfucell and Molex have signed a license agreement for manufacturing Enfucell SoftBattery® - Compact medium-power transmitter from Rohde & Schwarz offers maximum efficiency and reliability in a minimum of space - Analog Devices’ Rx/Tx Converters Enable More Reliable Mobile Infrastructure for High-Quality Phone Service - Vicor Corporation Introduces New 60V Cool-Power ZVS Buck-Boost Regulators - STMicroelectronics Enhances Access Lines of STM32F4 High-Performance Microcontroller Series, including New 125°C Devices - Tektronix Boosts Video QoE Monitoring Scalability, Efficiency and Reliability - Epson Shipping Samples of a New 32-Bit Microcontroller with an ARM® Cortex®-M0+ Processor - e2v and GaN Systems global alliance extends the power of GaN to Aerospace and Defense industries - Toshiba Announces Qi-certified 15W Wireless Power Transmitter System - NI Releases HIL Software Geared to Autonomous Vehicle Testing - Analyzing CXPI interfaces for automotive applications using oscilloscopes from Rohde & Schwarz - Microchip Introduces the Industry’s Smallest-Package and Lowest-Power MEMS Oscillators in DSC6000 Family - ON Semiconductor Introduces Next Generation Fan Motor Drivers to Simplify and Accelerate Appliance Design - Stacked Perovskite/CIGS Solar Module Achieves Unprecedented Efficiency at 17.8 Percent - Nokia and Telecom SudParis join forces to show advantages of ultra-broadband networks to French municipalities - 3D-nanoprinting to turbocharge microscopes - Nokia and Europe's first drone-based Smart City traffic management test facility collaborate to ensure safe global aerial operations - Leading-Edge Leads the Way in Pure-Play Foundry Growth - GE Introduces the Digital Mine to Boost Efficiency and Drive Improved Safety and Productivity - Telecommunications and automotive players form global cross-industry 5G Automotive Association - Mellanox: Using Palladium ICA Mode - Sono Motors crowdfunds $200k for its out-there solar-powered EV - Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs - Radar echoes from a generator – innovative testing solution for the lab and service - RED – new radio equipment directive for Europe - Microchip Introduces the Industry’s Smallest Package and Lowest Power MEMS Oscillators in DSC6000 Family - NewWind is revolutionizing energy production - NIKE HYPERADAPT 1.0 MANIFESTS THE UNIMAGINABLE - Ericsson manages Wi-Fi connectivity for high-speed trains in Germany - The Switch, a Yaskawa company, to acquire Wärtsilä Drives’ products - GOPRO UNVEILS HERO5 AND KARMA - Merger between centers imec and iMinds completed - 2016 a Sequel to Last Year’s M&A Mania - TactoTek Secures In-Mold Structural Electronics (IMSE) Lighting Patent - MosChip Semiconductor Technology Limited announces acquisition of three companies and adds strength into IoT - GEMALTO AND VALEO PARTNER TO TURN YOUR SMARTPHONE INTO A SECURE CAR KEY - Heliatek raises €80 million - Arrow receives Micron Distribution awards - Intersil Announces Industry’s First Four-Channel Video Decoder with MIPI-CSI2 interface for Automotive Around View Systems - Optical fiber transmits one terabit per second - Evince secures £0.75 million of new investment for breakthrough diamond-based electronics - UltraSoC supports RISC-V: “the Linux of the semiconductor industry” - Avnet Agrees to Sell Technology Solutions Business Unit to Tech Data for $2.6B - 36V, 2A Monolithic Synchronous Step-Up Silent Switcher LED Driver - Vishay Intertechnology Low-Profile, High-Current Inductors Optimized for High-Frequency VRM10.0 Applications - Digital LED driver ICs from Infineon with flicker free control and low stand-by power - Tektronix Enhances Optical Modulation Analyzer Software Enables Leading Edge Coherent Research on Multi-Channel Optical Transport Systems - STMicroelectronics Drives Power-Module Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers - ARM enables autonomous vehicles with its most advanced safety processor - SP Devices launches the world’s first 14-bit resolution digitizer for Optical Coherence Tomography (OCT) applications - ON Semiconductor Expands Breadth of Options for Low-Light Industrial Imaging Applications - ADI Expands Portfolio of High Performance RF and Microwave Standard Modules to Facilitate Rapid Prototyping and Faster Time to Market - CUI’s External Ac-Dc Power Supplies Now Meet EU’s CoC Tier 2 Efficiency Standards - NI Demonstrates mmWave 802.11ad Wireless Test Technology - Ericsson appoints Ulf Ewaldsson as head of strategy and technology - RS Components brings engineering to life with ‘RS Live’, a mobile innovation experience - Considerations In Selecting The Right Contact For Your Interconnect System - Mastering station from Rohde & Schwarz looks to the future with HDR, floating point processing and enhanced IMF workflows - Vishay Introduces New Analog Switch Product Families Built on Advanced Silicon Process That Improves Analog Circuit Performance and Reliability - DACD Solution Simplifies Smart LED Lighting Design - Terminal Blocks Highlight & Heavy Duty Connectors - New-Tech Europe Magazine | September 2016 | Digital edition - The lifecycle of an idea - Qormino® - Complex embedded design made quick, easy and enduring - Adapting Non-Sealed Surface Mount Parts for Hi-Rel Customer Assembly Processes - Smarter algorithms improve stepper-motor performance - Extending Product Lifespan Using Wear-Leveling - Exar Launches High-Speed, Small Footprint RS-485 Receivers for High Performance Industrial Applications - Microsemi Announces New Thermally Improved Chip Scale Atomic Clock Devices with Full Operating and Storage Temperature - Premiere in Berlin: the ICE 4 has arrived - NetEase creates gamers’ paradise with Enlighten real-time global illumination technology - Mellanox Technologies and Oclaro Team Up to Connect 100Gb/s PSM4 Silicon Photonics to Next Generation 25Gb/s LR Transceivers for Servers and Storage - Ericsson and Translink simplify commuting across the Netherlands - A mobile device developed by VTT detects irregular heartbeats and helps to prevent cerebral infarctions - CPI joins forces with leading European industrial biotechnology pilot facilities to improve Europe’s innovation capacity - Nokia Bell Labs, Deutsche Telekom T-Labs and Technical University of Munich achieve speeds of 1 Tb per second in groundbreaking optical technology trial - STMicroelectronics Empowers Wireless IoT-Device Developers with New LoRa™ Kit Leveraging STM32 Microcontroller Ecosystem - Rohde & Schwarz supports 5G signal generation and analysis based on Verizon 5G open trial specifications - New test to improve commercial viability of printable electronics - GE’s Steam Power Systems to deliver $1.9 Billion Contract for Hinkley Point C Nuclear Power Station in the United Kingdom - University of Maryland Achieves First Flight of a Solar-Powered, Piloted Helicopter - 50Msps, 16-Bit DAC Demonstration Board Has Mojo - ROHM’s Isolated Power Supply Control ICs for Auxiliary Supply in High Power Industrial Applications - New Vishay Intertechnology Series of Wide Terminal Thin Film Chip Resistors Features 1 W Power Rating in Compact 0612 Case Size - Encoding and multiplexing solution from Rohde & Schwarz with new features: HDR encoding now also for HDTV - Camera that sees invisible danger to make land, sea and air safer - From Leaf to Tree: Large-Scale Artificial Photosynthesis - e2v and Peregrine Semiconductor introduce ultra-low phase noise FRAC-N Phase-Locked Loop (PLL) for commercial space applications - ERC Starting Grant to revolutionize the efficiency, cost and stability of thin-film solar cells - Nissan unveils new Intelligent Mobility prototypes in Rio de Janeiro - FORD TARGETS FULLY AUTONOMOUS VEHICLE FOR RIDE SHARING IN 2021; INVESTS IN NEW TECH COMPANIES, DOUBLES SILICON VALLEY TEAM - The ultimate in luxury: Vision Mercedes-Maybach 6 - CellRobot - Hundreds of Robots in One - Epson Partners with DJI to Create AR Smart Glasses Solutions for Piloting Unmanned Aerial Vehicles - TOPAs European Consortium for buildings energy consumption management accomplishes first pilot site installation - Solar Panels Gain 30% Additional Power with Maxim’s Cell-String Optimizer - Rockwell Automation Acquires Automation Control Products to Deliver Simple and Secure Centralized Visualization and Mobility Solutions - Toshiba’s “Easy Prototyping” Solution for Custom SoC Development Platform Reduces Need for Customer’s Own Design Resources - Microchip Debuts New Development Board for Designing with 16-bit and 32-bit PIC® Microcontrollers - Microsemi Announces New Addition to its Imaging/Video Solution to Support Growing Demand for MIPI CSI-2 Interfaces - TI unveils first ultra-low power dual-band wireless MCU in production - Renesas to Acquire Intersil to Create the World’s Leading Embedded Solution Provider - DenciTec® – PCB technology that takes miniaturization to the next level - New Fabric Uses Sun and Wind to Power Devices - 100V No-Opto Flyback Regulator Delivers Up to 5 Watts in TSOT-23 Package - XP Power launches digitally controlled 1U configurable power platform - Data Acquisition System Protects Smart Grid Equipment from Harmful Faults While Improving Power Delivery - Encoding and multiplexing solution from Rohde & Schwarz with new features: HDR encoding now also for HDTV - Mary McDowell Named CEO of Polycom Effective as of the Closing of the Acquisition of Polycom by Affiliates of Siris - UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities - Ericsson and BT showcase cutting edge live HEVC 4K broadcast at IBC 2016 - IBM and Harrow Council to bring Watson Care Manager to individuals in the UK - The next level in operating cost savings – the new high-power transmitter from Rohde & Schwarz - Microsemi Announces Power-Over-Ethernet Multiplexer Offering Compact, Cost-Effective Solution for 2.5 Gbps Device Installations - Microsemi Announces LiteFast Serial Communication Protocol to Reduce Customers’ Design-In Efforts and Time to Market - Mocana Security of Things Platform™ integrates support for the Infineon OPTIGA™ TPM - TI reference design adds Wi-Fi capability to electric vehicle charging stations - 1” x 1” Isolated Dc-Dc Converters Offer High Efficiency in a Rugged, Encapsulated Package - Advantest’s T5851 Tester Wins Best of Show Award at Flash Memory Summit - Intel and TPG to Collaborate to Establish McAfee as Leading Independent Cybersecurity Company Valued at $4.2 Billion - €2.65 MILLION EUROPEAN PROJECT TO SUPPORT FLEXIBLE SEMICONDUCTOR ADOPTION IN ASIA - Auto, aerospace industries warm to 3D printing - An EPFL startup makes residential solar panels twice as efficient - Updated Semiconductor Outlook for Internet of Things - Historic Dell and EMC Merger Complete; Forms World’s Largest Privately-Controlled Tech Company - Argentinian regulatory authority chooses Rohde & Schwarz monitoring system - Infineon secures new smart wearables for Taiwanese iPASS transport ticketing system - Audi to become involved in Formula E - NI Lowers Semiconductor Test Cost With RF Measurement Enhancements for the STS - Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles - Intel to Acquire Movidius: Accelerating Computer Vision through RealSense for the Next Wave of Computing - Qualcomm and AT&T to Trial Drones on Cellular Network to Accelerate Wide-Scale Deployment - AutoLap™ is Named “Innovation of the Year” - IAGO - a platform for businesses to create chat bots without writing a single line of code. - Microchip enables fast, precise measurement of single-cell growth - Controlling complex multicamera recordings with the ingest and playout platform from Rohde & Schwarz - Nokia and Tele2 Russia collaborate on developing 5G technologies - IBM Watson Powers Wave of Innovation in Consumer Electronics - GE Plans to Invest $1.4B to Acquire Additive Manufacturing Companies Arcam and SLM; Accelerates Efforts in Important Digital Industrial Space - Samsung Partners with Emerging German Artists to Produce ‘The Origin of Quantum Dot’ Exhibition at IFA 2016 - STMicroelectronics Keynotes on Increasing Adoption of MEMS in IoT and on Future Smart Cars at SEMICON Taiwan - Nokia announces AirScale-powered 4.5G Pro and 4.9G to establish smooth path for operators to 5G - Hitachi begins Proof of Concept tests of “EMIEW3” humanoid robot at Haneda Airport - DSP Group and Sercomm Announce New Series of ULE IoT Smart Home Sensors - NXP and Midea Introduce New Smart Kitchen Appliance at IFA 2016 - Ericsson first to deliver 5G NR radio - WORLD’S LARGEST OLED TUNNEL WELCOMES VISITORS TO IFA WITH 450 MILLION BRILLIANT PIXELS - Advantech in-vehicle ruggedized network video recorders now certified by RTSoft MONTRACK software for continuous video monitoring of fleets - GE joins MIT Energy Initiative to develop advanced technology solutions for transforming global energy systems - Texas Instruments assists “Internet Car” Roewe RX5 to deliver innovative digital driving experiences Based on “Jacinto 6” family of processors, the first infotainment advanced driver assistance system (InfoADAS) supporting “Internet Car” - Maxim’s DeepCover® Microcontroller Enables XAC PCI-PTS 4.1 Certification - ROHM Introduces 16bit ‘Tough’ MCUs Optimized for Rechargeable NiMH Applications - Toshiba Launches Low-input Current Drive, Rail-to-Rail Output, Gate-drive Photocouplers - Pulse Electronics Power BU Releases New High Permeability Nanocrystalline Common Mode Chokes - Maxim’s Industrial IoT Reference Design Speeds Development of Authenticated Data Chains - Dialog Semiconductor Enters Gallium Nitride (GaN) Market with First Integrated Devices Targeting Fast Charging Power Adapters - Wurth Electronics Midcom Announces New Flyback Transformers in Partnership with Dialog Semiconductor - 3-D printed structures “remember” their shapes - ESCRYPT and GlobalSign to join Infineon Security Partner Network with smart factory solutions - Elisa becomes the first operator in the world to achieve 1.9 Gbit/s in the 4G network - Arrow Electronics Brings Crowdfunded Technology to Life with Indiegogo - MCU Market Forecast to Reach Record High Revenues Through 2020 - Honeywell Completes Acquisition of Intelligrated - Samsung Mass Produces 14-Nanometer Exynos Processor with Full Connectivity Integration - New 7th Gen Intel Core Processor: Built for the Immersive Internet - Samsung Expands Smartwatch Portfolio with Gear S3 - Nokia announces a change in the composition of the Nokia Group Leadership Team - Samsung Partners with European Content Providers to Enhance Premium TV Viewing Experience - Facebook CEO Gifts Solar-Powered Drone to Pope Francis - Three Steps for Reducing Total Cost of Ownership in Pumping Systems - SCHURTER awards RS Components for outstanding sales performance RS achieves notable results in sales of SCHURTER’s portfolio of electric and electronic components - TIM and Samsung launch the first smartwatch in Italy with integrated eSIM, in collaboration with Gemalto - Runner-up world champion in e-mobility motor racing - Nano Dimension Supplies First DragonFly 2020 System to Leading Israeli Defense Company - An effective and low-cost solution for storing solar energy - LG SIGNATURE TO MAKE EUROPEAN DEBUT AT IFA 2016 - Boosting Compact Ultrasound IQ: GE Healthcare’s New Vivid™ iq Combines Power and Portability - Ericsson leads cloud transformation of public sector in Estonia - ON Semiconductor Announces Receipt of Regulatory Approval for Acquisition of Fairchild Semiconductor - New-Tech Europe Magazine | August2016 | Digital edition - Mobileye and Delphi to Establish Partnership for SAE Level 4/5 Automated Driving Solution for 2019 - Qualcomm and OSIsoft Announce Smart Ballpark Collaboration with San Diego Padres - Texas Instruments to gain access to early semiconductor innovations through strategic relationship with Silicon Catalyst - World’s First Tattoo by Industrial Robot - VTT invests to develop its semiconductor research and manufacturing at Micronova Espoo - NI Enhances NI ELVIS Teaching Platform With New Module for Mechatronics Education and Design - OMRON Launches New Image Sensing Unit for IoT - Movidius licenses UltraSoC analytics IP to speed debug and development - Honeywell Hardware Awarded Final Certification For Inmarsat's Next-Generation GX Aviation In-Flight Wi-Fi - TowerJazz and TPSCo Announce a New State of the Art CMOS Image Sensor Technology based on Stacked Deep Photodiode - Nokia expands virtual reality leadership globally with OZO launch in China - NXP and RioCard Launch New Contactless Payment Wearable for Multimodal Transportation Network in Rio de Janeiro - Tektronix Begins Delivery of the IsoVu™ Optically Isolated Measurement System - Wurth Electronics Midcom Announces a New Flybuck™ Transformer in Partnership with Texas Instruments - Vishay Intertechnology Miniature Minimold Through-Hole IR Receivers Offer Improved Optical Performance and RF Noise Rejection, Wave or Reflow Soldering Options - IZT Unveils Next Generation of its High Performance Receivers - TI’s new USB Type-C™ docking system design can cut solution size in half - Analog Devices Adds Cybersecurity Software and Services Capabilities Across Its Portfolio with New Acquisition - Intel’s FPGA Future: We’re Here to Stay - UK approves 'world's biggest offshore wind farm' project - Seven Top-20 Semiconductor Suppliers Show Double-Digit Gains in 2Q16 - Japan's Renesas in talks to buy US chipmaker Intersil for $3bn - World’s first NFC payment ring powered by Infineon’s contactless security chip - VTT and PhoeniX Software announce a process design kit to support silicon photonics developers around the world - Uber acquires autonomous truck startup Otto - IZT Presents its Latest Broadcast Solutions at IBC - Doubling battery power of consumer electronics - Silicon Labs Celebrates 20 Years of Connecting People, Devices and Data - Cypress Names Hassane El-Khoury as Next CEO - MIT develops self-shading windows - New Approach Doubles 3D Resolution of Fluorescence Microscopy - WaRP7 provides greater flexibility and rapid development for IoT and wearables applications - Microsemi Wins Jet Propulsion Laboratory's Prestigious 'Supplier Trust and Recognition Award' - 36V Ultralow Noise Precision Op Amp Features 30nVP-P 0.1Hz to 10Hz Noise - Würth Elektronik eiSos acquires AMBER wireless GmbH - congatec introduces highly flexible IoT gateway system - Intel CEO Introduces Vision for Merged Reality at 2016 Intel Developer Forum - Novatek Licenses CEVA-XM4 Imaging and Vision DSP for Embedded Visual Intelligence - The innovative shock absorber system from Audi: New technology saves fuel and enhances comfort - Dot-drawing with drones - LinguisTech - self-teaching English language software - Marvell Expands its awarding winning SSD product suiteby introducing Advanced BGA SSD controllers for new generations of slim, High Performance computing Device - Radiation tolerant optocouplers from TT Electronics provide highly reliable electrical circuit isolation in deep space environments - Synchronous Rail-to-Rail, Single Resistor Step-Down Regulator Sinks/Sources ±5A from 0V to 14.5VOUT - Revolutionary Solar Roof Announced by Elon Musk This Week - Huawei P9 wins European Consumer Smartphone 2016-17 at this year's EISA Awards - Innovative gas sensors from ams enable new Cling VOC fitness wristband to measure indoor air quality and alcohol in breath - NXP’s Microcontroller Business Reinforces Market Commitment with Extended Product Longevity of Key LPC Products - Ultrathin µModule Regulator Gets Closer to FPGAs, GPUs, ASICs or Processors under a Common Heat Sink - Intersil Introduces High Efficiency, High Current Buck-Boost Regulators for Battery-Powered Portables - The Foundation of Artificial Intelligence - Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP - Toward practical quantum computers - Polycom Recognised Separately by Gartner and IDC MarketScape as a Leader in Videoconferencing Market - Mini NASA Satellite Begins Environmental Testing - Samsung Electronics Now Ranked No. 1 in Enterprise SSD Market - Cisco Contributes Silicon Reference Design for Unprecedented Performance Increase in Cable HFC Plants - Silicon Labs Launches Industry’s First High-Speed Multi-Channel PLC Input Isolators - D/A Converter Offers More Accuracy in a Smaller Footprint for Diverse Applications Ranging from Radar to Smartphone Testing - Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones - Orange Tree announces SuperSpeed USB 3.0 FPGA module ZestSC3 provides 360Mbytes/sec sustained data transfer - NXP SmartMX Secures New Electronic ID Cards in Jordan - Living Structural Materials Could Open New Horizons for Engineers and Architects - Rohde & Schwarz awarded major security scanner contract from German Federal Ministry of the Interior - Tektronix Brings New HDR and WCG Support to Industry Leading Waveform Monitors - Microchip Releases Industry’s First End-to-End Security Solution for IoT Devices Connected to Amazon Web Services’ Cloud - Korean airports upgrade access control with CIPURSE™ based security - Samsung Showcases Industry-leading Flash Technologies to Address Growing Requirements of Storage Systems - miDIAGNOSTICS appoints industry expert Dr. Hilja Ibert as CEO - Mellanox Launches Integrated Networking Solutions That Accelerate NVMe Over Fabrics - Intel's Life-Changing Bionic Legs - Mentor Graphics Verification Academy Adds SystemVerilog Course and Patterns Library to Expand Engineers’ Expertise and Resources - Panasonic Acquired All Shares of German Software Company OpenSynergy - IBM Scientists Imitate the Functionality of Neurons with a Phase-Change Device - Highly integrated Hall sensors by Infineon reduce systems costs considerably - Ficosa opens new plant in Brazil - Samsung Unveils the New Galaxy Note7 the Intelligent Smartphone That Thinks Big - Renesas Electronics to Withdraw from the Microwave Semiconductor Device Business - Cisco and NI Collaborate to Introduce Early Access Technology Platform for Time Sensitive Networking - Olympians Capture the Excitement of the Rio 2016 Olympic Games Opening Ceremony through the Samsung Galaxy S7 edge Olympic Games Limited Edition - Elementary School Students Use Moverio Smart Glasses as Class Communication Tool - Qualcomm and Baidu Announce Commercialization of IZat Integrated Hardware Location Platform to Lead the Way for Smartphone Location Services in China - Tiny high-performance solar cells turn power generation sideways - See more at: https://news.wisc.edu/tiny-high-performance-solar-cells-turn-power-generation-sideways/#sthash.yhENrPHz.dpuf - HELLA Expands Its Radar-Based Driver Assistance Portfolio Based On NXP Technology - Ericsson and Bombardier test LTE networks at speeds up to 200 km/h - TT Electronics announces 12 new distribution partners for its full range of fully configurable temperature, pressure, level, and flow products - STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package - UK Tech firm Oxbotica accelerates away with launch of ground-breaking driverless vehicles software - Avnet Extends Cash Offer to Acquire Premier Farnell plc - Semtech LoRa® Wireless RF Technology Used to Keep Skiers Safe in the Swiss Alps - UK SEMICONDUCTOR PIONEER SETS ITS SIGHTS ON CHINA WITH PATENT CONFIRMATION - KAIST researchers develop ultrathin, transparent oxide thin-film transistors for wearable displays - GSK and Verily to establish Galvani Bioelectronics – a new company dedicated to the development of bioelectronic medicines - Implantable “Neural Dust” Enables Precise Wireless Recording of Nerve Activity - congatec strengthens its Japanese sales and support organization - Energy Harvesting Power Management Unit Delivers Industry-Leading Efficiency in Energy Scarce IoT Applications - NI Announces World’s First Application Framework for Massive MIMO to Speed Innovation in 5G Prototyping - STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package - New Panasonic HL Series Electric Double Layer Capacitors (ELDC) “Gold Capacitors” offer long life and superior performance over secondary batteries for auxiliary power applications - Targeted debugging of MIPI M-PHY interfaces using the new triggering and decoding option for R&S RTO2000 oscilloscopes - Nokia and Telefonica Germany sign managed services contract to transform fixed and mobile network operations - XP power launches high efficiency 40/50 Watt DC-DC converter series in compact 2 x 1 inch footprint - Battery500 consortium to spark EV innovations - ams launches the industry’s smallest module to offer color, ambient light and proximity sensing - Audi partners with digital health incubator to tone up startups and drivers - Norway wants to build the world's first underwater floating tunnel for £19 billion - Würth Elektronik eiSos is sponsor of the Electromagnetic Field 2016 festival - Rohde & Schwarz and Promate sign a global strategic framework agreement for display solutions - Automotive, Renewables and Power Conversion strong - BAE Systems Awarded $245 Million Contract for UK Type 26 Gun System - ROHM presents most comprehensive range of Automotive Grade LDO Regulators - Intersil Announces Industry's First Rad Tolerant 36V Instrumentation Amplifier with Integrated Differential ADC Driver - Vishay Intertechnology's Anti-Surge Thick Film Chip Resistors Combine Superior Pulse and ESD Handling With High Power Rating for Automotive and Industrial Applications - 32-Bit SAR ADC with Digitally Filtered & 1Msps No Latency Outputs - Sony Sells Industrial Battery Business - Qualcomm Signs 3G/4G China Patent License Agreement with OPPO - Nokia completes acquisition of Gainspeed - STMicroelectronics Earns MEMS Manufacturer of the Year Award - CONSORTIUM INCLUDING AFFILIATES OF GIANT AGREES TO ACQUIRE PLAYTIKA UNIT FOR $4.4 BILLION IN DEAL WITH CAESARS INTERACTIVE ENTERTAINMENT - Samsung and Nestlé Collaborate on the Internet of Things and Nutrition to Advance Digital Health - Murata DC-DC converter powers gate drives for optimal performance and efficiency - STMicroelectronics Acquires ams’ NFC and RFID Reader Assets - E-paper displays with internal timing controllers simplify design and offer cost savings - New 50 mm thyristor/diode modules address requirements of cost-sensitive applications - ON Semiconductor Introduces Automotive Power Integrated Module Solution for Next Generation Automotive BLDC Systems - Self-assembling nano inks form conductive and transparent grids during imprint - XL Axiata selects Ericsson to boost indoor user experience - Qualcomm and Lear Corporation Sign Commercial Wireless Electric Vehicle Charging License Agreement - Osram expands its expertise in automotive LED modules - China’s Final Chance to Achieve Its IC Industry Ambitions Now Underway - Mercedes-Benz is presenting the first fully electric truck for heavy distribution operations - e2v releases its first military temperature grade DDR3L memory solution - Silicon-air battery achieves running time of over 1,000 hours for the first time - New Cypress Automotive LED Driver Delivers Robust Performance and Minimizes the Bill-of-Material for Headlight Systems - Fairchild’s New Active Bridge Solution Delivers Best-in-Class Performance for Power Over Ethernet-Based IoT Devices - New Vishay Intertechnology Mid-Power UV LED in 365 nm Wavelength Range Delivers Exceptionally Long Lifetime in Compact Package - Toshiba Starts World’s First Sample Shipment of 64-Layer 3D Flash Memory - International Technology Roadmap for Semiconductors Examines Next 15 Years of Chip Innovation - SST and SilTerra Announce Production Readiness of Embedded SuperFlash® Macros on SilTerra’s 180 nm CMOS Platform - ABB wins $40 million transformer orders to extend and upgrade the Polish grid - ROHM Semiconductor Receives ”Supplier of the Year 2015 Award“ From Continental - New lithium-oxygen battery greatly improves energy efficiency, longevity - Orbital ATK and ECAPS Sign Agreement on Breakthrough Propulsion Technology - EU and Japan Expand Collaboration Targeting New-generation Smart Cities - ams acquires color and spectral sensing specialist MAZeT to extend its leadership in advanced optical sensing - New remote-controlled microrobots for medical operations - The Twike – half-bike and half-car – is now even more comfortable - Amazon and UK Government Aim for the Sky with Partnership on Drones - TI announces the only Qi-certified 15-W wireless power transmitter - Nokia to provide Tele2 with Cloud Packet Core solution across entire Tele2 Group network to deliver mobile broadband, further prepare for 5G - Hitachi to Introduce HIVECTOL-HVI-E2 Series, the Smallest in class Medium Voltage Multi-level IGBT Drive - Panasonic Develops ballooncam(TM) Prototype, A Drone System for Staging Sports And Events - Microchip Releases Demonstration Platform Based on Industry’s Lowest Power BLE Sensor Node for IoT Applications - Epson Begins Volume Production of S1D13L04 Display Controller for High-Resolution Color TFT Panels - Avnet Silica develops partnerships to provide full range of edge-to-enterprise IOT connectivity solutions - Ericsson's Vestberg steps down - search for new CEO initiated - SurFlow: secure, robust, integrated data transfer through composites - Fast, Accurate, Economical Testing of Low-Power Devices Will Be Crucial to the Growth of the Internet of Things - Wideband High Dynamic Range Limiting Amplifier - Chromebook: The vanguard of the new mobile revolution - Operation of Microwave Precision Fixed Attenuator Dice up to 40 GHz - Find the right coils for wireless power transfer - Developers Race Ahead with Sensor-to-Cloud Developer Kit from Silicon Labs - Panasonic Develops a "Motion Sensing Unit" for Robots - Future Electronics and Robert Miller Establish Interconnect Business Development Management Group - High-Voltage Converter from STMicroelectronics Enables Ultra-Low-Consumption Power Supplies in Smart Home and Industrial Applications - Electromagnetic and Electronics Simulation on the 3DEXPERIENCE Platform - Avoid the pitfalls of obsolescence - Living floating house - 15dB Gain Block Delivers 47dBm OIP3 Linearity with Low Noise from 100kHz to 1.4GHz - New R&S ZNBT20 true multiport vector network analyzer up to 20 GHz - Intelligent connectivity for BMW vehicles. BMW expands high-performance connectivity for cars and motorcycles. - Panasonic Starts Accepting Orders for Robotic Solutions Utilizing Pepper - Electromagnetic compatibility: The major considerations when working with switching power supplies - UKTV extends broadcast services contract with Ericsson - Real-time bomb scanner to revolutionise airport security - The world's first universal non-electrical Wi-Fi amplifier - Life-Cycle Management Is All About Software - Mellanox Achieves Record Quarterly Revenue in the Second Quarter 2016 - ARM Holdings to be sold to Japan's SoftBank for £24bn - First automatic cars join traffic in Finland - Wuerth Elektronik eiSos and Zuken launch Component Libraries for CADSTAR - BAE Systems develops laser airspeed sensor for aircraft - Intel Custom Foundry Certifies ANSYS Simulation Tools for Next-Generation 10NM Tri-Gate Process - Osram supplies OLED technology for German premium car manufacturer - SSTL expands LEO platform capability with VESTA nanosatellite - Another Big Shrink: Tiling Chiplets into Next-Generation Microsystems - World premiere: Daimler Buses presents autonomously driving city bus of the future - XMOS appoints Mark Lippett as President and CEO - e2v increases space presence with new QML class V certified space grade data converters - Epson Shipping Samples of New 16-bit MCU for Driving LEDs at Up to 56 mA - Rohde & Schwarz commissioned to install nationwide DVB-T2 network in Oman - Engineers create first computerised indoor trainer for British wheelchair athletes - Energy-Efficiency is Key to Cloud Services for the Internet of Everything - High Speed Isolated Calibrated Current Sensors Provide More Effective Alternative to Conventional Shunt Based Solutions - e2v and Adeneo partner to create the world’s smallest, multicore computer, for aerospace applications - New-Tech Europe Magazine | July 2016 | Digital edition - Imec developed Wireless EEG Headset for Emergency Room and Intensive Care Unit Patients with Nihon Kohden - Next generation ams light sensors to shrink smart phone apertures up to 50% - Audio Pixels and TowerJazz Announce Agreement for Volume Production of Groundbreaking, High Performance MEMS-based Loudspeaker Chip - Study opens new realms of light-matter interaction - Vishay Intertechnology Precision Non-Magnetic Thin Film Chip Resistors Deliver High Power Ratings to 6 W in Small Sizes - TI introduces the industry’s fastest isolated gate driver for high-voltage applications - A Better Lithium Ion Battery May Have Been Created, in Austria - Solar panels study reveals impact on the Earth - NASA's Next Mars Rover Progresses Toward 2020 Launch - Nokia and MTS boost 4G speeds and coverage with commercial deployment of FDD-TDD carrier aggregation in Moscow - The Axon 7 by ZTE brings the movie theater to your pocket with Snapdragon 820 - Robot earns its shoes, walks like a person - NXP Showcases Stunning i.MX 8 Multisensory Experiences at FTF 2016 - Ricoh Europe (Netherlands) B.V. Semiconductor Support Centre has launched the R5112, a voltage regulator plus voltage detector designed to minimise current consumption. - New automotive actuators from TT Electronics deliver significant improvements to next generation haptic accelerator pedalsV - Micronas involved with two development projects of the Federal Ministry of Education and Research (BMBF) - Intel and Airbus Demo Drone Inspection of Passenger Airliners - A new generation of electron devices makes waves, trillions of them each second - EVOLUTION OF THE EYE REVEALED WITH LG OLED TV AND NATURAL HISTORY MUSEUM - LG Innotek Unveils Flexible Textile Pressure Sensors - Infineon to acquire Wolfspeed for US Dollar 850 million in cash - Omnicharge: Smart & Compact Portable Power Bank - ZF Invests Further in Radar Facility in Brest, France - Mazda develops new technology based on Hitachi's G-Vectoring safe driving assist technology to be introduced with updated Mazda Axela - Future Electronics Wins Two Prestigious Awards from NXP - The Paying Jacket - APIX now de-facto Automotive SerDes standard with 50 million units shipped - Nanotech "Tattoo" Can Map Emotions and Monitor Muscle Activity - Boeing Forecasts Demand for 39,620 New Airplanes Valued at $5.9 Trillion - Scientists grow atomically thin transistors and circuits - ESA commits to next stage of UK revolutionary rocket engine - Alliance Memory Launches New Monolithic High-Speed, Low-Voltage 1G x 8 CMOS DDR3L SDRAM in 78-Ball FBGA Package - "WE RAN THE NUMBERS ON A EUROPEAN HYPERLOOP — AND THEY LOOK FANTASTIC" - Next Generation Dual-Mode Bluetooth® Audio Products from Microchip - NI Introduces Second-Generation Vector Signal Transceiver to Help Solve the Most Demanding RF Design and Test Applications - Formula Student Team Delft Unveils the First Electric Race Car Created with Dassault Systèmes’ 3DEXPERIENCE Platform on the Cloud - Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process - Huaxintong Semiconductor licenses ARMv8-A architecture - SST Announces Qualification of Embedded SuperFlash® on GLOBALFOUNDRIES’ BCDLite® Process - Keysight Technologies Introduces Industry's First All-in-One Software for R&D Engineers Designing, Evaluating 5G Candidate Waveforms - Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect - Thales Alenia Space Signs Contract with Orbital ATK to Produce Additional Key Hardware for Upcoming Cargo Resupply Missions to International Space Station - Mouser-Sponsored Formula E Team Preparing for Strong Finish - Toshiba Launches Photorelays for Semiconductor Testers in Industry’s Smallest Package - Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes - With “Le Campus Junior”, Samsung Offers Kids Between 7 and 13 a Fun and Free Introduction to Computer Programming - Analog Devices’ D/A Converter Improves Television Viewing Experience - ON Semiconductor Enhances Near-Infrared Performance of CCD Image Sensors - Snapdragon 821 builds on 820 processor success - First Flight Test for Upgraded C-130 Transport Aircraft Successfully Completed - Peruvian regulatory authority awards contract to Rohde & Schwarz - TI launches the first DDR memory-termination linear regulator for space applications - Avast Announces Agreement to Acquire AVG for $1.3B - Imec Extends its Global R
& Innovation Footprint with Opening of imec Florida - Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond - Samsung Announces Galaxy S7 edge Olympic Games Limited Edition with Launch of Global Rio 2016 Olympic Games Campaign - How to Create a Working IoT Sensor in One Month - Toshiba Launches Large-current Control Photorelays in Small Packages - STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power STM32L4 Microcontroller Series - PixMap launches ‘revolutionary’ 3D vision system for drones and robots - ARCHOS enhances its IoT activities and joins the LoRa™ Alliance - Mathematical Framework that Prioritizes Key Patterns in Networks Aims to Accelerate Scientific Discovery - Ficosa wins a contract to produce for the first time the electromechanical seat-adjustment system - ROHM’s New 1700V SiC MOSFET - Compact 1 W and 2 W DC-DC converters target medical applications - GM-NASA Space Robot ‘Power’ Glove Finds New Life on Earth - IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1% - Vishay Intertechnology’s New Sulfur-Resistant Thick Film Chip Resistors Feature Ag/Pd Terminations for Conductive Gluing in Automotive and Industrial Applications - TowerJazz Extends its Partnership with JA Mitsui to Drive its Recently Acquired San Antonio Fab Growth and Ramp-Up Plans - Micron Introduces Industry's Best-in-Class SLC NAND Flash for IoT and Automotive - LG AND VOLKSWAGEN COMMIT TO JOINTLY DEVELOP CONNECTED CAR PLATFORM - Facebook Introducing OpenCellular: An open source wireless access platform - Mouser Now Stocking the Hexiwear Open Source IoT Platform from MikroElektronika and NXP - Samsung Introduces World’s First Universal Flash Storage (UFS) Removable Memory Card Line-up, Offering up to 256-Gigabyte (GB) Capacity - New synchronous rectification ICs for simplicity and efficiency in SMPS applications - Starship Technologies launches testing program for self-driving delivery robots with major industry partners - STMicroelectronics Reveals World’s Smallest Motor Drivers to Streamline Design and Boost Runtime of Battery-Powered Devices for the Internet of Things - BMW Group, Intel and Mobileye Team Up to Bring Fully Autonomous Driving to Streets by 2021 - And the winner is... Satellites for saving energy - Team Delft wins Amazon Picking Challenge - Is your meal really gluten free? Portable sensor detects trace amounts of gluten in food at restaurants. - Fashion designer Jasna Rok showcases collection based on smart plastics and smart textiles - Nano Dimension has Completed the Development of the Initial Version of its Software Package for 3D Printed Electronics – "Switch" - Infineon backs European Commission in developing cybersecurity guidelines - Solar Roadways to Pave Route 66 in Missouri With Solar Panels - Harwin celebrates official opening of new manufacturing facility in UK - Anglia opens free sample and dev kit service - Ericsson and Abengoa sign agreement for the transfer of Spanish fiber-services leader Abentel - Cypress Now the Leading Internet of Things Supplier with Acquisition of Broadcom’s Wireless IoT Business - NXP, Tongji University, SAIC and Partners Launch First Large-Scale Road Test for Intelligent Connected Vehicles in China - NASA's Juno Spacecraft in Orbit Around Mighty Jupiter - IBM and Cisco Tap Into the Power of IBM Watson and Cisco Spark to Transform the Way People Work - BT and Oracle Collaborate to Make It Easier for Global Organizations to Move to the Cloud - AMD Acquires Software Company HiAlgo, Laying Groundwork for Future Gaming Innovation in Radeon Software - Christian Leicher now President and CEO of Rohde & Schwarz - ISS Turns to IBM Watson IoT to Transform Management of 25,000 Buildings Worldwide - VTT and IT Center for Science CSC in closer cooperation - STMicroelectronics Introduces New Bluetooth® Low Energy Single-Chip Solution - OrbitOutlook Integrates Largest and Most Diverse Network of Space Sensors Ever to Help Avoid Collisions in Space - Vodafone and Ericsson demonstrate new 5G Proof of Concept - Qualcomm Files Patent Infringement Complaints against Meizu in China - Murata technology helps the University of Nottingham to a podium finish at the Isle of Man TT Zero - Würth Elektronik eiSos opens ultramodern logistics centre Ceremony in celebration of state-of-the-art warehouse logistics - New FIDO certified Bluetooth solution for secure mobile internet usage - New mid-infrared laser system could detect atmospheric chemicals - Valens’ First HDBaseT Automotive Silicon is Now Available - Ericsson, SK Telecom and Deutsche Telekom in world's first transcontinental 5G trial - Intel and Tyndall National Institute Renew $1.5 Million Research Partnership - Hitachi, Mitsubishi Electric, and Intel jointly propose IoT testbed for the manufacturing industry at IIC, and obtain approval - Toshiba Launches Illumination LED Driver IC with Single-Wire Input - New Battery-Charger Chip from STMicroelectronics Reduces Cost and Time-to-Market for Wearable and Portable Applications - 3D printing enables the smalles complex micro-objectives - Zero to 100 km/h in 1.5 seconds: Formula Student Team breaks world record with an electric racing car - Functional style enters a new dimension: the innovative X-CAT DISC designed by Designworks. - KDDI in Japan selects Gemalto's Connected cars and IoT solution - Say “hello” to TI’s new voice remote control solutions - ROHM Expands Its Color Lineup of Class-Leading  Thin, Compact LEDs - ARCA Introduces ArcaMini - CWRU takes the stage at Microsoft’s Build conference to show how HoloLens can transform learning - Amphenol Aerospace High Speed Solutions Introduces Rugged VPX Media & Protocol Conversion Modules - TI's synchronous DC/DC buck regulators eliminate switch-node ringing in automotive applications - 10 W Ac-Dc Power Supplies with Integrated USB Connectors Meet DoE Level VI and CoC Tier 2 Standards - TI introduces the industry’s highest performing reinforced isolated amplifier - Murata introduces world’s smallest 008004 size high-frequency inductors - Ericsson and King's College London demonstrate 5G tactile robotic surgery - OVH Enhances Its Global Networks to Deliver Best-in-Class Customer Experience With Cisco DWDM Technology - Microchip Launches Lowest Power, Cost-Effective PIC32 Family With Core Independent Peripherals - Tough new hydrogel hybrid doesn’t dry out - Foldable 3-D, Man-Made Proteins Could Make “Use By” Dates for Medicines Obsolete - Free Driver Software from STMicroelectronics Extends Flexibility in Designing STM32 Embedded Applications - Texas Instruments meets need for skilled power engineers with Power Management Lab Kit series - Elon Musk’s Tesla Plans to Acquire Elon Musk’s SolarCity, Offer Joint Services - New Epson Robot Force Sensors Enable Automation of Difficult Tasks - Allow robots to automatically modulate force - - ASML to Acquire HMI to Enhance Holistic Lithography Product Portfolio - Qualcomm announces 5G NR sub-6 GHz prototype system and trial platform - Rohde & Schwarz and Texas Instruments lay strategic relationship on new platform - Yuneec Typhoon H with Intel RealSense Technology Available for Preorder - SMIC Acquires LFoundry and Enters into Global Automotive Electronics Market - Ambu acquires patented single-use airway tubes with integrated camera - Cavium to Acquire QLogic - Qualcomm Announces Broad Support for Galileo Across Snapdragon Processor and Modem Portfolios - Power Transistors To See Less Volatility In Second Half of This Decade - ams' new temperature sensor offers best-in-class combination of accuracy, ultra-low power consumption and small size - NASA Electric Research Plane Gets X Number, New Name - Toshiba Launches the Industry’s Leading-class Low On-resistance Small-size N-Channel MOSFETs for Load Switches in LED Driver Applications - Transceiver Provides Reliable Radio Connections and Extended Battery Life for IoT and Other Wireless Applications - Epson to Acquire Italian Textile Printer Manufacturing Company Robustelli - NXP Extends Virtualization to the Edge of the Network - Intersil’s High Current Switching Regulators Adopted in Huawei P9 Smartphone - Silicon Carbide power MOSFETs from TT Electronics operate in environmentally challenged applications - New-Tech Europe Magazine | June 2016 | Digital edition - Samsung Shows Dedication to IoT with $1.2 Billion Investment and R&D - TI introduces the industry’s lowest-power, low-jitter retimers for 4K UHD video and camera interface - Intel Accelerates the Path to Deeper Insight with the Latest Intel Technologies for High-Performance Computing and Advanced Analytics - Panasonic Acquires UK Technology Systems Integrator Alan Dick Communications - Hyperloop One Announces New Russian Partnership And Global Challenge Updates - Local Motors Debuts "Olli", the First Self-driving Vehicle to Tap the Power of IBM Watson - General Motors Global Compact Car Platform Now Includes Microchip’s MOST50 Automotive Infotainment Networking Solution - Mellanox Solutions Accelerate the Fastest Supercomputer in the World - Around one in 15 new cars uses radar chips from market leader Infineon for driver assistance - New NANO Li-Ion Battery Does not Catch Fire, Designed for Defense Missions - World’s First Ever Solar Plant Provides Power Day and Night - ON Semiconductor Announces Sensorless Three-Phase Motor Controller for Automotive BLDC Implementation - Analog Devices’ Optical Sensor Improves Reliability of Gesture Recognition Applications - Samsung and Intel Launch Tech Initiative to Develop Recommendations for a National Internet of Things Strategy - Solution Blueprint Internet of Things (IoT) Increasing Production Line Performance and Reducing Operations Costs with IoT Technologies - Design an optimized circuit for HART-enabled 4- to 20-mA inputs - Expanding Frequency Range in High-Power Splitter/Combiners by Minimizing Resistor Capacitance - Connector selection crucial for high performance industrial applications - BMW Group. THE NEXT 100 YEARS. - STMicroelectronics Collaborates with Qualcomm on Sensors for Smart Mobile Devices - Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging - Hallmark Envisions Real-Time Space Command and Control - TactoTek awarded EUR 2.5 Million EU Horizon 2020 grant to mass produce injection molded electronics - Need hair? Press “print” - Imec Demonstrates Highly Efficient Bifacial Solar Cells with near 100% Bifaciality - Stockholm tops Ericsson Networked Society City Index 2016 - Parallel programming made easy - Bluetooth® 5 quadruples range, doubles speed, increases data broadcasting capacity by 800% - Leti Extends CMOS Platforms’ Lifespan and Explores New Computing Paradigms - Intel and Red Bull Bring Amazing Experiences to Red Bull X-Fighters 2016 Madrid in Plaza de Toros - Volkswagen Group to become a world-leading provider of sustainable mobility - Finessing Miniaturized Magnetics into the Microelectronics Mix - Total Personal Computing Unit Shipments Forecast to Drop 2% in 2016 - Cypress and MyScript® Announce Partnership for Automotive Industry - New Analog Devices SHARC® Processor Platform Delivers Superior Sound Experience in Audio System Applications - First test plant to produce fuel from solar power to be established in Finland - STMicroelectronics Joins Forces with Automotive Software - Amsterdam ArenA explores spectator comfort through environmental monitoring - Microsoft to acquire LinkedIn - New approach to microlasers - NXP Semiconductors to Divest its Standard Products Business - Researchers find a way to extend life and improve performance of fuel cell electrodes - Ficosa awarded multiple rear-view mirrors contract worth $510 M in North America - Swiss Daetwyler agrees $1.1 billion deal to buy Premier Farnell - Cavium to Acquire QLogic - STMicroelectronics Simplifies Design-In of State-of-the-Art Security for the IoT - Ericsson and Sprint kick off next-generation sporting experience - Compact 65 Watt external power supply meets Level VI requirements and suits medical and commercial applications - IAR Systems further simplifies development of applications based on Renesas RX MCUs - ARCCORE INTRODUCES NEW ARCTIC FUSION PROTOTYPE BOARD - Cypress Introduces New Programmable Analog SoCs - Rohde & Schwarz first to validate high-power user equipment RF conformance tests - TI enables smaller, safer and more accurate rotary position sensing - Nokia launches new IMPACT platform for fast and secure delivery of IoT services - New solar absorber could improve efficiency of solar thermal technology - Ixia Transforms Development Lifecycle for Software Developers - LG UNVEILS SPECIAL EDITION PORTABLE SPEAKER FEATURING ARTIST JONONE IN PARIS - Keysight Technologies, National Applied Research Laboratories Sign MOU to Establish Strategic Partnership on Research, Development of 5G Communication Technologies - Energy storage for renewables can be a good investment today, study finds - Nokia Smart Home solution connects residential customers to the Internet of Things - Nokia Technologies introduces body cardio, the first connected scale with cardiovascular health assessment - Cisco and MSP to open Mi-IDEA innovation centre in Manchester - Researchers discover new way to turn electricity into light, using graphene - VimpelCom and Ericsson enter software partnership worth over USD 1 billion - myAudi Sphere: new stage for the four rings at Munich Airport - Back to basics - Reliability considerations in power supplies - STMicroelectronics Extends Connectivity Portfolio with Certified USB-C and Power Delivery Solution - China-Based Smartphone Suppliers Held 8 of Top 12 Spots in 1Q16 Ranking - The robot Thymio is finding its niche in French schools - New method snips complex fibers into uniform particles - Mouser, Molex IndyCar Race Team Wins in Detroit, Charges into Texas Motor Speedway - Mouser Electronics Launches New Timing Technology Site - Perovskite Solar Cells Surpass 20% Efficiency - Manage the IoT on an Energy Budget​​​​ - Nokia plans to expand its footprint in the cable market by acquiring Gainspeed - Coin-sized scanner to target blindness - Keysight Technologies Introduces Industries' Highest Performance Gen 3 PXIe Chassis and System Components - SANDISK MOBILE STORAGE PORTFOLIO EXPANDED WITH FASTER, HIGHER CAPACITY USB TYPE-C FLASH DRIVE - UBM sold EETimes to Arrow Electronics - CPI supports Catapult Fellowship Scheme to develop printed antennae technology - Ingestible origami robot - Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications - Novel energy inside a microcircuit chip: VTT developed an efficient nanomaterial-based integrated energy storage - Qualcomm Announces Connected Car Reference Platform to Simplify Integration of Advanced Connectivity Technologies Into New Vehicles - Ericsson ConsumerLab: Personal safety to drive wearables market beyond health & fitness - Formula E technology partnership between Würth Elektronik eiSos and ABT Schaeffler Audi Sport - Smallest 3D camera worldwide brings Augmented Reality to a smartphone - New congatec Server-on-Modules for real-time media processing - Create 16x16 LED Displays with Flexible Reference Design - Intel® Xeon® Processor E7 v4 Family - Sigma-Delta A/D Converters Improve Signal Quality Monitoring in Instrumentation, Energy and Healthcare Applications - ASICs allow cost-effective IP protection for technology inventions - Troubleshooting Clock Jitter and Identifying PDN Sensitivities - FOX selects Ericsson for playout services in the Middle East - Rambus to Acquire Snowbush IP Assets - New Ultra-Small Digital Humidity Sensor: Simplicity Meets Proven Performance - Today Vicor released four new DCM products in the VIA package - New-Tech Europe Magazine | May 2016 - A Recipe for Embedded Systems - Temperature Logger Monitors Longer Sessions without Compromising Data Sample Rate - New Time-of-Flight Ranging Sensor from STMicroelectronics Boosts Range and Speed, in Industry’s Smallest Footprint - KnuEdge Unveils Breakthrough Technology That Will Unleash Innovation in Voice Biometrics and Human-machine Interaction - CERN puts complete trust in Rohde & Schwarz Mobile Network Testing solution - ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets - LG GOES 360 DEGREES TO SUPPORT HERITAGE CONSERVATION THIS WORLD ENVIRONMENT DAY - M12 connectors become more reliable, easier to fit and reduce installer injuries - Intelligent Gateways Make a Factory Smarter - Ericsson presents smart mobility at Europe's biggest transport event - Cadence Next-Generation Virtuoso Platform Deployed by STMicroelectronics for SmartPower Technologies - Mouser-Sponsored Rebellion Racing Gearing Up for Le Mans - Making cities smarter - Startup launches theft-proof, weatherproof bikes Slava Menn aims to make cycling safer and easier in cities worldwide. - NI and Hewlett Packard Enterprise Collaborate to Make Available Pre-Tested Big Analog Data™ Solutions - Exar Signs Definitive Agreement to Sell its iML Subsidiary for $136 Million, Net of Cash - Samsung Pay is Now Available in Spain - Europe’s SpaceDataHighway relays first Sentinel-1 images via laser - IBM and Cisco Combine the Power of Watson Internet of Things with Edge Analytics - SIRIN LABS LAUNCHES SOLARIN: A MILITARY-GRADE SUPER SMART PHONE - TowerJazz Announces Successful Completion of Non-Convertible Unsecured Bonds Institutional Tender - Samsung Brings Freedom and Fun to Your Fitness with the Launch of Gear Fit2 and Gear IconX - Sondrel and UltraSoC partner to deliver ‘shift left’ for SoC projects - Inuitive Selects CEVA-XM4 Intelligent Vision DSP for Next Generation 3D Computer Vision SoC - IBM to Acquire EZSource - EarlySense Completes $25 Million Funding Round to Fuel Global Growth of Contact-Free Monitoring Technology - World-first approach to reduce latency in live captioning - New Epson Robot Force Sensors Enable Automation of Difficult Tasks - Swiss Gotthard rail tunnel - an engineering triumph - Two-Channel, Bi-Directional Digital Isolators Reduce Space and System Complexity for Designers - STMicroelectronics and SAG Cooperate to Deliver High-Performance, Tiny NFC Tags for IoT Applications - Long-term Strategy Pays Off As TI Maintains Analog Leadership - “SemI40” strengthens Europe’s economy with the “learning factory” - WATERFORD GETS A SELF-DRIVE CAR THANKS TO WIT ELECTRONIC ENGINEERING STUDENTS - Volkswagen to Invest $11 Billion in Electric Car Battery Factory - Innovium secures more than $50M in funding - Internet of Things to overtake mobile phones by 2018: Ericsson Mobility Report - Rohde & Schwarz launches Scope in Space competition - Keysight Technologies Introduces the Industry's Only 10 GS/s, DC Coupled, 10-bit PCIe® High-Speed Digitizer - British Counter-UAV Technology (AUDS) Selected by FAA for US Airport Trials - Cypress USB-C Power Delivery Solution Helps LeEco Debut the World’s First Smartphones with One Port for Data Transmission, Power Charging and Audio - Micron Takes Client Data Storage to the Next Dimension with Fast, Secure, Power-Efficient 3D NAND Flash Solid State Drives - element14 announces public availability of the BBC micro:bit - TI introduces industry’s highest current 40-A, 16-VIN converter - NXP and Accton Collaborate to Deliver First ARM Cortex-A72 Based Switching Platform for Enterprises and Cloud Edge Networks - Microchip Announces Graphical User Interface Composer Tool for MPLAB® Harmony - Zenbo - YOUR SMART LITTLE COMPANION - VTT Expert Services Ltd acquired the measuring and testing services of the Natural Resources Institute Finland - ALMA Observatory pushing high Cisco technology - Intersil Unveils Industry’s Highest Performance Laser Diode Driver for Automotive Heads-Up Displays - Eliminate the Need for Battery Characterization and Speed Time to Market with ModelGauge™ m5 - Nokia completes the acquisition of Withings - The New Intel® Core™ i7 Processor Extreme Edition: Intel’s Most Powerful Desktop Processor Ever - 3D Printing PCBS - System Validation at ARM: Enabling our Partners to Build Better Systems - New-Tech Europe Magazine | April 2016 digital edition - New-Tech Europe | March 2016 | Digital edition - Panasonic Commercializes "Conductive Polymer Hybrid Aluminum Electrolytic Capacitors" for Automotive Use - The feelSpace Navigation Belt - Toshiba to Start Field Testing Medium-sized EV Bus with Wirelessly Rechargeable SCiB™ Lithium-ion Battery - Qualcomm Extends Industry-Leading Snapdragon Wear Lineup with New Processor, Platforms and Support for Targeted-Purpose Wearables - Panasonic Commercializes the Large Current "Power Choke Coil" for Automotive Use - Samsung Mass Producing Industry’s First 512-Gigabyte NVMe SSD in a Single BGA Package for More Flexibility in Computing Device Design - Toshiba Announces Immediate IP Subsystem Availability of PCI Express® and DDR3 for Custom LSI Platforms - Qualcomm Brings New Wi-Fi Solution and Software Ecosystem Support to Enhance Development for the Internet of Things - Advanced Power Technology from STMicroelectronics Enables Unique Portable e-Car Charger from Zaptec - Qualcomm Delivers New GigaDSL Offerings to Help Broadband Operators Seamlessly Transition to Gigabit Services - Latest ARM Premium Mobile Technology to Drive Immersive Experiences - New R&S FSVA midrange signal and spectrum analyzer offers enhanced RF performance at an excellent value - NXP Introduces Industry’s Broadest Portfolio of Broadband LDMOS RF ICs for Powering Outdoor Small Cell Base Stations - A new treatment room design model for future hospitals - British-designed Vintage Toy Synthesiser scoops first prize in global element14 Music Tech Design Challenge - New Epson IMUs Enable High-Precision Control of Machinery in Demanding Environments - NXP Introduces New High Performance GaN RF Power Transistors for Cellular Base Stations - Ixia and QualiTest Speed Delivery of End-to-End Networking Test Solutions - Panasonic Develops Two Types of Connectors for Connecting In-vehicle LED Lamp Modules to Boards - Volkswagen Group announces a strategic partnership with on-demand mobility provider Gett - SoundVision wins Ericsson Innovation Awards 2016 - Scania links up with Ericsson to test 5G mobile technology - NI Introduces Test Solution for 802.11ax High-Efficiency Wireless - Researchers Teaching Robots to Feel and React to Pain - Sensifree Secures $5M in Series A Financing Led by TransLink Capital - IBM Scientists Achieve Storage Memory Breakthrough - NIAAA selects winners of its Wearable Alcohol Biosensor Challenge - Advantest Earns 28th Consecutive Ranking as a 10 BEST Supplier of Semiconductor Test Equipment, Excelling as Global Customers Rate System Uptime as Paramount in the Industry - New concept turns battery technology upside-down Pump-free design for flow battery could offer advantages in cost and simplicity. - Imec, Holst Centre and Barco Silex Collaborate on Data Security for Wearables and Internet of Things Networks - Microsoft announces streamlining of smartphone hardware business - Intel Acquires Computer Vision for IOT, Automotive - STM32F7 Microcontrollers from STMicroelectronics Expand Ecosystem with New Development Boards to Accelerate Embedded Design - FotoNation® Partners With Kyocera to Develop Intelligent Automotive Camera Technology - 150V Low IQ Inverting Synchronous DC/DC Controller Uses a Single Inductor & Has Ground-Referenced Controls - Imec and its Solliance Partners Present First Semi-Transparent Perovskite Modules - Toshiba’s Ultra-Fast Data Matching Technology is Over 50 Times Faster than its Predecessors - Medtronic and Qualcomm collaborate to aim to improve care and health outcomes for people with type 2 diabetes - Communications and Computer Systems Drive IC Sales Across All Regions - 16-Bit, 5Msps SAR ADC with Wide Input Common Mode Range Simplifies Analog Front-End Circuitry - Tektronix Expands Serial Standards Testing on DPO70000SX Oscilloscopes Brings 3rd, 4th Generation Serial Bus Compliance Testing to the Industry's Highest Fidelity Oscilloscope - Panasonic Launches "DW Relays" Suited for Remote Control of Smart Switches and Power Outlets - Putting New Energy into Fashion - Industry's First 3-in-1 Waveform Generator Debuts New Portable Tektronix AWG4000 Meets a Wide Range of Signal Generation Needs -- From Simple AFG to Complex Sequenced Waveforms - Keysight Technologies Launches PXI Express High-Speed Source/Measure Unit - Samsung Electronics Expands 750 EVO SSD with Worldwide Availability and Increases Capacity to 500GB - Amphenol Industrial's Max-M12 Expansion - Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip - ST and Weifu Cooperate to Address Automotive Engine Control - Evaluate Rugged 3D Interface and Weigh Scale with Maxim’s Smart Force Sensor - What Is RocketSim? Why Did Cadence Acquire Rocketick? - Sensors to Servers: from prototype to custom hardware - Shape-shifting modular interactive device unveiled - Infineon and Imec cooperate on 79 GHz CMOS radar sensor chips for the automotive industry - Intersil’s 5A and 3A Power Modules Offer Industry-Leading Power Density and Efficiency - TI unveils industry’s highest power density 12-V, 10-A, 10-MHz DC/DC converter - Bristol named as leading UK Smart City - Intel Reports on Advances and Achievements in 2015 Corporate Responsibility - Ultra-small SWIFT™ step-down converter features unique topology to achieve four times higher current density - Printing metal in midair - NXP Shrinks Automotive Power Package for the Connected Car - Microchip Debuts Industry’s First LoRa® Technology Evaluation Kits for Low-Power Wide-Area Networks (LPWAN) - Analog Devices Simplifies Wireless System Design with RadioVerse™ Technology and Design Ecosystem - Indiegogo Teams with Arrow Electronics to Accelerate Technology Entrepreneurs’ Path to Market - Personal aircraft aiming to off from your home - Gesture control is revolutionizing usability of devices – Google ATAP and Infineon advance their partnership in “Soli” radar technology - TI delivers the industry's first RF sampling 14-bit, 3-GSPS analog-to-digital converter - NXP Partners with Wayv to Unveil the World’s First Handheld Portable, Battery-Operated RF Cooking Appliance - The Road to Full Autonomous Driving: Mobileye and STMicroelectronics to Develop EyeQ®5 System-on-Chip, Targeting Sensor Fusion Central Computer for Autonomous Vehicles - Strengthening European microelectronics: Infineon launches "IoSense" pilot lines project in Dresden - NXP Semiconductors Announces Best Supplier Awards - STMicroelectronics and Arduino Launch Cooperation to Expand Maker-Community Access to STM32 MCUs and Sensors - STMicroelectronics and Autotalks Fuse Satellite Navigation with Vehicle-to-Vehicle and -Infrastructure Communication (V2X) - TAP Turns Anything You Touch into a Keyboard. - Encapsulated DC-DC converters offer chassis or DIN rail mounting - STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification - Seven Top-20 1Q16 Semiconductor Suppliers Show Double-Digit Declines - Holy Shift! A Look inside GM’s new 10-Speed Automatic - The CEA Announces Expanded Collaboration with Intel to Advance Cutting-edge Research and Innovation in Key Digital Areas - Registration opens for UK’s first public driverless vehicle trials - LG ANNOUNCES STARTUP INITIATIVE BY SPINNING OFF TWO PROJECTS - Imec Expands its Silicon Platform for Quantum Computing Applications - ARM Acquires Apical - a Global Leader in Imaging and Embedded Computer Vision - Microchip Celebrates Continued Growth and Expansion of Award-Winning Line of Development Tools - A Glimpse at the Smart City of the Future – NXP, Siemens Demonstrate Smart Mobility in Austin - VTT delivers world's first industrial internet solution for a printed electronics plant - NXP Expands Partnership with US DOT; Showcases Today’s Solutions to Build Tomorrow’s Smart Cities - Maxim Integrated’s SC2200 dual-path RFPAL significantly improves system efficiency of base stations. - Infineon reinforces the Management Board to continue the successful growth strategy - Triple-Channel Universal PMIC Supports Low Power FPGA and SoC Processors - A new tool from VTT for the economic evaluation of security solutions for urban areas - NXP Demonstrates Complete Autonomous Vehicle Platform Using NXP Silicon at Each ADAS Node - UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability - Keysight Technologies Introduces Phased-Array Beamforming Software Module for 5G, Radar, EW Systems - Analog Devices’ Silicon Switch Reduces Size and Power Consumption in Cellular Radio RF Front Ends - Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs - Nokia Bell Labs achieves world's first 10 Gbps symmetrical data speeds over traditional cable access networks - Samsung Drives Forward the Galaxy S7 Ecosystem with Gear VR Content Package - IQE Joins imec’s Gallium Nitride-on-Silicon Industrial Affiliation Program - Norway to introduce New Hydrogen Refueling Stations - Volvo Cars pioneers two-hour in-car delivery service with Swedish start-up urb-it - DARPA Demo Day 2016 Aims to Speed Transition of Game-Changing Technologies to Military Services - World’s first validation of LTE-Advanced Pro uplink 64QAM and LTE-Advanced uplink CA with R&S TS8980 - Automotive Testing Expo 2016: Rohde & Schwarz presents its test and measurement solutions for the automotive industry - Harwin to sponsor Purdue Electric Racing in Formula Student Electric Race Challenge - TI introduces the first differential inductive switch - Solliance realizes a first up-scaled Perovskite based PVmodule with 10% efficiency - LG INTRODUCES ACTIVE LIFESTYLE CAMERA WITH LIVE STREAMING OVER 4G - Antenova introduces three brand new ‘plug and play’ antennas for small devices in the 3G, 4G and LTE bands - Little ANTs: researchers build the world’s tiniest engine - Panasonic Showcases Wide Range of Industry Leading Technologies at PCIM Europe 2016 - Launch of first London HyFive Hydrogen Refuelling station - New products and solutions to electric commercial vehicles - New Power Conversion Platform Improves Safety, Reliability and Efficiency in Renewable Energy Applications - ON Semiconductor Expands Low Power Wireless Solutions Portfolio with SIGFOX and ARM for Rapid IoT Deployment - SKINTRACK TECHNOLOGY TURNS ARM INTO SMARTWATCH TOUCHPAD - Analog Devices and Cambridge Consultants Collaborate on Cost-Effective Monitoring System to Reduce Parking Frustrations - Researchers find unexpected magnetic effect - New material temporarily tightens skin - Low Loss 3-Phase Ideal Diode Bridge Rectifier Reduces Heat, Easing Thermal Design - Cypress’s New Family of Programmable Oscillators Deliver Industry-Leading Performance for Next-Generation Networking Systems - ARM University Program Introduces New Mobile Gaming Education Kit - LG Innotek develops 'under-glass' fingerprint sensor module - Sequans’ LTE technology selected by Thales for in-flight connectivity solution for the European Aviation Network - Accelerating Complex Computer Simulations: Thinking beyond Ones and Zeros - UltraSoC selected as a Gartner “Cool Vendor” - Ericsson Revenue Manager selected by T-Mobile Czech Republic - BTG plc acquires Galil Medical, a leader in cryoablation - From Gaming to Grand Designs: ARM Enlighten Technology Expands Into New Markets - Automotive Electronics System Demand Fails to Boost Automotive IC Market in 2015 - Samsung Electronics Introduces the EVO Plus 256GB MicroSD Card, with the Highest Capacity in its Class - Ixia Launches Xceed Technology Partner Program to Grow Partner Success - Samsung’s New Wi-Fi Range Brings New Era of Connectivity and Convenience to the Kitchen - Ultimicron for Natural, Beautiful EVFs - Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software - Infineon power modules for hybrid and electric vehicles help meet space constraints and deliver higher power density - Samsung Reinvents the Refrigerator - VTT is bringing out a small and consumer-friendly treatment device for excessive sweating - Global Debut of Panasonic 3D Scanning Booth Turns Audience into Kabuki Avatars at Opening of "Kabuki Lion" in Las Vegas - STMicroelectronics Brings Superior Indoor and Undercover Navigation to Mobiles and Wearables - Hover Camera - Fast and easy motor drive design: Infineon launches iMotion™ Modular Application Design Kit - Hi-Rel industries shift to jackscrew fixings for ultimate connection security - Peter Cleveland: Intel CEO and Drone Enthusiast to Lead New FAA Drone Advisory Council - MaxLinear, Inc. Acquires Wireless Access Assets from Microsemi Corporation - Conrad Business Supplies introduces a new handheld network tester from IDEAL Networks - Keysight Technologies Announces Series of “How to Design an RF Power Amplifier” Videos for Novice, Experienced Designers - ALLIANCE TO ‘TRANSFORM TECHNOLOGY’ AT THAMES WATER - Raytheon developing technology to make software "immortal" - China develops graphene electronic paper - Qualcomm Helps Make Your Mobile Devices Smarter With New Snapdragon Machine Learning Software Development Kit - Volvo Cars to launch UK’s largest and most ambitious autonomous driving trial - IBM Master the Mainframe Contest Winners Announced for United Kingdom and Ireland - Replication of coloured 3D models simplified - Powerbox acquires Eplax, strengthening custom power solutions for demanding applications - Microsoft acquires Italian IoT platform Solair - Bioo Pot Charges Your Phone with Plant Energy - Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices - Microchip Introduces Hardware Cryptography-Enabled 32-bit Microcontroller for Internet of Things Applications - Imec Honors Dr. Gordon Moore with “Lifetime of Innovation Award” - Micronas and GLYN expand their distribution partnership - CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years - Keysight Technologies Introduces the First CXPI Triggering, Decode Options for Oscilloscopes - Cavium Unveils OCTEON TX™: Industry’s widest range of 64-bit ARM®-based SOCs for a broad spectrum of open, services-centric applications in enterprise and service provider infrastructure - Intel and French Skipper Francois Gabart Team up with Trimaran MACIF - The Changing Face of Test - A new kind of challenge - Sub-Threshold Design - A Revolutionary Approach to Eliminating Power - Spotting hidden activity in cells - Cartamundi, imec en Holst Centre winnen “Best Product” award op Printed Electronics Europe - VTT is developing customised snacks through 3D food printing - Intel Announces Executive Promotion - Cadence Completes Acquisition of Rocketick Technologies - Altera’s Design Solutions Network Connects Customers with Experts to Help Innovate With Their FPGA-Based Designs - Cypress to Acquire Broadcom’s Wireless Internet of Things Business - Heliofloat System Brings Off-shore Solar Closer to Reality - SOLAR IMPULSE LANDS IN THE SILICON VALLEY COMPLETING THE CROSSING OF THE PACIFIC OCEAN WITH SEVERAL WORLD RECORDS  - Samsung Knox Now Leading the Next Evolution of the Enterprise - ams AG Announces $77 Million Intellectual Property Judgment Against United States Competitor - GXV-T Revs up Research into Nimbler, Faster, Smarter Armored Ground Vehicles - New Vishay Intertechnology Thick Film, Multi-Resistance-Value Chip Resistor Arrays Supplement Thin Film Arrays - Siemens and Valeo join forces for global leadership in powertrains for electric cars - TactoTek reveals mass producible injection molded structural electronics innovations - Nokia plans to acquire Withings to accelerate entry into Digital Health - Toshiba Launches Current-Feedback 4ch Power Amplifier IC for Car Audio with Built-In Full-Time Offset Detection - No more workarounds: The new TO-220 FullPAK Wide Creepage Package - Hitachi Automotive Systems Announces to Supply Alfa Romeo with Carbon-Fibre Propeller Shaft for the new Giulia - Brian Krzanich: Our Strategy and The Future of Intel - Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design - Panasonic and Siemens to cooperate for next-generation electronic equipment assembly plants - GE Unveils GuardEon* — A Global Circuit Breaker Platform Built for the Digital Industrial Era - At CERN, eight-inch sensor chips from Infineon could reveal the mysteries of the universe - Micronas presents sensor solution for multidimensional measurement with integrated decoupling capacitors - New magnetic position sensors for automotive applications support full ISO26262 safety compliance and provide System-in-Package (SiP) format - Obama and Merkel open HANNOVER MESSE - Revolutionize high-performance power conversion with TI’s 600-V GaN FET power stage - THE NEW INVENTION ZR : FLYBOARD® Air - VersaSense presents MicroPnP: the world's first plug-and-play Internet of Things platform based on SmartMesh IP from Linear Technology - Scienlab presents solutions for BMS development based on Linear Technology BMS products - 8µA IQ Surge Stopper Protects Electronic Systems from Overvoltage & Overcurrent Transients - AMP up Your Next SoC Project - New Tools for Human-Machine Collaborative Design - London & Partners: London’s Technology Workers among Most Experienced and Highest Paid in Europe - UW undergraduate team wins $10,000 Lemelson-MIT Student Prize for gloves that translate sign language - Ixia, Marvell and NXP Delivered the First Successful Multivendor Interoperability Demonstration of the AVnu AVB Automotive Profile - element14 adds passives from TE Connectivity, Ohmite, Bourns and Vishay to product portfolio, for industrial applications - Green Housing Trends in Malaysia - Keysight Technologies Announces Strategic Collaboration with San'an-IC to Release Process Design Kits for HBT, pHEMT Processes - Thermophotovoltaic Solar Cells Produce Electricity in the Dark - Making electronics out of coal - A fund for startups built by — and for — Berkeley founders - UltraSoC named in Leap 100 list by City AM and Mishcon de Reya - A Flexible Camera: A Radically Different Approach to Imaging - Robotic consensus - DJI Introduces Next-Generation Matrice 600 Aerial Platform - WiFi Capacity Doubled at Less than Half the Size - Changes on the Board of Directors and Micronas Group Management - Analog Devices and LifeQ Collaborate to Improve Effectiveness of Body Monitoring Devices in Health Management - Digital divide among UK business is holding back the economy - Panasonic Launches "PA-N Relay" Suitable for Programmable Logic Controllers - With simple process, engineers fabricate fastest flexible silicon transistor - LPRS and SPICA Technologies offer Complete End to Enterprise Solution for the Internet of Things - Groundbreaking event in Utica, NY, signals start of construction of new ams wafer fab - Qualcomm and LG Electronics Resolve Arbitration Dispute Over Licensing Terms - NO LIGHTS? NO PROBLEM! FORD FUSION AUTONOMOUS RESEARCH VEHICLES USE LIDAR SENSOR TECHNOLOGY TO SEE IN THE DARK - Robot developed by UGA engineers offers safer, more efficient way to inspect power lines - Hitachi Automotive Systems has developed a high-output 48V lithium-ion battery pack for mild hybrid electric vehicles - Vishay Intertechnology Medium-Power Planar Transformer Provides Higher Efficiency, Space Savings Over Traditional Winding Technology - Compact, Low-Profile Micro-Speakers Target Portable Applications - Tektronix Unlocks End-to-End ABR Monitoring New Adaptive Bit Rate Decryption for Sentry ABR Delivers Real-Time QoS, QoE and PVQ Monitoring for Multiscreen Services - Atmel and Rockchip Join ARM Global University Program Alliance - 14 IC Product Categories to Exceed Total IC Market Growth in 2016 - Qualcomm Signs 3G/4G Chinese Patent License Agreement with Yulong - World’s first development environment for the industrial internet and 5G solutions to be built in Finland - Cisco Global Services Center in Krakow Enters Fifth Year of Operation, Continues to Expand With New Functions - Dispelix Ltd, the next generation Augmented Reality see-through display technology spins out and gets EUR 1.7 million fu - Marvell Anounces Automotive Center of Excellence Grand Opening in Ettlingen Germany - Lattice Expands Award-Winning MachXO3™ Product Family New Product Offers 35 Percent Increase in LUTs and 15 Percent More I/Os, Continuing to Deliver on the Promise of Lowest Cost Per I/O Device - Intel Announces Restructuring Initiative to Accelerate Transformation - Siemens and Airbus sign long-term cooperation agreement in the field of Hybrid Electric Propulsion systems - Tektronix Introduces iPhone App for Source Measure Unit Instruments The Fastest, Easiest Way to Perform Current-Voltage (I-V) Characterization Comes to Apple iPhone and iPad - 1.5A Synchronous Step-Down DC/DC Converter Delivers 93% Efficiency at 2MHz & Operates from 3.0V to 42V Inputs - Rohde & Schwarz to provide Royal Malaysian Navy with leading-edge, IP-based, integrated communications system - Nokia Technologies teams with Steinberg to fully leverage OZO audio technology for virtual reality - Prof Jonathan Coleman awarded €2.2m in European Funding - UltraSoC boosts presence in USA - Daniel Dahan appointed as Farnell element14 Sales operations lead in Benelux - LG ELECTRONICS DEMONSTRATES ATSC 3.0 WIRELESS NETWORK ANTENNA - Altera Demonstrates Ultra High Definition (UHD) Solutions at NAB; Offering a Path to Virtualized Studio Infrastructure - Watly, Solar-Powered Computer that Provides Clean Water, Electricity and Internet - Intel Inside New 3-D Fitness Tracker - The farm tech revolution - MU and STMicroelectron