BMW Group partnership for future mobility: Joining hands with Tencent to build BMW Group China High Performance D³ platform.

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BMW Group partnership for future mobility: Joining hands with Tencent to build BMW Group China High Performance D³ platform. Beijing. BMW China Automotive Trading Ltd. and Tencent signed an agreement... Read More

Maxim’s Healthcare Sensors Enable Ultra-Small Size, Lowest Power and Clinical-Grade Accuracy for Next-Generation Wearables

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Designers creating next-generation wearable health and fitness applications can reduce temperature measurement power by 50 percent with the MAX30208, as well as shrink optical solution size by 40 percent with... Read More

UnitedSiC adds 2 new 650V SiC FET packages to UF3C FAST Series

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UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has added two new TO220-3L package options to its growing range of hard-switching UF3C FAST series of 650V SiC FETs. The... Read More

Trackwise Publishes Comprehensive Resource to Support FPC Design

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UK-based Trackwise, an innovative manufacturer of limitless-length, multilayer flexible printed circuits, has just published ‘The engineers’ guide to multilayer flexible printed circuits (FPCs): technologies and applications’. This comprehensive white paper... Read More

u-blox and Arvento announce launch of new vehicle tracking system

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u-blox (SIX:UBXN), a leading provider of positioning and wireless communication technologies and Arvento Mobile Systems, a global pioneer in vehicle telematics and fleet management technology, announce the imminent launch of... Read More

Intel and SAP Broaden Their Technology Partnership to Power Enterprises’ Digital Transformation

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What’s New: Intel and SAP* today announced a multiyear technology partnership focused on optimizing Intel’s platforms, including Intel® Xeon™ Scalable processors and Intel® Optane™ DC persistent memory, for SAP’s end-to-end enterprise... Read More