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New DAC Aims to Ease System Design

February 6, 2019 Comments Off on New DAC Aims to Ease System Design

Digital-to-analog converter (DAC) technology is one specialty of Teledyne e2v, which has been developing such converter solutions for many years. The company recently announced its latest DAC, which it says can... Read More

Ericsson joins O-RAN Alliance

www.ericsson.com February 6, 2019 Comments Off on Ericsson joins O-RAN Alliance

Ericsson (NASDAQ: ERIC) has joined the O-RAN Alliance, a group of leading telecom service providers and suppliers with the commitment to evolving radio access network (RAN) architecture and orchestration built... Read More

At Cabsat 2019 Rohde & Schwarz will showcase latest advances in scalable storage, satellite amplifiers and file-based media solutions

https://www.rohde-schwarz.com February 6, 2019 Comments Off on At Cabsat 2019 Rohde & Schwarz will showcase latest advances in scalable storage, satellite amplifiers and file-based media solutions

On its booth (B2-32) at Cabsat, Rohde & Schwarz will show a number of strategic products that will impact on many sectors of the broadcast industry from postproduction storage to... Read More

KDDI deploys Nokia gigabit G.fast solution to bring new services to its high-speed internet ‘au Hikari’ customers in Japan

www.nokia.com February 6, 2019 Comments Off on KDDI deploys Nokia gigabit G.fast solution to bring new services to its high-speed internet ‘au Hikari’ customers in Japan

KDDI, a leading telecommunications operator in Japan, is deploying Nokia’s G.fast solution to apartments and multi-dwelling units (MDU) buildings to deliver ultra-broadband services to customers. Reducing the need to install new fiber,... Read More

Vector takes over Munich-based TESIS

February 6, 2019 Comments Off on Vector takes over Munich-based TESIS

Vector, the specialist for developing and testing software and vehicle electronics located in Stuttgart, Germany, has completed a full takeover of Munich-based TESIS GmbH. TESIS specializes in simulation solutions for... Read More

Xilinx Introduces HDMI 2.1 IP Subsystem

www.xilinx.com February 6, 2019 Comments Off on Xilinx Introduces HDMI 2.1 IP Subsystem

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that it has introduced a complete HDMI™ 2.1 IP subsystem to its portfolio of intellectual property cores, enabling Xilinx®... Read More

Semiconductor R&D Spending Will Step Up After Slowing

http://www.icinsights.com February 5, 2019 Comments Off on Semiconductor R&D Spending Will Step Up After Slowing

3D die-stacking technologies, manufacturing barriers, and growing complexities in end-use systems among the technical challenges that are expected to lift R&D growth rates through 2023. The semiconductor business is defined... Read More

Raman-on-Chip for High-Throughput, High-Resolution Handheld Spectroscopy

www.imec-int.com February 5, 2019 Comments Off on Raman-on-Chip for High-Throughput, High-Resolution Handheld Spectroscopy

Next week, at SPIE BIOS and SPIE Photonics West 2019 in San Francisco, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents an on-chip solution for... Read More

Operations and Workforce Expansion

www.baesystems.com February 5, 2019 Comments Off on Operations and Workforce Expansion

BAE Systems, the third-largest defense contractor in the world, is expanding operations into Manchester, New Hampshire – the latest in a series of strategic investments in its facilities and workforce... Read More