October 31, 2017Comments Off on 2” x 4” Open Frame Ac-Dc Power Supplies Offer High Densities up to 30 W/in3
CUI’s Power Group today announced the continued expansion of its portfolio of high density open frame ac-dc power supplies with the introduction of two new series. The VOF‑180 and VOF‑225A... Read More
October 31, 2017Comments Off on ams launches NFC Sensor Interface for Industrial IoT
Premstaetten, Austria (31 October, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today released the AS3956, a dynamic NFC tag IC which meets industrial-grade... Read More
October 30, 2017Comments Off on USB Smart Hub ICs Enable Smartphone-Connected Automotive Infotainment
New Devices from Microchip Provide Unparalleled Flexibility to Fit Customers’ Designs CHANDLER, Ariz., Oct. 23, 2017 — With the rise in in-vehicle infotainment systems, car manufacturers need to provide a... Read More
October 27, 2017Comments Off on Würth Elektronik eiSos Supplies Wireless Power Coil for Semtech’s LinkCharge® LP Multi-Device Wireless Charging Solution
Waldenburg (Germany), 27 October 2017 – Würth Elektronik eiSos, a manufacturer of electronic and electromechanical components, announced its collaboration with Semtech Corporation (Nasdaq: SMTC) by integrating its transmission coil, WE-WPCC,... Read More
October 27, 2017Comments Off on New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with BSI Pixel Technology to Satisfy Challenging Security and Surveillance Applications
PHOENIX, Ariz. – 26 October, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel... Read More
October 26, 2017Comments Off on HEITEC Emphasizes Industry Expertise Top-of-the-range chassis systems
HEITEC offers customers a comprehensive chassis technology portfolio. In addition to components for complete 19” packaging systems, the product range includes instrument cases and system enclosures as well as an... Read More
October 26, 2017Comments Off on congatec virtualizes robust COM Express Type 7 Server-on-Module
congatec presents virtualized fog server installation congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – will be presenting its... Read More
October 26, 2017Comments Off on NXP Introduces Industry’s First Automotive-Qualified Bluetooth 5-Ready Wireless Microcontrollers with integrated CAN-FD
SANTA CLARA, California, (ARM TECHCON 2017) – October 24, 2017 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its Kinetis KW35/36 MCU family, the industry’s first automotive-qualified Bluetooth 5-ready wireless... Read More
October 26, 2017Comments Off on Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10 FPGA
Intel today announced it has begun shipping its Intel® Stratix® 10 SX FPGA – the only high-end FPGA family with an integrated quad-core ARM* Cortex*-A53 processor. With densities greater than... Read More
October 26, 2017Comments Off on ON Semiconductor Introduces World’s First Highly Scalable Family of Next-Generation Automotive Image Sensors
PHOENIX, Ariz. – Oct. 25, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations and the market leader in automotive imaging, today announced a CMOS image sensor platform that... Read More