Munich, Germany, and Shanghai, China – 2 August 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Alibaba Cloud Computing Company (Alibaba Cloud) have signed a memorandum of... Read More
Audi and Ericsson to pioneer 5G for automotive manufacturing
Ingolstadt/Stockholm, August 2, 2018 – Premium automobile manufacturer Audi, and 5G innovation leader, Ericsson (NASDAQ: ERIC) are announcing plans to pioneer the use of 5G technology for automotive production. At... Read More
Siemens strengthens its digital enterprise leadership with acquisition of mendix
Siemens to acquire mendix, a leader in low-code application development, for €0.6 billion Acquisition to accelerate adoption of MindSphere by ecosystem growth and 10x faster application development Closing of transaction... Read More
Intel to Collaborate with SiTime on MEMS Timing for 5G Modems
What’s New: Intel and SiTime Corporation*, a provider of MEMS timing solutions, have announced that they will work together on robust, tiny and low-power microelectromechanical (MEMS) timing solutions for Intel’s 5G... Read More
Play selects Ericsson to accelerate nationwide mobile network expansion in Poland
The expansion of Play’s network includes radio access network components as well as Operation Support System (OSS) components with Ericsson Network Manager. The agreement is effective immediately. The network expansion... Read More
The winning team tracks the secure transport of blood samples with a Würth Elektronik radio module
Würth Elektronik eiSos GmbH & Co. KG supported the winning team in the start-up competition “DX-Labtrack” at the Hackathon TECHFEST in Munich from June 14th to 17th, 2018. Based on... Read More
Samsung Begins Mass Producing Industry’s First 2nd-Generation 10nm-Class, 16Gb LPDDR4X Mobile DRAM
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer-class* (1y-nm), LPDDR4X (Low Power, Double Data Rate, 4X)... Read More
Analog Devices and B-Secur Collaborate on Biometric Authentication Technologies for the Automotive Industry
Analog Devices, Inc. (ADI) announced today a collaboration with B-Secur LTD to develop a complete biometric authentication solution for use in automotive vehicles. The combination of ADI’s leading signal conditioning... Read More
C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC
UltraSoC today announced that C-SKY Microsystems Co Ltd (“C-SKY”), a China-based semiconductor company acquired by the Alibaba Group in April, has licensed UltraSoC’s embedded analytics technology for use in C-SKY’s China-developed system-on-chip (SoC) products.... Read More
Hyperstone announces Shinden Hightex Corporation as Distribution Partner
To increase the company’s presence in Japan, German semiconductor company Hyperstone announced today that it has appointed Shinden Hightex Corporation as its new distributor for its NAND Flash controller products... Read More
























