New Emerald 2M image sensor featuring MIPI interface Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the expansion of its Emerald family of... Read More
Sharing your own car via an app: Infineon and XAIN to collaborate on bringing blockchain into the car
Munich, Germany – 25 October 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and XAIN have agreed to work together on bringing blockchain technology into the car. The... Read More
UltraSoC and ResilTech partner to further functional safety in automotive systems
Improving the development of safe and secure ISO26262 and J3061 compliant systems UltraSoC and ResilTech today announced a collaboration that brings together their expertise and technologies to further the functional... Read More
Volocopter to Test its Electrical Vertical Take-Off and Landing (eVTOL) Air Taxis in Singapore
Bruchsal/Paris/Singapore, October 2018 – Volocopter, the pioneer in urban air mobility, announced today during Autonomy – the Summit of Urban Mobility in Paris, that they will perform a next set of inner... Read More
ON Semiconductor Announces Industry’s First CE Certification for Sigfox Verified RF System-in-Package Solution
All-in-one Sigfox SiP is optimized for LPWAN IoT applications without requiring additional components or certification Sigfox Connect – BERLIN, Germany – 23 October, 2018 – ON Semiconductor (Nasdaq: ON), driving... Read More
Arrow Electronics Showcases IoT, Start-up and Software Solutions at electronica
NEU-ISENBURG, Germany–Arrow Electronics’ presence at electronica 2018 underlines the company’s strategic direction as a technology solutions provider. Its presence will comprise three core pillars: an IoT zone and Arrow Software... Read More
Rohde & Schwarz presents its next generation T&M solutions for 5G, automotive and IoT at electronica 2018
From November 13 to 16, 2018, Rohde & Schwarz, one of the leading test and measurement equipment manufacturers, will present its innovations at electronica under the slogan “Accelerate design. Maximize... Read More
Qualcomm and Ericsson Successfully Make First 3GPP-compliant 5G NR Sub-6 GHz OTA Call with a Mobile Form Factor Device
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and Ericsson announced the successful completion of a 3GPP Rel-15 spec compliant 5G NR over-the-air (OTA) call over sub-6 GHz... Read More
DECT Remerges as Driving Technology for Magenta Smart Speaker HD Voice Calling Powered By DSP Group
Milpitas, Calif., 23 October 2018 – DSP Group®, Inc. (NASDAQ: DSPG), a leading global provider of wireless chipset solutions for converged communications, today announced that its DECT/ULE solution will power... Read More
Renesas and BlackBerry Deliver R-Car Based Development Environment Integrating Virtualization, Functional Safety, and Security
Companies Expand Partnership To Enable Leading-Edge Automotive Systems Düsseldorf, October 23, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions and BlackBerry Limited (NYSE: BB;... Read More
























