, Driving Performance on land and on water: Stronger and lighter: the eleventh boat from Mercedes-AMG and Cigarette Racing sets new benchmarks through extensive use of carbon-fibre
, Driving Performance on land and on water: Stronger and lighter: the eleventh boat from Mercedes-AMG and Cigarette Racing sets new benchmarks through extensive use of carbon-fibre

Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source

Munich, Germany – 27 November 2017 – The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay (Inlam).

Conventional chip packages are welded, soldered or glued to the card antenna. With the CoM package, however, the chip module communicates with the card antenna by radio frequency (RF). The complex mechanical design is no longer necessary, the card itself becomes more robust and production costs are reduced.

CoM packages are already used for numerous payment and eID cards, which function both contact-based and contactless (dual interface). Yet, CoM technology also offers significant advantages for purely contactless eID cards and passports:

  • Flexible card layout with world’s thinnest module, measuring only 125µm for improved card design and less rigid passports
  • Improved robustness for documents with ten years validity thanks to elimination of weak points through electro mechanical card antenna connection
  • One-stop-shopping shortens and simplifies the supply

New chip generation for consumer-friendly contactless cards

Transactions with contactless cards are typically much faster than with contact-based cards that must be inserted into the reader. Multi-application, in turn, combines several applications in a single card and allows new business models. Multifunctional eIDs and sovereign ID documents are for example in high demand in areas with relatively poor banking infrastructure in Africa and Latin America: thus, citizens there can also use their ID card for financial transactions.

However, multi-application cards require more storage capacity and special security structures when it comes to the chip solution. Infineon’s SLC52 security chip is particularly powerful and versatile with up to 700 KB of memory, Integrity Guard and an advanced chip architecture. It thus forms the solid foundation of the new and complete contactless card solution. Further information is available at: www.infineon.com/CoM

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