Introduction Our thirst for high speed mobile data is insatiable. As we saturate the available RF spectrum in dense urban environments, it’s becoming apparent that there’s a need to increase... Read More

Designers of high-density electronics systems can now match 0.15 mm co-planarity connectors with 0.10 mm thick solder stencils through careful aperture design. As electronic systems increase in component density, designers... Read More

Introduction It goes without saying that PC board layout determines the success or failure of every power supply design. It sets functional, electromagnetic interference (EMI), and thermal behavior. While switching... Read More

Abstract For digitally beamformed phased arrays, a common implementation method considered for the LO generation is to distribute a common reference frequency to a series of phase-locked loops distributed within... Read More