Components | Page 14 of 56

New Infineon IFX007T – An easy-to-use high power motor driver qualified for industrial and consumer applications

November 9, 2018 Comments Off

Munich, Germany – 9 November 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the IFX007T NovalithIC™ motor driver for industrial applications. The IFX007T smart half-bridge provides... Read More

Murata shrinks NBIoT module and stretches battery life

November 9, 2018 Comments Off

Hoofddorp, Netherlands: Murata today announced what is believed to be the world’s smallest narrow-band IoT (NBIoT) cellular wireless module. The LBAD0ZZ1RX measures just 15.6 mm x 14.0 mm x 2.2... Read More

TI unlocks mmWave technology for worldwide industrial market through new 60-GHz sensor portfolio

https://newscenter.ti.com November 8, 2018 Comments Off

To advance millimetre-wave (mmWave) sensor technology in worldwide industrial applications, Texas Instruments (TI) (NASDAQ: TXN) today announced its 60-GHz sensor portfolio, the highest resolution single-chip, complementary metal-oxide semiconductor (CMOS), for... Read More

Maxim’s Digital Input ICs Deliver 50% Smaller Footprint, 60% Lower Power and 6x Faster Throughput

November 6, 2018 Comments Off

MUNICH, Germany – November 6, 2018 – Designers of industrial equipment striving to meet the size, power and performance requirements of Industry 4.0 applications can now turn to an expanded... Read More

50 Megapixel CCD Image Sensor from ON Semiconductor Targets Inspection of Smartphone Displays

https://www.onsemi.com November 1, 2018 Comments Off

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image... Read More

Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market

news.samsung.com October 31, 2018 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new 0.8-micrometer (μm) pixel image sensors – the 48-megapixel (Mp) Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL... Read More

ON Semiconductor Introduces Mesh Networking and New Development Support for Industry-Leading RSL10 Bluetooth® 5 Radio Family

October 31, 2018 Comments Off

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has extended the capabilities of its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with support for the Bluetooth SIG mesh... Read More

Toshiba announces Bluetooth® 5 IC for automotive applications

October 31, 2018 Comments Off

Toshiba Electronics Europe (“Toshiba”) has announced a new Bluetooth® IC for automotive applications will be added to their IC line-up. The TC35681IFTG is based on an arm® Cortex®-M0 CPU and... Read More

New Connected-Car Automotive MCU from STMicroelectronics Enables Secure Remote Updates and High-Speed In-Vehicle Networking

www.st.com October 31, 2018 Comments Off

STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, is making connected cars safer, more flexible, and future-proof with its latest high-performance, multi-core, multi-interface... Read More

TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0

https://newscenter.ti.com October 31, 2018 Comments Off

Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara™ AM6x processor family provides industrial-grade reliability, with... Read More

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