Julien Ryckaert & Eric Beyne, ImecAugust 26, 2019Comments Off on A 3D technology toolbox in support of system-technology co-optimization
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. Eric Beyne, imec fellow and program director of imec’s... Read More
http://news.mit.eduJuly 22, 2019Comments Off on Automated system generates robotic parts for novel tasks
An automated system developed by MIT researchers designs and 3-D prints complex robotic parts called actuators that are optimized according to an enormous number of specifications. In short, the system... Read More
By Sara Ellinger, NXPJuly 15, 2019Comments Off on Fingerprint on Card Technology: The Right Sensor Ensures Scalability and a Consumer-Friendly Experience
Since fingerprint touch sensors were first integrated into smartphones more than five years ago, fingerprint authentication has rapidly replaced PIN codes as consumers’ preferred method for unlocking phones. By delivering... Read More
By Jenson Chang, LUCID Vision LabsJuly 15, 2019Comments Off on Making Inroads into High Speed Vision
Since its introduction in 1980 and standardization in 1983 as IEEE 802.3, Ethernet allows computers to connect to other computers, servers, printers, scanners and other peripherals over single networks. These... Read More
TrinamicJuly 15, 2019Comments Off on An Introduction to Embedded Motion Control
This article will provide an introduction to, and overview of, the subject of embedded motion control and some considerations for design engineers when implementing motion control in embedded systems. Embedded... Read More
By Claire Masterson | ADIJuly 15, 2019Comments Off on Massive MIMO and Beamforming: The Signal Processing Behind the 5G Buzzwords
Introduction Our thirst for high speed mobile data is insatiable. As we saturate the available RF spectrum in dense urban environments, it’s becoming apparent that there’s a need to increase... Read More
By David Decker | Samtec, Inc.July 15, 2019Comments Off on How To Optimize Solder Stencil Aperture To Increase Connector Options
Designers of high-density electronics systems can now match 0.15 mm co-planarity connectors with 0.10 mm thick solder stencils through careful aperture design. As electronic systems increase in component density, designers... Read More
Tony Armstrong, Analog DevicesJune 26, 2019Comments Off on Silent Switcher Devices Are Quiet and Simple
Introduction It goes without saying that PC board layout determines the success or failure of every power supply design. It sets functional, electromagnetic interference (EMI), and thermal behavior. While switching... Read More