NEW PRODUCTS | Page 131 of 318

Latest News

Infineon marks innovation milestone with world’s first300-millimeter power silicon carbide (SiC) wafer
Inova and Lattice Demonstrate Same-Cycle Distributed Motor Control for a Humanoid Hand with DLR Powered by Lattice FPGAs
Phinergy Completes Acceptance Tests for 72 kW Backup-Power Module, Opens Data Centre Demonstration Site
Marvell Signs $115 Billion Enterprise-Value Deal to Acquire Lumentum
Tower Semiconductor Reports Record $526 Million Third-Quarter Revenue
Bites Raises $40M Series A to Turn Frontline Training into a Business Performance Engine
Siemens introduces next generation of Sinamics G drives
Samtec to Exhibit Defense, Aerospace, and Robotics Solutions at electronica 2026
Unconventional AI to Acquire NeuReality, Accelerating Its Path to 1,000x AI Compute Efficiency
DigiKey Accelerates Access to TDK SensEI’s edgeRX Starter Solution for Industrial AI and Predictive Maintenance

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

February 27, 2019 Comments Off

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight... Read More

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

February 26, 2019 Comments Off

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user... Read More

Joint Demonstration of Anritsu 5G Tester with TCL Communication 5G USB Device at MWC2019

February 26, 2019 Comments Off

Anritsu today announced it will jointly demonstrate its MT8000A 5G tester with TCL Communication’s first 5G USB device at Mobile World Congress 2019. The TCL Communication 5G USB device is... Read More

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

February 26, 2019 Comments Off

Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at 10 times the speed and... Read More

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

February 26, 2019 Comments Off

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package,... Read More

PolarFire FPGA-based solution enables lowest-power, smallest-form-factor 4K video and imaging applications

February 21, 2019 Comments Off

Microchip announces the new PolarFire™ FPGA imaging and video solution to address the challenges of developing complex computer algorithms which enable systems to capture and display information and high-resolution images.... Read More

New TWIN SerDes devices in the APIX3 family from Inova Semiconductors

February 20, 2019 Comments Off

Two new APIX3 SerDes TWIN transmitters, each with two independent transmission channels, are now available from Inova Semiconductors. APIX (Automotive Pixel Link) is a multi-channel SerDes (serializer/deserializer) technology developed by... Read More

« First ‹ Previous 129 130131132 133 Next ›Last »

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

Joint Demonstration of Anritsu 5G Tester with TCL Communication 5G USB Device at MWC2019

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

PolarFire FPGA-based solution enables lowest-power, smallest-form-factor 4K video and imaging applications

New TWIN SerDes devices in the APIX3 family from Inova Semiconductors

Vicor Power Systems introduces a new family of VITA 62 compliant power supplies for MIL-COTS VPX applications

Low Power SSD Controller: X1 for Reliable 3D Flash Support

3 W and 5 W Encapsulated Ac-Dc Power Supplies Offer Multiple Mounting Options