TE Connectivity’s Intercontec M12 Motor Connectors Provide All-in-One Connectivity for Power, Signal and Data Fast locking system with rotatable angled receptacles for quick and flexible mounting

Comments Off on TE Connectivity’s Intercontec M12 Motor Connectors Provide All-in-One Connectivity for Power, Signal and Data Fast locking system with rotatable angled receptacles for quick and flexible mounting

Maisach-Gernlinden, 24 May 2022 – TTI, Inc., a leading specialty distributor of electronic components, is now stocking the Intercontec M12 one cable technology (OTC) motor connectors from TE Connectivity. The... Read More

Infineon introduces the highly-integrated and scalable wireless charging platform WLC with Qi-compliant and configurable controllers

Comments Off on Infineon introduces the highly-integrated and scalable wireless charging platform WLC with Qi-compliant and configurable controllers

Munich, Germany, and Taipei, Taiwan – 24 May, 2022 – The wireless charging market has been increasingly growing over the last years, with more and more applications applying this capability... Read More

LEM to unveil the world’s first Integrated Current Sensor with Sigma Delta bitstream output at PCIM Europe 2022

New-Tech Magazines Group Ltd. Comments Off on LEM to unveil the world’s first Integrated Current Sensor with Sigma Delta bitstream output at PCIM Europe 2022

Key points: New HMSR DA provides significant performance improvement on noise, distortion and interference Applications include standalone servo drives, robotics, sewing machines, automated guided vehicles and CNC machine tools The... Read More

PIC® and AVR® Microcontrollers Anchor the Majority of Embedded Designs Today

New-Tech Magazines Group Ltd. Comments Off on PIC® and AVR® Microcontrollers Anchor the Majority of Embedded Designs Today

With smartphones, autonomous vehicles, and 5G wireless connectivity dominating the landscape of embedded design in 2022, Microchip’s 8-bit PIC® and AVR® microcontroller (MCU) families are gaining market share. Over the... Read More

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

New-Tech Magazines Group Ltd. Comments Off on Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks

Nexperia, the expert in essential semiconductors, today announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These... Read More

Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments

New-Tech Magazines Group Ltd. Comments Off on Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments

Infineon Technologies LLC, part of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), today announced the availability of the space industry’s first radiation-hardened (rad hard), serial interface Ferroelectric RAM (F-RAM)... Read More