Ericsson (NASDAQ: ERIC) and Intel, together with China Mobile Research Institute and China Mobile Jiangsu Company, have successfully demonstrated the first 3GPP-compliant, multi-vendor Standalone (SA) 5G New Radio (NR) call... Read More
Industrial Internet and Connected Vehicles Drive IoT Sales Through 2021
IC Insights recently released its Update to its 2018 IC Market Drivers Report. The Update includes IC Insights’ latest outlooks on the smartphone, automotive, PC/tablet and Internet of Things (IoT) markets. The $93.9 billion top-line... Read More
TMR angle sensor in a TO-6 package for PCB-less applications
TDK Corporation (TSE:6762) is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative... Read More
Audi connects the electric car with the house
Audi is taking the idea of electric mobility beyond the automobile in offering its customers a tailormade system offering. To that end, the brand is teaming up with two new... Read More
Intel Starts Testing Smallest ‘Spin Qubit’ Chip for Quantum Computing
Intel researchers are taking new steps toward quantum computers by testing a tiny new “spin qubit” chip. The new chip was created in Intel’s D1D Fab in Oregon using the... Read More
5G on a roll, cellular IoT deployments ramping up – Ericsson Mobility Report
Commercial rollouts of 5G and larger than previously forecasted deployments of cellular IoT are focal points in the latest edition of the Ericsson (NASDAQ: ERIC) Mobility Report. The forecast for... Read More
Nokia’s new 5G design and deployment services deliver faster time to market and lower total cost
Nokia is launching new services to help operators prioritize their 5G investments and bring 5G-based services to market faster. Network slicing, cloudification and 5G New Radio technology pose different challenges... Read More
Imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas
Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, today announced at the International Microwave Symposium (IMS, Philadelphia, USA), the world’s first CMOS 140GHz radar-on-chip system with... Read More
BAE Systems to develop first-of-its-kind software for DARPA to model conflicts
The U.S. Defense Advanced Research Projects Agency (DARPA) is sponsoring BAE Systems to develop software that will aid military planners in understanding and addressing the complex dynamics that drive conflicts... Read More
3D Glass Solutions Releases Industry’s First Integrated Passive Devices PDK Specifically for NI AWR Software
EL SEGUNDO, Calif. – June 11, 2018 – 3D Glass Solutions (3DGS) announces the release of an industry-first, glass-based RF integrated passive devices (IPDs) process design kit (PDK) specifically for... Read More
























