January 10, 2017Comments Off on New Arduino-Compatible Sensor Evaluation Kit
Multiple onboard sensors make it easy to build a sensor environment for prototyping and initial set development Willich-Münchheide, January 5th 2017 – ROHM has recently announced the availability of the... Read More
January 10, 2017Comments Off on Infineon enables compact and cost-effective LED front light applications with LITIX™ LED driver family
Munich, Germany – January 10, 2017 – LEDs in automotive front lighting enable energy savings, new light designs and applications such as matrix beam and laser high-beam. Supporting the progress... Read More
January 9, 2017Comments Off on ADL Embedded Solutions Inc. Announces New 75mm x 75mm Intel E3800-series Edge-Connect SBC – ADLE3800SEC
ADL Embedded Solutions Inc., a leading provider of high-performance embedded solutions, has announced today its compact ADLE3800SEC SBC with Edge-Connect. This ultra-compact 75mm x 75mm form factor is a full-featured,... Read More
https://www.renesas.com/January 8, 2017Comments Off on Renesas Electronics Unveils Automotive Radar Solution to Bolster ADAS and Autonomous Driving Vehicles
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its first RH850-based, 32-bit, automotive radar microcontroller (MCU) series, the RH850/V1R, that will deliver the high... Read More
January 6, 2017Comments Off on Harwin increases design choices and production flexibility with extensions to 1.27mm, 2mm and 2.54mm pitch connector ranges
Harwin has extended the number of models available in its highly successful Industry Standard Connector ranges, including Harwin’s Archer M50 (1.27mm pitch), M22 (2mm pitch) and M20 (2.54mm pitch) interconnects. ... Read More
January 5, 2017Comments Off on COM modules with 7th generation Intel Core processors
The new Kaby Lake processors are manufactured in 14 nm technology, as the former 6th generation Intel® Core™ processors, and have a similar architecture but are optimised for higher performance... Read More
January 5, 2017Comments Off on CSEM ANNOUNCES BLUETOOTH 5-READY SILICON RF IP
2017 will witness the arrival on the market of the first Bluetooth 5 products which, with twice the datarate and four times the range of Bluetooth 4.2, will accelerate the... Read More
https://www.st.com/content/January 5, 2017Comments Off on STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services
STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, has boosted performance and security in its latest Telemaco processors tailored to support richer... Read More
https://www.qorvo.com/January 5, 2017Comments Off on Qorvo® Introduces Multi-Protocol System on Chip for Smarter, More Secure Homes
Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today introduced a complete system on chip (SoC) for smart home devices that delivers multi-protocol support with... Read More
https://media.nxp.com/January 4, 2017Comments Off on NXP Presents the World’s First One-Chip Solution for All Global In-Car Infotainment and Broadcast Standards
Software-defined, multi-standard device for global digital and analog broadcast standards AM/FM, DAB(+), DRM(+) and HD Ultra-compact single chip integrating six ICs into one: radio and audio as one combined high-performance... Read More