Osram enters the 3D sensing market with two new VCSELs

www.osram-group.com Comments Off on Osram enters the 3D sensing market with two new VCSELs

VCSELs combine the high power density and simple packaging of an IRED with the spectral width and speed of a laser. Unlike laser diodes, VCSELs and are much less sensitive... Read More

Carbon handprint: New environmental indicator for evaluating the positive climate impacts of products

www.vttresearch.com/media/news/carbon-handprint Comments Off on Carbon handprint: New environmental indicator for evaluating the positive climate impacts of products

VTT and LUT University alongside with Finnish companies have developed a method and guidelines for evaluating and communicating on the carbon handprint of products. The carbon handprint describes the positive... Read More

Qualcomm Introduces Next-Gen Cellular Chipset Purpose-Built for IoT

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Qualcomm Technologies, Inc. a subsidiary of Qualcomm Incorporated, today announced its next-generation modem purpose-built for Internet of Things (IoT) applications such as asset trackers, health monitors, security systems, smart city... Read More

DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019

https://www.icinsights.com Comments Off on DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019

DRAM fastest growing market in four of past six years, demonstrating very cyclical market. IC Insights is in the process of revising its forecast and analysis of the IC industry... Read More

Ericsson, SK Telecom and Qualcomm collaborate to break 5G barriers

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Ericsson, SK Telecom (SKT) and Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated, have successfully carried out a 5G NR data call on mid-band over SKT’s live, 5G commercial network... Read More

Autotalks Validates C-V2X Chipsets Using Rohde & Schwarz Equipment

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Kfar Netter, Israel, December 13th, 2018 – Autotalks, a world leader in V2X (Vehicle to Everything) communication solutions and Rohde & Schwarz, a leading supplier of test and measurement solutions to the... Read More

Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node

www.imec-int.com Comments Off on Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node

This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, presents the first power-performance-area comparison between SRAM-... Read More