www.rohde-schwarz.comMarch 1, 2018Comments Off on Rohde & Schwarz to present world’s first signaling test solution for Bluetooth® LE
Bluetooth Low Energy (LE) has emerged as a major transmission technology for the Internet of Things (IoT). Bluetooth LE components are found in a variety of applications in the automotive... Read More
March 1, 2018Comments Off on Small and secure RF modules for embedded applications
Acknowledged as the UK’s leading source of advanced embedded technology, Solid State Supplies Ltd. now offers the XBee3™ embedded RF modules from Digi. The modules ease the design task with... Read More
February 28, 2018Comments Off on Teledyne e2v unveils its next ultra-compact advanced computing module to join its Qormino® family
Teledyne e2v has revealed the QLS1046-4GB, an ultra-compact computing module combining the NXP LS1046 Arm® based processor with 4GB DDR4 memory on a custom substrate. 27th February 2018, Grenoble, France... Read More
February 28, 2018Comments Off on ON Semiconductor’s SiC Diodes Offer Higher Efficiency, Power Density and Lower System Costs
50 V silicon carbide Schottky diodes feature superior switching performance and higher reliability APEC 2018 – Booth #601 – SAN ANTONIO, TX – February 28, 2018 – ON Semiconductor (Nasdaq:... Read More
February 28, 2018Comments Off on Intel Introduces ‘Intel AI: In Production’ Program – a New Way to Bring Artificial Intelligence Devices to Market
Intel today unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial intelligence prototypes to market. Since its introduction last July, the... Read More
February 27, 2018Comments Off on Single-Chip Custom Solutions for the IoT Edge
S3 Semiconductors, announced today the introduction of its SmartEdge™ Platform, giving its customers access to cost-optimized, custom single-chip solutions that put performance right at the edge of the IoT. Processing... Read More
February 27, 2018Comments Off on SMARC module for Industrial Ethernet
eCOUNT embedded presents the ES-1XXX, its first Computer-on-Module family to support the SMARC 2.0 standard from the SGET. The modules are equipped with ARM Cortex-A9 based Intel® Cyclone® V SoCs... Read More
February 27, 2018Comments Off on Toshiba Announces New 2TB Hard Disk Drive for Client Storage Applications
Toshiba Electronics Europe GmbH announces the launch of its new MQ04 Series 2TB[1] HDD model MQ04ABD200, designed for use in notebook PCs, all-in-one and slim-line desktop systems, and other applications requiring high... Read More
February 27, 2018Comments Off on Digital Control Meets Intelligent Analog to Streamline Design
CHANDLER, Ariz., Feb. 27, 2018 — Whether it’s used as an initial introduction into embedded development, the main controller of a connected application or as an attach component to offload... Read More
www.rohde-schwarz.comFebruary 27, 2018Comments Off on Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT
Rohde & Schwarz and CommSolid have successfully completed the verification of 3GPP Release 14 location services (LCS), which is one of the new positioning technologies for NarrowBand-IoT (NB-IoT). The Cat-NB2 verification... Read More