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Latest News

Infineon marks innovation milestone with world’s first300-millimeter power silicon carbide (SiC) wafer
Inova and Lattice Demonstrate Same-Cycle Distributed Motor Control for a Humanoid Hand with DLR Powered by Lattice FPGAs
Phinergy Completes Acceptance Tests for 72 kW Backup-Power Module, Opens Data Centre Demonstration Site
Marvell Signs $115 Billion Enterprise-Value Deal to Acquire Lumentum
Tower Semiconductor Reports Record $526 Million Third-Quarter Revenue
Bites Raises $40M Series A to Turn Frontline Training into a Business Performance Engine
Siemens introduces next generation of Sinamics G drives
Samtec to Exhibit Defense, Aerospace, and Robotics Solutions at electronica 2026
Unconventional AI to Acquire NeuReality, Accelerating Its Path to 1,000x AI Compute Efficiency
DigiKey Accelerates Access to TDK SensEI’s edgeRX Starter Solution for Industrial AI and Predictive Maintenance

Hyperstone appoints a new Vice President of Sales for the Americas

January 24, 2019 Comments Off

Today, the microcontroller company Hyperstone announces the addition of John Carey to strengthen the American team as Vice President of Sales. Working out of Hyperstones west coast office, Carey will... Read More

Boeing Autonomous Passenger Air Vehicle Completes First Flight

January 23, 2019 Comments Off

Boeing NeXt program tests prototype to advance safety and technology of urban air mobility Electric vertical takeoff and landing vehicle has design range of up to 50 miles The PAV... Read More

Toshiba Memory Europe Unveils Industry’s First UFS Ver. 3.0 Embedded Flash Memory Devices

January 23, 2019 Comments Off

Toshiba Memory Europe GmbH (TME) has started sampling the 128GB[1] version of the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilizes the... Read More

Hailo expands Series A round to $21M and launches Hailo-8™ Fast Track program for select customers

January 22, 2019 Comments Off

Israeli startup Hailo, developers of a proprietary processing architecture for deep learning on edge devices, has expanded its Series A funding round to $21 million. Chinese venture capital firm, Glory... Read More

TowerJazz and Ranix announce a partnership to develop RF transceivers to be used in V2X and ETCS Systems for the Automotive Market

January 22, 2019 Comments Off

TowerJazz, the global specialty foundry leader, and Ranix, a total solution provider for automotive communication and IoT security, today announced the development of RF transceivers for V2X (Vehicle-to-everything) and ETCS... Read More

Rohde & Schwarz strengthens its monitoring and IP contribution business fields by integrating GMIT GmbH

www.rohde-schwarz.com January 22, 2019 Comments Off

In 2010, Rohde & Schwarz expanded its product line by adding software based, cloud-enabled solutions from GMIT GmbH. The next logical step has now been taken – to fully integrate... Read More

Global GDP Growth Increasingly Important Driver of IC Market Growth

http://www.icinsights.com January 22, 2019 Comments Off

IC Insights is in the process of completing its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published... Read More

Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-screen Display Smartphones

news.samsung.com January 22, 2019 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. While being the industry’s most compact image sensor at 1/3.4... Read More

Rheinmetall and BAE Systems to create a UK based Land Systems Joint Venture

www.baesystems.com January 22, 2019 Comments Off

The new Joint Venture will be headquartered at BAE Systems’ facility in Telford, England and will sustain over 400 jobs in the UK, as well as preserve key technology and... Read More

Analog Devices’ Katsu Nakamura Named IEEE Fellow

January 22, 2019 Comments Off

Analog Devices, Inc., (ADI) Technology Fellow Dr. Katsu Nakamura has been named an IEEE Fellow. He is being recognized as a leader in the development of integrated circuits for digital... Read More

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Hyperstone appoints a new Vice President of Sales for the Americas

Boeing Autonomous Passenger Air Vehicle Completes First Flight

Toshiba Memory Europe Unveils Industry’s First UFS Ver. 3.0 Embedded Flash Memory Devices

Hailo expands Series A round to $21M and launches Hailo-8™ Fast Track program for select customers

TowerJazz and Ranix announce a partnership to develop RF transceivers to be used in V2X and ETCS Systems for the Automotive Market

Rohde & Schwarz strengthens its monitoring and IP contribution business fields by integrating GMIT GmbH

Global GDP Growth Increasingly Important Driver of IC Market Growth

Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-screen Display Smartphones

Rheinmetall and BAE Systems to create a UK based Land Systems Joint Venture

Analog Devices’ Katsu Nakamura Named IEEE Fellow

Flying electric vessel maker Candela raises €30M amid soaring oil prices

Sports-Tech Startup Marquee Raises $1.2 Million to Help Clubs Avoid Billions Lost on Failed Player Transfers

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 10, Kicking off in Mexico City

BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.

BMW Exploro bikes: new special edition combines innovative technology with progressive design.

Artificial intelligence and big data can help preserve wildlife

Sweat-proof “smart skin” takes reliable vitals, even during workouts and spicy meals

Flying electric vessel maker Candela raises €30M amid soaring oil prices

Sports-Tech Startup Marquee Raises $1.2 Million to Help Clubs Avoid Billions Lost on Failed Player Transfers

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 10, Kicking off in Mexico City

BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.

BMW Exploro bikes: new special edition combines innovative technology with progressive design.

Infineon marks innovation milestone with world’s first300-millimeter power silicon carbide (SiC) wafer

Microsemi Introduces XMC Form Factor SATA SSD for Industrial and Defense Applications

Mouser Electronics’ Robotics Innovation Video Wins Telly Award

Mouser-Sponsored Rebellion Racing Team Looks to Collect a Win at Famed Nürburgring

New Honeywell proximity sensors are rugged and reliable in extreme environments – now from TTI, Inc.