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Teledyne e2v releases first military qualified Arm® based processor for Hi-Reliability applications

www.teledyne-e2v.com March 12, 2019 Comments Off

Teledyne e2v, an aerospace qualified manufacturer of advanced semiconductors, has qualified and released the first upscreened processor from NXP’s new Layerscape®Series, the LS1046A, to operate at -55°C to 125°C. The... Read More

Intel Announces First 58Gbps FPGA Transceiver in Volume Production Enabling 400G Ethernet Deployment

newsroom.intel.com March 12, 2019 Comments Off

What’s New: At the Optical Fiber Communications (OFC) conference in San Diego this week, Intel’s Programmable Solutions Group is showcasing market-leading 58Gbps transceiver technology integrated on the Intel® Stratix® 10 TX FPGA —... Read More

II-VI Incorporated and Samtec Demonstrate 56 Gbps PAM4 per Channel FireFly™ On-Board Optical Engines at OFC 2019

March 7, 2019 Comments Off

II-VI Incorporated (Nasdaq:IIVI), a global leader in optical components for datacom transmission and Samtec, a privately held global manufacturer of a broad line of electronic interconnect solutions, today unveiled a... Read More

New SAR ADC family enables high-speed, high-resolution analogue-to-digital conversion in harsh environments

March 7, 2019 Comments Off

Microchip announces 12 new Successive Approximation Register (SAR) Analogue-to-Digital Converters (ADCs) together with a companion differential amplifier designed specifically for the new portfolio of SAR ADCs. Designed to operate in... Read More

Toshiba starts sample shipments of automotive DC motor driver IC with LIN slave function

March 5, 2019 Comments Off

Toshiba Electronics Europe GmbH has started sample shipments of an automotive DC motor driver IC with a LIN (Local Interconnect Network) slave function that can communicate with a LIN 2.0... Read More

New ams light sensor with 50/60Hz flicker detect helps mobile phones take great photos every time

ams.com March 4, 2019 Comments Off

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduces a new color (RGB), proximity and flicker detection sensor, the TCS3707, which enables a mobile phone camera... Read More

Toshiba Memory Europe Adds BiCS FLASH To Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products

March 1, 2019 Comments Off

Toshiba Memory Europe GmbH today announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate Toshiba... Read More

Dialog Semiconductor’s Latest Family of Bluetooth Low Energy Wireless Multi-core MCUs, sets the Standard for Tomorrow’s Users

February 27, 2019 Comments Off

Dialog Semiconductor plc (XETRA:DLG), a provider of custom and configurable power management, AC/DC power conversion, charging and Bluetooth® low energy technology, today unveiled the SmartBond™ DA1469x family of Bluetooth low... Read More

New fully integrated embedded motor controller with extended memory for automotive applications

www.micronas.com February 27, 2019 Comments Off

TDK Corporation (TSE 6762) expands its Micronas embedded motor controller portfolio with the HVC 4420F, featuring extended flash memory for the drive of small brush-type, stepper, or brushless motors. It... Read More

Cypress USB-C with Power Delivery Making Universal Power Adapters a Reality

February 27, 2019 Comments Off

Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today introduced a USB-C Power Delivery (PD) solution designed to reduce the e-waste resulting from the estimated one million tons of... Read More

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