The system combines NVIDIA Nemotron open models with Palantir Foundry, AIP and Ontology. Its first deployment is supporting materials allocation and supply chain decisions within NVIDIA’s own operations NVIDIA and... Read More
Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers
Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework for 800 Volts direct current (VDC) architecture SSCB technology is designed to interrupt DC faults... Read More
Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale
New industrial FDM® platform expands Stratasys’ production-grade portfolio with the longest heated build capacity in its class, enabling cost-effective tooling, fixtures and end-use parts for demanding manufacturing environments MINNETONKA, Minn.... Read More
Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects
New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in next-gen HPC, AI, quantum computing, photonics and neuromorphic computing This week, at the 2026 Applied... Read More
Mistral raises €3B to make sovereign, open-weight AI the technology frontier
Mistral today announced that it has raised €3 billion in a Series D funding round at a post-money valuation of more than €21 billion, the largest equity fundraising round ever... Read More
DiaFlux™ Thermal-Grade CVD Diamond Heat Spreaders in Two Grades
RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for... Read More
EnSilica Plans Milan Centre for Modem and mmWave ASIC Development
The UK fabless chipmaker intends to recruit 20 specialist engineers over the next six months, adding European design capacity for satellite communications, physical-layer processing and application-specific silicon. EnSilica plans to... Read More
Intel and ASML Report More Than One Million Wafers Processed With High-NA EUV
The cumulative figure includes tool certification, R&D and selected Intel 18A production layers. Intel says overlay, throughput and availability meet its expectations, but has not disclosed numerical manufacturing data. Intel... Read More
Up to 100 Meters Between Vehicle and Charging Station: Vector Launches vSECC.InPlug for Bus and Truck Depots
Vector is introducing vSECC.InPlug, a new communication controller board for DC charging infrastructures. By relocating charging communication directly into the DC charging connector, the solution enables cable runs of up... Read More
Infineon sets new power benchmark for AI accelerators and vertical power delivery with 2 A/mm² dual-phase smart power stages
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation... Read More
























