Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology

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Arrow Electronics has announced the launch of a new evaluation platform, jointly designed in collaboration with Microchip Technology, Bourns, and Amphenol: 10BASE-T1S REF_SPE_T1S reference design board. This reference design assists... Read More

Wireless modules for embedded systems now available from Tria Technologies

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Multi-protocol modules support WiFi®, Bluetooth® and mesh networking standards Tria Technologies™, an Avnet company specializing in embedded compute boards, systems and HMIs, has announced the availability of two new wireless... Read More

Power Integrations Extends Flyback Topology to Enable 440 W, Offering Simpler Alternatives to Resonant Power Designs

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New TOPSwitchGaN ICs more than double power output, reducing system cost, complexity, and design time Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today... Read More

DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration

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Free, browser-based design environment streamlines engineering workflows from simulation to BOM export and purchasing  THIEF RIVER FALLS, Minn., USA ­— DigiKey, the global distribution leader of electronic components and automation... Read More

Infineon introduces ultra-low noise XENSIV™ TLE4978 hybrid Hall and coil current sensor for next-generation power systems

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Munich, Germany – 17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XENSIV™ sensor portfolio with the TLE4978 family of coreless, isolated magnetic current sensors... Read More

Infineon introduces highly integrated USB-C Power Delivery microcontroller for high-voltage battery charging

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Infineon Technologies has introduced the EZ-PD™ PMG1-B2, described as the industry’s first single-port USB Type-C Power Delivery microcontroller with an integrated 55 V buck-boost controller designed for charging lithium-ion battery... Read More

Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands

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 Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond Impress leverages insights and engineering expertise from NearStack OTS, with... Read More