Würth Elektronik eiSos Supplies Wireless Power Coil for Semtech’s LinkCharge® LP Multi-Device Wireless Charging Solution

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Waldenburg (Germany), 27 October 2017 – Würth Elektronik eiSos, a manufacturer of electronic and electromechanical components, announced its collaboration with Semtech Corporation (Nasdaq: SMTC) by integrating its transmission coil, WE-WPCC,... Read More

New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with BSI Pixel Technology to Satisfy Challenging Security and Surveillance Applications

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PHOENIX, Ariz. – 26 October, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel... Read More

HEITEC Emphasizes Industry Expertise Top-of-the-range chassis systems

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HEITEC offers customers a comprehensive chassis technology portfolio. In addition to components for complete 19” packaging systems, the product range includes instrument cases and system enclosures as well as an... Read More

congatec virtualizes robust COM Express Type 7 Server-on-Module

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congatec presents virtualized fog server installation congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – will be presenting its... Read More

STMicroelectronics Announces Class-Leading Water-Resistant Pressure Sensor and First Design Win in High-Performance Wearables from Samsung

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  Advanced water-resistant 10bar pressure sensor achieves best-in-class accuracy and stability for new, go-anywhere smart wearables Major design win in new Samsung Gear Fit 2 Pro range launched autumn 2017... Read More

New dual-band Wi-Fi radio module with Bluetooth functionality from Panasonic enables high data rates and low-power operation

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PAN9026 ideal for highly integrated and cost-effective applications Panasonic Industry Europe is announcing a dual-band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi radio module with integrated Bluetooth BDR/EDR/LE functionality. The new PAN9026... Read More

OMC launches new small-footprint SMA Tx/Rx housings

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Smallest footprint; up to 25% space-saving; all-metal package; secure connection to PCB OMC, the pioneer in optoelectronics manufacturing, has launched two new high density PCB-mounting SMA (H22) style housings for... Read More