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Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC

www.cypress.com November 19, 2017 Comments Off

Cypress Memory Products are the Industry’s First to Pass Stringent Qualification Process Cypress Semiconductor Corp. (CY), the market leader in advanced embedded system solutions including radiation-hardened memories, and United Microelectronics... Read More

TI DLP® technology enables next-generation augmented reality head-up displays

November 19, 2017 Comments Off

New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery Texas Instruments (TI) (NASDAQ: TXN) today unveiled the next evolution of... Read More

Toshiba Electronic Devices & Storage Corporation Releases 1.5A LDO Regulators in Industry’s Smallest Package for Mobile Applications

toshiba.semicon-storage.com November 15, 2017 Comments Off

Toshiba Electronic Devices & Storage Corporation has today started shipping “TCR15AG,” a low-dropout (LDO) regulator series in the industry’s smallest[1] WCSP6F package. The TCR15AG series is suitable for mobile and... Read More

Next-Generation Smart Objects Can Do More and Consume Less with New STM32L4+ Microcontrollers Series from STMicroelectronics

www.st.com November 15, 2017 Comments Off

Best-in-class memory and new graphics features bring sharper user experiences to wearables and smart objects Advanced controller, optimized for small, circular displays, boosts pixel-handling efficiency Proven power-saving architecture enables richer... Read More

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Tag Archives : New Products

Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC

TI DLP® technology enables next-generation augmented reality head-up displays

Toshiba Electronic Devices & Storage Corporation Releases 1.5A LDO Regulators in Industry’s Smallest Package for Mobile Applications

Next-Generation Smart Objects Can Do More and Consume Less with New STM32L4+ Microcontrollers Series from STMicroelectronics

Ultra-Compact 3 W Wall Plug Adapters Meet DoE Level VI and CoC Tier 2 Efficiency Standards

NI Announces Industry’s First PXI Chassis With 58 W of Power and Cooling per Slot

Intel and Micron Increase 3D XPoint Manufacturing Capacity with IM Flash Fab Expansion

Improve response time to critical system events on CAN networks with new 8-bit MCU with Core Independent Peripherals

Würth Elektronik eiSos extends STAR-TEC snap ferrite family Thick Cables Elegantly Interference-Suppressed

Latest single-wire serial EEPROM from Microchip enables remote identification