Mistral today announced that it has raised €3 billion in a Series D funding round at a post-money valuation of more than €21 billion, the largest equity fundraising round ever... Read More

RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for... Read More

The UK fabless chipmaker intends to recruit 20 specialist engineers over the next six months, adding European design capacity for satellite communications, physical-layer processing and application-specific silicon. EnSilica plans to... Read More

The cumulative figure includes tool certification, R&D and selected Intel 18A production layers. Intel says overlay, throughput and availability meet its expectations, but has not disclosed numerical manufacturing data. Intel... Read More

Vector is introducing vSECC.InPlug, a new communication controller board for DC charging infrastructures. By relocating charging communication directly into the DC charging connector, the solution enables cable runs of up... Read More

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation... Read More

The smartwatch combines a low-power NFC payment chip with a tokenized wallet supporting Mastercard and Visa services, marking the first integration of both SECORA Connect X and SECORA Wallet in... Read More

First wafers are scheduled to ship in September, moving the companies’ manufacturing agreement from development towards sampling—but qualification and volume-production details remain undisclosed. Navitas Semiconductor says the first wafers for... Read More