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NXP Launches World’s First Scalable, Single-Chip Secure Vehicle-to-X Platform

https://media.nxp.com September 13, 2017 Comments Off on NXP Launches World’s First Scalable, Single-Chip Secure Vehicle-to-X Platform

NXP Semiconductors N.V. (NASDAQ:NXPI), the world’s largest supplier of automotive semiconductor solutions, has expanded its leadership in secure vehicle-to-everything communications (V2X) with its next generation RoadLINK™ solution. The new NXP SAF5400 is... Read More

Osram presents innovative SMARTRIX modules

https://www.osram-group.com September 12, 2017 Comments Off on Osram presents innovative SMARTRIX modules

Matrix light not only contributes to greater road safety but also gives headlight designers greater freedom thanks to its smaller dimensions. This technology is therefore very much on the march.... Read More

Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System

https://www.renesas.com September 12, 2017 Comments Off on Renesas Electronics High-Performance Automotive Chips Adopted by Nissan for its New LEAF Automated-Parking System

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions today announced that its R-Car system-on-chip (SoC) for car infotainment and advanced driving assistant systems (ADAS) as well as... Read More

New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package

https://www.st.com September 11, 2017 Comments Off on New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package

New 8-bit Microcontroller from STMicroelectronics Delivers Uniquely Flexible Feature Set in Space/Cost-Saving 8-Pin Package STMicroelectronics is extending choice and freedom for budget-conscious designers by introducing its new 8-bit STM8S001 microcontroller... Read More

Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects

https://www.st.com September 8, 2017 Comments Off on Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects

To help product innovators streamline prototyping and development of connected smart objects, STMicroelectronics has created the SPBTLE-1S ready-to-use Bluetoothֲ® Low Energy (BLE) module that integrates all the components needed to... Read More