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Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

https://news.samsung.com October 10, 2019 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one... Read More

Digi-Key Electronics Launches Partnership with Analog Devices on Innovative MeasureWare Platform

New-Tech Europe Magazine October 10, 2019 Comments Off

THIEF RIVER FALLS, Minnesota, USA – Digi-Key Electronics, the global electronic components distributor, announced today a partnership with Analog Devices on their innovative new MeasureWare platform. The multi-sensor platform will... Read More

CML removes barriers to wider use of AIS, increasing maritime safety for more sea vessels

New-Tech Europe Magazine October 10, 2019 Comments Off

Maldon, Essex – 9 October 2019 – CML Microcircuits is pleased to introduce the SCT7033, the industry’s first AIS Class B processor to include the full protocol stack already embedded... Read More

Vicor introduces a new lower-power DCM2322 family of isolated, regulated DC-DC modules

October 10, 2019 Comments Off

Power density, low weight and ease-of-use are critical considerations when designing isolated, regulated DC-DC converter systems for a broad range of robotics, UAV, rail, communications and defense/aerospace applications. The new... Read More

Rohde & Schwarz and MESIT jointly invest in secure communications solutions and form DICOM

www.rohde-schwarz.com October 7, 2019 Comments Off

Rohde & Schwarz and MESIT have established a new joint venture (JV) with MESIT as the majority shareholder. The strategic purpose is to further enhance the trusted, interoperable SOVERON communications system. SOVERON stands... Read More

Rohde & Schwarz announces first IEEE 802.3cg 10BASE-T1S compliance test solution for the automotive industry

October 3, 2019 Comments Off

he flexibility of Automotive Ethernet makes the simple twisted-pair network technology ideal for an ever-increasing range of in-vehicle networks. The new IEEE 10BASE-T1S standard expands the range of applications supported... Read More

Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor

October 2, 2019 Comments Off

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced the industry’s first 0.7-micrometer (μm)-pixel image sensor, the 43.7-megapixel (Mp) Samsung ISOCELL Slim GH1. Thanks to advanced ISOELL Plus... Read More

Microchip Simplifies Hardware-Based IoT Security with the Industry’s First Pre-Provisioned Solutions for Deployments of Any Size

October 2, 2019 Comments Off

With a minimum orderable quantity of 10 units, Microchip’s Trust Platform provides hardware-based secure key storage for low-, mid- and high-volume deployments As the number and types of connected devices... Read More

Maxim Power Management Solution Sets Industry’s Standard with Highest Efficiency of 96% and Lowest Quiescent Current of 6µA to Boost Runtime of Portable Devices

October 2, 2019 Comments Off

MUNICH, Germany – October 2, 2019 – With the lowest quiescent current (IQ) in its class of 6µA, as well as the highest peak efficiency of 96 percent in the... Read More

Renesas Electronics and StradVision Collaborate on Smart Camera Development for Next-Generation ADAS

October 2, 2019 Comments Off

Delivering Smart Camera Solutions That Employ Deep Learning for Object Recognition with High Precision and Low Power Consumption Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and... Read More

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