Samsung and Broadcom Expand AI Chip Collaboration, Partnership Could Exceed $200 Billion

New-Tech Magazines Group Ltd. Comments Off on Samsung and Broadcom Expand AI Chip Collaboration, Partnership Could Exceed $200 Billion

Samsung Electronics and Broadcom have signed a memorandum of understanding (MoU) to expand their collaboration across advanced memory, semiconductor manufacturing and advanced packaging technologies. The initiative is aimed at supporting... Read More

Five Semiconductor Trends Defining the Next Generation of Computing

By New-Tech Magazine Group Team Comments Off on Five Semiconductor Trends Defining the Next Generation of Computing

Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry. Based on the TechInsights Semiconductor Outlook 2026, this article explores five trends that are redefining... Read More

Is RF Design Ready for Its Biggest Methodological Shift in Decades?

New-Tech Magazines Group Ltd. Comments Off on Is RF Design Ready for Its Biggest Methodological Shift in Decades?

A Princeton University research project suggests that future RF components may no longer be designed by refining existing geometries, but by defining the desired performance first and allowing AI-assisted algorithms... Read More

Qedma Integrates its Advanced Error Mitigation Software with Quantinuum’s Quantum Computing Platform

New-Tech Magazines Group Ltd. Comments Off on Qedma Integrates its Advanced Error Mitigation Software with Quantinuum’s Quantum Computing Platform

QESEM software enables enterprise and scientific research users of Quantinuum’s highly accurate quantum computers to further improve circuit fidelity Qedma today announced an integration with Quantinuum’s platform that will allow... Read More