The Series C values Lyte at $1.6 billion as the company moves its multimodal LyteVision platform into production deployments across inspection, logistics and manufacturing. Lyte has raised $165 million in... Read More
mPTech Integrates Infineon’s SECORA Payment Technology into HAMMER WATCH 3
The smartwatch combines a low-power NFC payment chip with a tokenized wallet supporting Mastercard and Visa services, marking the first integration of both SECORA Connect X and SECORA Wallet in... Read More
Navitas Moves Gen 5 GaNFast Devices onto GlobalFoundries’ 200 mm GaN Line
First wafers are scheduled to ship in September, moving the companies’ manufacturing agreement from development towards sampling—but qualification and volume-production details remain undisclosed. Navitas Semiconductor says the first wafers for... Read More
sensiBel Introduces Optical MEMS Microphone with 136 dB Dynamic Range
The Norwegian company’s SBM140B combines a claimed 84 dBA signal-to-noise ratio with a 146 dB SPL overload point and 24-bit digital output, with production planned for early 2027. Norwegian sensor... Read More
Act Security Makes First Acquisition One Month After Emerging From Stealth
The cybersecurity company acquired Cloud Copilot and is using its technology to launch Amphi, a free, open-source toolkit designed to help cloud engineers test and manage access policies before they... Read More
Echo’s Mythos Readiness Report Finds AI Has Solved Vulnerability Discovery, Making Judgment the Scarce Resource
New Echo research shows that the vulnerabilities attackers actually exploit are rarely the ones AI just found; they’re the ones organizations already knew about. Echo’s readiness framework maps how organizations... Read More
Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips
Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of the microstructures needed for this // Ultra-fine structures are created... Read More
NVIDIA and MediaTek Deepen Long-Standing Partnership to Build AI Edge to Cloud Computing Platforms
Companies Expand Collaboration Across Multigenerational Cloud AI Factories, Local AI Computing and Automotive MediaTek to Adopt New NVIDIA NVLink Fusion Platform, Helping Customers Take Custom XPUs to NVIDIA NVLink-Connected, Rack-Scale... Read More
SK hynix Charts Co-Packaged Optics Roadmap for Next-Generation AI Infrastructure
SK hynix has highlighted a new technology roadmap for co-packaged optics (CPO) published in Nature Electronics, outlining how optical interconnects could help overcome the growing bandwidth and energy limitations of... Read More
AMD Brings UCIe Connectivity to Versal Adaptive SoCs for Chiplet-Based Systems
AMD has announced plans to add native UCIe 1.1 connectivity to select Versal adaptive SoCs, enabling direct, high-bandwidth communication between the devices and specialized co-packaged chiplets. The first products to... Read More
























