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NVIDIA and Palantir Deploy AI Stack to Manage NVIDIA’s Supply Chain

September 10, 2026 Comments Off on NVIDIA and Palantir Deploy AI Stack to Manage NVIDIA’s Supply Chain

The system combines NVIDIA Nemotron open models with Palantir Foundry, AIP and Ontology. Its first deployment is supporting materials allocation and supply chain decisions within NVIDIA’s own operations NVIDIA and... Read More

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

New-Tech Magazines Group September 9, 2026 Comments Off on Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework for 800 Volts direct current (VDC) architecture SSCB technology is designed to interrupt DC faults... Read More

Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

New-Tech Magazines Group September 9, 2026 Comments Off on Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

New industrial FDM® platform expands Stratasys’ production-grade portfolio with the longest heated build capacity in its class, enabling cost-effective tooling, fixtures and end-use parts for demanding manufacturing environments MINNETONKA, Minn.... Read More

Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

New-Tech Magazines Group September 8, 2026 Comments Off on Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in next-gen HPC, AI, quantum computing, photonics and neuromorphic computing This week, at the 2026 Applied... Read More

DiaFlux™ Thermal-Grade CVD Diamond Heat Spreaders in Two Grades

New-Tech Magazines Group September 8, 2026 Comments Off on DiaFlux™ Thermal-Grade CVD Diamond Heat Spreaders in Two Grades

RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for... Read More

EnSilica Plans Milan Centre for Modem and mmWave ASIC Development

New-Tech Magazines Group September 8, 2026 Comments Off on EnSilica Plans Milan Centre for Modem and mmWave ASIC Development

The UK fabless chipmaker intends to recruit 20 specialist engineers over the next six months, adding European design capacity for satellite communications, physical-layer processing and application-specific silicon. EnSilica plans to... Read More

Intel and ASML Report More Than One Million Wafers Processed With High-NA EUV

New-Tech Magazines Group September 8, 2026 Comments Off on Intel and ASML Report More Than One Million Wafers Processed With High-NA EUV

The cumulative figure includes tool certification, R&D and selected Intel 18A production layers. Intel says overlay, throughput and availability meet its expectations, but has not disclosed numerical manufacturing data. Intel... Read More

Up to 100 Meters Between Vehicle and Charging Station: Vector Launches vSECC.InPlug for Bus and Truck Depots

New-Tech Magazines Group September 7, 2026 Comments Off on Up to 100 Meters Between Vehicle and Charging Station: Vector Launches vSECC.InPlug for Bus and Truck Depots

Vector is introducing vSECC.InPlug, a new communication controller board for DC charging infrastructures. By relocating charging communication directly into the DC charging connector, the solution enables cable runs of up... Read More

Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages

New-Tech Magazines Group September 7, 2026 Comments Off on Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation... Read More