Components | Page 11 of 56

Samsung Develops Industry’s First 3rd-generation 10nm-Class DRAM for Premium Memory Applications

March 21, 2019 Comments Off

New 8Gb DDR4 based on most advanced 1z-nm process enables DRAM solutions with ultra-high performance and power efficiency The 1z-nm 8Gb DDR4 to be in mass production in the second... Read More

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications

https://www.onsemi.com March 19, 2019 Comments Off

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced two new silicon carbide (SiC) MOSFET devices. The industrial grade NTHL080N120SC1 and AEC-Q101 automotive grade NVHL080N120SC1 bring the enabling, wide-ranging... Read More

Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones

news.samsung.com March 17, 2019 Comments Off

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile DRAM – the industry’s first 12-gigabyte (GB) low-power double data... Read More

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

February 27, 2019 Comments Off

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight... Read More

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

February 26, 2019 Comments Off

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user... Read More

Toshiba Image Recognition SoC for Automotive Applications Integrates a Deep Neural Network Accelerator

February 26, 2019 Comments Off

Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at 10 times the speed and... Read More

e-peas Applies its Ultra-Low Power Technology to Thermally-Based Energy Harvesting

February 26, 2019 Comments Off

e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a space-saving 28-pin QFN package,... Read More

New TWIN SerDes devices in the APIX3 family from Inova Semiconductors

February 20, 2019 Comments Off

Two new APIX3 SerDes TWIN transmitters, each with two independent transmission channels, are now available from Inova Semiconductors. APIX (Automotive Pixel Link) is a multi-channel SerDes (serializer/deserializer) technology developed by... Read More

ON Semiconductor Introduces the RSL10 Sensor Development Kit for Power-Optimized IoT Applications

February 14, 2019 Comments Off

Out-of-the-box sensor platform provides enhanced sensor technology with industry’s lowest power Bluetooth® Low Energy NUREMBERG, Germany – 13 February, 2019 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is... Read More

Xilinx Introduces HDMI 2.1 IP Subsystem

www.xilinx.com February 6, 2019 Comments Off

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that it has introduced a complete HDMI™ 2.1 IP subsystem to its portfolio of intellectual property cores, enabling Xilinx®... Read More

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