January 15, 2019Comments Off on Ericsson and Qualcomm complete 5G data call on 2.6 GHz band
The bi-directional downlink and uplink data call was made at the Ericsson Lab in Kista, Sweden last December 20. It brings a new sub-6 frequency band one step closer to... Read More
January 15, 2019Comments Off on Falk Herrmann appointed new CEO of Rohde & Schwarz Cybersecurity
At the start of 2019, Dr. Falk Herrmann was appointed the new CEO of Rohde & Schwarz Cybersecurity GmbH. The mechanical engineer gained extensive international management experience during his 20-year career with the... Read More
January 15, 2019Comments Off on Samsung and KDDI Demonstrate Real Time 4K Video Communication Powered by 5G at a Japanese Train Station
Samsung Electronics and KDDI today announced that they have successfully completed a 5G test with real time transmission of 4K ultra-high-definition (UHD) surveillance video on a train platform, the first... Read More
January 15, 2019Comments Off on CPI Supports Project to Improve Industrial Productivity
The two-year Models for the Manufacturing of Particulate Process (Models MPP) project focused on establishing a generic framework and core capability to improve industrial productivity. As part of the drive... Read More
January 10, 2019Comments Off on T-Mobile, Ericsson and Intel successfully complete first 5G call on 600 MHz
The first 5G data video call over 600 MHz included successful uplink and downlink communication and was carried out on a live commercial network. During the tests, Ericsson, Intel and... Read More
January 10, 2019Comments Off on Qualcomm Chipsets and RF Front End Power More than 30 Commercial 5G Mobile Devices Scheduled to Launch in 2019
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced strong 5G device momentum with more than 30 5G design-wins, the majority of which are smartphones, from global... Read More
January 10, 2019Comments Off on 2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration
Today at CES 2019 in Las Vegas, Intel unveiled the next wave of PC innovation that will advance the PC experience to help power every person’s greatest contribution, including: Details... Read More
January 10, 2019Comments Off on Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement
Cree, Inc. (Nasdaq: CREE) announces that it signed a multi-year agreement to produce and supply its Wolfspeed® silicon carbide (SiC) wafers to STMicroelectronics (NYSE: STM), a global semiconductor leader serving... Read More
January 9, 2019Comments Off on Hyundai Motor Group and WayRay Unveil Next-generation Visual Technology at CES 2019
The Next-generation Visual Technology provides drivers with navigational and ADAS features to enhance their in-car experiences HMG aims to secure leadership in the holographic AR display industry that is expecting... Read More
January 8, 2019Comments Off on ams introduces world’s smallest 1D time-of-flight sensor for accurate proximity sensing and distance measurement in smartphones
Premstaetten, Austria (08 January, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, introduces the world’s smallest integrated 1D time-of-flight distance measurement and proximity sensing... Read More
July 16, 2023Comments Off on BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.