AMD has announced plans to add native UCIe 1.1 connectivity to select Versal adaptive SoCs, enabling direct, high-bandwidth communication between the devices and specialized co-packaged... Read More
• New cryogenic quantum fridges designed to link hundreds of quantum chips. • Cooled to below 15 millikelvin, more than 180 times colder than deep... Read More
Artificial intelligence is no longer another digital tool for manufacturers. It is becoming the intelligence layer that connects engineering, production and automation into a new... Read More
Tria Technologies’ Cedric Vincent looks in depth at what this ground-breaking legislation means for the embedded industry and how OEMs could avoid heavy financial penalties... Read More
New-Tech Magazines GroupAugust 27, 2026Comments Off on SK hynix Charts Co-Packaged Optics Roadmap for Next-Generation AI Infrastructure
SK hynix has highlighted a new technology roadmap for co-packaged optics (CPO) published in Nature Electronics, outlining how optical interconnects could help overcome the growing bandwidth and energy limitations of... Read More
New-Tech Magazines GroupAugust 27, 2026Comments Off on Infineon to Acquire C2i Semiconductors to Advance AI Data Center Power Delivery
Infineon Technologies has announced the acquisition of C2i Semiconductors, a Bangalore-based specialist in software-defined multiphase controllers and smart power stages for AI data center applications. The transaction is expected to... Read More
July 30, 2026Comments Off on IBM and Qedma Demonstrate Quantum Advantage, Modeling Physics Beyond Classical Capabilities Through Trusted Quantum Computation
By New-Tech Magazine Group TeamJuly 27, 2026Comments Off on Five Semiconductor Trends Defining the Next Generation of Computing
Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry. Based on the TechInsights Semiconductor Outlook 2026, this article explores five trends that are redefining... Read More
New-Tech Magazines GroupAugust 27, 2026Comments Off on SK hynix Charts Co-Packaged Optics Roadmap for Next-Generation AI Infrastructure
SK hynix has highlighted a new technology roadmap for co-packaged optics (CPO) published in Nature Electronics, outlining how optical interconnects could help overcome the growing bandwidth and energy limitations of... Read More
New-Tech Magazines GroupAugust 27, 2026Comments Off on Infineon to Acquire C2i Semiconductors to Advance AI Data Center Power Delivery
Infineon Technologies has announced the acquisition of C2i Semiconductors, a Bangalore-based specialist in software-defined multiphase controllers and smart power stages for AI data center applications. The transaction is expected to... Read More
New-Tech Magazines GroupJuly 31, 2026Comments Off on Bloom Security Launches with $20 Million Seed to Secure the AI-Native Endpoint
Led by Glilot Capital Partners and Ten Eleven Ventures, Bloom Security introduces endpoint security purpose-built for the AI-native endpoint. Bloom Security today announced its launch from stealth with a $20... Read More
July 16, 2023Comments Off on BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.
July 16, 2023Comments Off on BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.