November 5, 2018Comments Off on Intel Shows Breadth of Data-Centric Platform with Cascade Lake Advanced Performance and Xeon E-2100
What’s New: Intel today announced two new members of its Intel® Xeon® processor portfolio: Cascade Lake advanced performance (expected to be released the first half of 2019) and the Intel Xeon... Read More
November 5, 2018Comments Off on Analog Devices’ Transceivers Bring High-Def Video via Existing Vehicle Cable and Connector Infrastructure
Analog Devices, Inc. today announced a transceiver series that enables high-definition (HD) video over existing Unshielded Twisted Pair cables and unshielded connectors. This allow OEMs to upgrade easily from standard-definition cameras to HD... Read More
November 5, 2018Comments Off on u-blox’s first multi-band GNSS timing receiver meets 5G’s stringent accuracy requirements
u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the ZED-F9T high accuracy timing module. This module meets even the most stringent timing synchronization requirements... Read More
https://www.onsemi.comNovember 1, 2018Comments Off on 50 Megapixel CCD Image Sensor from ON Semiconductor Targets Inspection of Smartphone Displays
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image... Read More
www.teledyne-e2v.comNovember 1, 2018Comments Off on Teledyne e2v announces new 5Mpixel CMOS image sensor for high-speed scanning and embedded vision solutions
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the expansion of its Snappy family of image sensors with a new 5 Megapixel device.... Read More
news.samsung.comOctober 31, 2018Comments Off on Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new 0.8-micrometer (μm) pixel image sensors – the 48-megapixel (Mp) Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL... Read More
October 31, 2018Comments Off on ON Semiconductor Introduces Mesh Networking and New Development Support for Industry-Leading RSL10 Bluetooth® 5 Radio Family
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has extended the capabilities of its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with support for the Bluetooth SIG mesh... Read More
October 31, 2018Comments Off on Toshiba announces Bluetooth® 5 IC for automotive applications
Toshiba Electronics Europe (“Toshiba”) has announced a new Bluetooth® IC for automotive applications will be added to their IC line-up. The TC35681IFTG is based on an arm® Cortex®-M0 CPU and... Read More
www.rohde-schwarz.comOctober 31, 2018Comments Off on INDO DEFENCE 2018: Rohde & Schwarz presents innovative portfolio of communications and intelligence systems
In Jakarta, Rohde & Schwarz will present itself as a single-source supplier of integrated solutions for secure communications and radio intelligence. Interoperable, powerful communications systems for deployment on land, in the air... Read More
www.st.comOctober 31, 2018Comments Off on New Connected-Car Automotive MCU from STMicroelectronics Enables Secure Remote Updates and High-Speed In-Vehicle Networking
STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, is making connected cars safer, more flexible, and future-proof with its latest high-performance, multi-core, multi-interface... Read More