May 28, 2020Comments Off on Application-ready congatec COM/carrier combo
Size-optimized congatec SMARC 2.1 carrier board makes Intel Atom processor based 3.5-inch SBCs modular Deggendorf, Germany, 28 May 2020 * * * congatec – a leading vendor of embedded computer technology... Read More
April 21, 2020Comments Off on eMCOS® Hypervisor by eSOL: new virtualization function to eMCOS scalable RTOS
Paris and Tokyo, April 21, 2020 – eSOL, a leading global specialist in embedded software systems, announced the immediate availability of its eMCOS® Hypervisor, a ground-breaking embedded virtualization function for... Read More
August 10, 2019Comments Off on Sundance launches VCS-1 embedded processor module for precision robotics applications
Optimized for robotics, using Computer Vision, Edge AI and Deep Learning Utilizes industry-standard PC/104 form factor Developed for the EU’s VineScout viticulture project (Project ID: 737669) Chesham, UK – August... Read More
May 22, 2019Comments Off on IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality
IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces the immediate availability of the leading C/C++ compiler and debugger toolchain IAR Embedded Workbench® with support... Read More
www.micronas.comFebruary 27, 2019Comments Off on New fully integrated embedded motor controller with extended memory for automotive applications
TDK Corporation (TSE 6762) expands its Micronas embedded motor controller portfolio with the HVC 4420F, featuring extended flash memory for the drive of small brush-type, stepper, or brushless motors. It... Read More
February 12, 2019Comments Off on PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms
Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and... Read More
news.samsung.comFebruary 1, 2019Comments Off on Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage
Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in... Read More
www.cypress.comJanuary 29, 2019Comments Off on Cypress Advances Premium Automotive Infotainment User Experience with Wi-Fi 6 Connectivity Solution
Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced the expansion of its industry-leading wireless connectivity portfolio for automotive infotainment with a trio of new products. The Wi-Fi® and... Read More
January 23, 2019Comments Off on Toshiba Memory Europe Unveils Industry’s First UFS Ver. 3.0 Embedded Flash Memory Devices
Toshiba Memory Europe GmbH (TME) has started sampling the 128GB[1] version of the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilizes the... Read More
January 16, 2019Comments Off on Cypress Advances Premium Automotive Infotainment User Experience with Wi-Fi 6 Connectivity Solution
Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced the expansion of its industry-leading wireless connectivity portfolio for automotive infotainment with a trio of new products. The Wi-Fi® and... Read More