February 5, 2016Comments Off on Epson Develops LabelWorks LW-Z900/LW-PX900 to Meet Industrial Label Printing Needs
Whether photographs printed at home, documents printed at the office, posters printed for commercial use, or textiles with printed patterns, prints are all around us. A tremendous number of labels... Read More
February 5, 2016Comments Off on L-3 Cincinnati Electronics Selects Cypress to Manufacture Readout Integrated Circuits for Thermal Imaging Applications
Cypress Foundry Solutions Chosen for High-Yield SONOS Process Technology Expertise in “Stitching” Oversized Dice from Wafers SAN JOSE, Calif. and MASON, Ohio, January 22, 2014 – Cypress Semiconductor Corp. (NASDAQ: CY)... Read More
February 4, 2016Comments Off on Toshiba Develops a Wide-Input-Voltage-Range High-Efficiency Switched-Capacitor DC-DC Converter for Wireless IC
TOKYO—Toshiba Corporation (TOKYO: 6502) today announced the development of an on-chip switched-capacitor DC-DC converter for wireless ICs that offers up to 95.8% efficiency with a 0.85-to-3.6V wide input voltage range,... Read More
By Pieter Willems, CMOSISFebruary 3, 2016Comments Off on CMOS Sensors Boost High-End Medical, Industrial and Consumer Imaging
Image capture of real-world scenes and blending this with virtual information represented as visual patterns is a vital tool in a growing number of industrial, medical and consumer applications. This... Read More
February 3, 2016Comments Off on Hitachi Developed Prototype of Low Power Transceiver to Achieve High Speed Data Transmission in Low Signal Integrity
Achieving 25Gb/s data transmission at 50dB transmission loss, and to enable the connection of information equipment with 10m copper cable Tokyo, February 3, 2016 — Hitachi, Ltd. (TSE: 6501) has... Read More
February 3, 2016Comments Off on New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time
Physically aware 2D Elastic Compression architecture reduces test logic wirelength by up to 2.6X and enables compression ratios to scale beyond 400X without impacting design size Cadence Design Systems, Inc.... Read More
February 2, 2016Comments Off on Samsung Launches New LED Module Lineup, inFlux, for High-Flux Industrial Lighting
Samsung Electronics, a world leader in advanced components, introduced inFlux, a new lineup of high-flux (extremely bright), linear LED modules optimized for industrial lighting applications such as plants, parking lots... Read More
February 1, 2016Comments Off on New Power Monitoring IC From Microchip Provides Highly Accurate Real-Time Power Monitoring of Multiple Loads
Highly Integrated Advanced Features Facilitate System Design and Reduce System Cost of Industrial, Commercial and Consumer Power-Hungry Applications. CHANDLER, Ariz., Feb 1, 2016 — Microchip Technology Inc. (NASDAQ: MCHP), a leading... Read More
February 1, 2016Comments Off on TI drives high-voltage batteries with industry’s first 100-V high-side FET driver
Unprecedented flexibility and power protection for advanced industrial battery applications DALLAS (Feb. 1, 2016) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the first single-chip 100-V high-side FET driver for high-power... Read More
February 1, 2016Comments Off on Now at Mouser: TE Connectivity’s Fortis Zd LRM Connectors Combine Performance and Rugged Modular Design
Mouser Electronics, Inc. is now stocking the Fortis Zd LRM connector system from TE Connectivity (TE), a world leader in connectivity. This innovative modular connector system, designed for next-generation packaging... Read More