November 30, 2017Comments Off on New SECORA™ Pay brand: one-stop-offering for fast and easy production of payment cards and smart wearables
Munich, Germany and Cannes, France – 29 November 2017 – EMV®-compliant payment solutions face growing demand worldwide – with a clear path towards contactless and multifunctional use to increase user... Read More
November 29, 2017Comments Off on Samsung Starts Mass Production of its 2nd Generation 10nm FinFET Process Technology
New S3 line is now ready for ramp-up to meet the 10nm demand Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its Foundry Business has commenced... Read More
November 29, 2017Comments Off on Emmanuel Sabonnadiere Named Leti CEO
Leti, a technology research institute of CEA Tech, today announced that Emmanuel Sabonnadiere has been named CEO, succeeding Marie-Noelle Semeria. Sabonnadiere, who has more than 25 years of executive leadership... Read More
November 29, 2017Comments Off on Airbus, Rolls-Royce, and Siemens team up for electric future
Airbus, Rolls-Royce, and Siemens have formed a partnership which aims at developing a near-term flight demonstrator which will be a significant step forward in hybrid-electric propulsion for commercial aircraft. The... Read More
November 29, 2017Comments Off on Optimized and cost-efficient design implementation using AT&S X-in-Board technology
Leoben, November 29, 2017 – In addition to its comprehensive portfolio of standard printed circuit board (PCB) technologies, AT&S also has various special processes, materials and technologies that are optimized... Read More
November 29, 2017Comments Off on SONY® Semiconductor Solutions launches its 3rd Generation Image Sensors, IMX421 and IMX422, for High-Speed Automation
SONY® Semiconductor Solutions features its high-performance 3rd generation CMOS Global Shutter with the brand-new IMX421 and IMX422 image sensors. Both of these two high-speed sensors for Machine Vision and Factory... Read More
November 28, 2017Comments Off on Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source
Munich, Germany – 27 November 2017 – The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant... Read More
www.press.bmwgroup.comNovember 26, 2017Comments Off on BMW Group invests 200 million euros in Battery Cell Competence Centre
Focus on technological expertise in battery-cell development and production Fifth-generation electric drivetrain integrates electric motor, transmission and power electronics in a single component Rare-earth-free electric motor ensures resource independence The... Read More
news.samsung.comNovember 26, 2017Comments Off on Samsung Wins Home Office Contract to Supply Upgrade Emergency Services Network
Samsung Electronics announced today that the company has been awarded a contract for the supply of smartphones and related accessories by the Home Office for use on the emergency services... Read More
July 16, 2023Comments Off on BMW announces new long-term partnership with the Städel Museum. Artist Marc Brandenburg has created an exclusive design for a BMW iX1.