u-blox’s announces first cellular module featuring an embedded SIM (eSIM)

New-Tech Magazines Group Ltd. Comments Off on u-blox’s announces first cellular module featuring an embedded SIM (eSIM)

The SARA-R500E LTE-M module with an embedded SIM (eSIM) offers product developers an integrated, robust, and secure solution to connect size-constrained IoT applications to the cellular network. u-blox (SIX:UBXN), a... Read More

Direct Insight creates QNX 7 BSP for power-efficient Toradex Colibri iMX8X SoC modules

New-Tech Magazines Group Ltd. Comments Off on Direct Insight creates QNX 7 BSP for power-efficient Toradex Colibri iMX8X SoC modules

Suits medical devices, industrial automation, data acquisition, robotics and moreOxfordshire, UK June 2021: Direct Insight, the UK-based, technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has... Read More

Application-ready congatec COM/carrier combo

Comments Off on Application-ready congatec COM/carrier combo

Size-optimized congatec SMARC 2.1 carrier board makes Intel Atom processor based 3.5-inch SBCs modular Deggendorf, Germany, 28 May 2020 * * * congatec – a leading vendor of embedded computer technology... Read More

IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality

Comments Off on IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality

IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces the immediate availability of the leading C/C++ compiler and debugger toolchain IAR Embedded Workbench® with support... Read More

PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

Comments Off on PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and... Read More