Harwin Expands Breadth of Robust Surface Mount 3-Point PCB Socket Series

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High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact product offering. While this series was initially capable of accommodating 1mm and 1.5mm diameter contact pins, it now... Read More

NXP and Smart Columbus Continue to Partner on the Future of Smart Mobility

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NXP Semiconductors N.V.(NASDAQ:NXPI), has announced the next phase in its Smart City collaboration with Columbus, Ohio, the winner of the 2016 U.S. Department of Transportation’s $40 million Smart City Challenge. NXP will contribute key... Read More

Kerlink Partners with SPHINX to Bring Internet of Things Solutions to More Network Integrators & Resellers in Europe

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Thorigné-Fouillard and Montaigu, France – June 29, 2018, 8:00am. CET – Kerlink (ALKLK – FR0013156007), a specialist and global leader in solutions dedicated to the Internet of Things (IoT), and SPHINX ,which helps integrators, resellers and... Read More

Avnet Abacus honoured with Senten Manten Gold Award by TDK

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Outstanding sales performance, strong leadership, and technical excellence are highlighted in annual distribution awards Poing, Germany, 3rd July, 2018: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power... Read More

At ISC 2018, Intel Transforms the Future of High-Performance Computing

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What’s New: A new era of supercomputing offers unprecedented opportunities for scientific and industrial breakthroughs. The global competition among high-performance computing (HPC) systems heats up at the International Supercomputing Conference (ISC 2018) in... Read More