Components | Page 11 of 57

Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity

May 30, 2019 Comments Off

Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers... Read More

Renesas Electronics Launches RX23E-A Group, First RX Microcontrollers Built-In Industry-Leading Analog Front End For High-Precision Sensing and Measurement Equipment

www.renesas.com May 28, 2019 Comments Off

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23E-A Group 32-bit RX microcontrollers (MCUs), combining high-precision analog front end (AFE) and an MCU... Read More

Renesas Launches RX72T Group to Expand Microcontroller Options for Servo Control in Industrial Robots

May 16, 2019 Comments Off

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX72T Group of 32-bit motor control microcontrollers (MCUs) with dedicated hardware accelerator IP to perform the... Read More

u-blox takes continuous lane accurate positioning to challenging urban environments

May 7, 2019 Comments Off

u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the u‑blox ZED-F9K high precision multi-band GNSS (Global Navigation Satellite System) module with built-in inertial sensors.... Read More

Maxim Unveils Smallest, Most Power-Efficient Dual IO-Link Transceiver with DC-DC Regulator and Surge Protection

www.maximintegrated.com April 5, 2019 Comments Off

Designers can now enable smarter digital factories with the MAX22513 surge-protected, dual-driver IO-Link® device transceiver with integrated DC-DC buck regulator from Maxim Integrated Products, Inc. (NASDAQ: MXIM). As the industry’s smallest,... Read More

Toshiba’s new small surface mount LDO regulators lower power consumption

March 25, 2019 Comments Off

Toshiba Electronics Europe GmbH has launched two new series of small surface mount LDO regulators for application in the power supply of mobile devices, imaging and audio-visual products. The 40... Read More

Samsung Develops Industry’s First 3rd-generation 10nm-Class DRAM for Premium Memory Applications

March 21, 2019 Comments Off

New 8Gb DDR4 based on most advanced 1z-nm process enables DRAM solutions with ultra-high performance and power efficiency The 1z-nm 8Gb DDR4 to be in mass production in the second... Read More

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications

https://www.onsemi.com March 19, 2019 Comments Off

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced two new silicon carbide (SiC) MOSFET devices. The industrial grade NTHL080N120SC1 and AEC-Q101 automotive grade NVHL080N120SC1 bring the enabling, wide-ranging... Read More

Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones

news.samsung.com March 17, 2019 Comments Off

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile DRAM – the industry’s first 12-gigabyte (GB) low-power double data... Read More

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

February 27, 2019 Comments Off

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight... Read More