, NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution
, NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution

The Future of Adaptive Computing: The Composable Data Center

Salil Raje, EVP and GM Xilinx Data Center Group Comments Off on The Future of Adaptive Computing: The Composable Data Center

Most of us are still meeting with our co-workers via online video conferencing after the paradigm shift caused by the COVID-19 pandemic.  You are probably not thinking much of what... Read More

, NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution

20 pins, two rows – and no smarter way for high power connections

New-Tech Magazines Group Ltd. Comments Off on 20 pins, two rows – and no smarter way for high power connections

Following the market’s high demand for the heat and vibration-proof CF1 board-to-FPC connector, Panasonic Industry now launches the new double-row CF2 version for automotive battery management and lighting systems. Munich,... Read More