Components | Page 12 of 57

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

February 26, 2019 Comments Off

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user... Read More

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

February 26, 2019 Comments Off

Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at 10 times the speed and... Read More

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

February 26, 2019 Comments Off

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package,... Read More

New TWIN SerDes devices in the APIX3 family from Inova Semiconductors

February 20, 2019 Comments Off

Two new APIX3 SerDes TWIN transmitters, each with two independent transmission channels, are now available from Inova Semiconductors. APIX (Automotive Pixel Link) is a multi-channel SerDes (serializer/deserializer) technology developed by... Read More

ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications

February 14, 2019 Comments Off

Out-of-the-box sensor platform provides enhanced sensor technology with industry’s lowest power Bluetooth® Low Energy NUREMBERG, Germany – 13 February, 2019 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is... Read More

Xilinx Introduces HDMI 2.1 IP Subsystem

www.xilinx.com February 6, 2019 Comments Off

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that it has introduced a complete HDMI™ 2.1 IP subsystem to its portfolio of intellectual property cores, enabling Xilinx®... Read More

Samsung Breaks Terabyte Threshold for Smartphone Storage with Industry’s First 1TB Embedded Universal Flash Storage

news.samsung.com February 1, 2019 Comments Off

Samsung Electronics, the world leader in advanced memory technology, announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in... Read More

Renesas Electronics Expands RX24T and RX24U Microcontroller Lineup for High-Temperature-Tolerant Motor Control Applications

January 31, 2019 Comments Off

New 32-Bit MCUs Support Circuit Boards in High-Temperature Locations and Compact Circuit Board Design in Space-Constrained Home Appliances and Industrial Machinery Düsseldorf, January 31, 2019 – Renesas Electronics Corporation (TSE:... Read More

Samsung Enables Stunning Picture Quality and Elegant Designs in 8K TVs with Advanced Display Driver IC

January 30, 2019 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today announced an 8K display driver IC (DDI) that helps deliver true-to-life 8K resolution in sleek TV designs with industry-leading intra-panel... Read More

Microchip’s First Libero SoC Design Suite Release Boosts FPGA Designer Productivity and Delivers One Unified Design Suite for Latest Families

January 30, 2019 Comments Off

As each new generation of devices scale, Field Programmable Gate Array (FPGA) designs are increasing in complexity and resource utilization, making designer productivity essential to accelerating time to market. Microchip... Read More