LAKE OSWEGO, Ore. — August 31, 2021 — CUI Devices’ Thermal Management Group today announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks. Compatible... Read More
Latest News
- Shifters Raises $10.2 Million Seed Round Led by Ace Capital Partners to Advance AI-Native Ground Robotics
- Quantum Machines Reaches a Novera QPU Performance Milestone with Its OPX1000 Platform
- Unframe Announces $50M In Additional Funding and Crosses $100M in Total Contract Value in Twelve Months, Becoming One of the Fastest-Scaling Enterprise AI Companies on Record
- UVeye Wins Newsweek AI Impact Award for AI Mobility
- Priority Software Unveils Priority’s AI First ERP Powered by an Embedded aiERP Companion and Specialized AI Agents
- Sweet Security Launches Sweet Attack to Debunk The Myth Before Mythos Ships
- New Semperis Study Reveals AI’s Effects on the Identity Attack Surface
- Akamai Technologies Announces Intent to Acquire LayerX, Advancing Its Workforce Security Strategy with AI Usage Control
- Appcharge ships MCP server – the first piece of its AI-native DTC platform
- New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
