RFHIC today launched DiaFlux™, a family of thermal-grade polycrystalline CVD diamond heat spreaders for high-power RF, microwave, optoelectronic, and semiconductor packaging applications. The DiaFlux™ product pages, including full specifications for both grades, are now live on RFHIC’s website. [https://rfhic.com/products-diamond-materials/]
Modern high-power designs concentrate ever-greater heat flux beneath small, high-power die. When conventional heat-spreader materials become the bottleneck, the design’s thermal ceiling caps output power, density, and performance. DiaFlux™ brings the highest-thermal-conductivity material class in engineering practice directly to the point of heat generation — in the sizes, thicknesses, and tolerances real packages need.
The family launches with two grades sharing one form-factor system:
- DiaFlux™ 150 — Standard Thermal Grade: 1,500 W/m·K at 25 °C, for the broad range of high-power applications where conventional spreaders limit the design
- DiaFlux™ 180 — High Performance Thermal Grade: 1,800 W/m·K at 25 °C, for the most thermally demanding designs
Key specifications (both grades):
- Polycrystalline CVD diamond, grown by plasma-assisted chemical vapor deposition; electrically insulating
- Thicknesses: 200, 350, and 500 µm, held to ±20 µm
- Round formats Ø3–100 mm; square formats 3 × 3 mm to 70 × 70 mm; custom geometries available
- Laser-cut edges with feature sizes below 0.2 mm; lateral tolerance ±0.2 mm
- Surface roughness Ra <20 nm
- Supplied as plates, chips, heat spreaders, and wafers
Because both grades share identical form factors, thickness, tolerances, and surface finish, grade selection is purely a thermal-performance decision — switching grades does not change the mechanical design.
Getting started
Engineers evaluating a thermal design can request a technical consultation with RFHIC’s application engineering team through the DiaFlux™ product pages. To learn more, please contact us.
