Unleashing perovskites’ potential for solar cells

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Perovskites — a broad category of compounds that share a certain crystal structure — have attracted a great deal of attention as potential new solar-cell materials because of their low... Read More

Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity

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China shows biggest increase, nearly matching North America with 12.5% share in 2018. IC Insights recently released its new Global Wafer Capacity 2019-2023 report that provides in-depth detail, analyses, and... Read More

Swisscom selects Ericsson Security Manager

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Ericsson (NASDAQ: ERIC) has been selected by Swisscom, the leading telecommunications service provider in Switzerland, for its market-leading Ericsson Security Manager solution. Ericsson Security Manager will provide increased security automation,... Read More

Ford Motor Company, Huayou Cobalt, IBM, LG Chem and RCS Global Launch Blockchain Pilot to Address Concerns in Strategic Mineral Supply Chains

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Committed to supporting human rights and environmental protection while helping infuse more transparency into global mineral supply chains, Ford Motor Company, Huayou Cobalt, IBM (NYSE: IBM), LG Chem and RCS... Read More

Sikorsky’s AAG and BLADE Announce Agreement for On-Demand Urban Mobility Option in New York City Using Sikorsky S-76® Helicopter

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Sikorsky’s subsidiary Associated Aircraft Group (AAG) and Fly Blade, Inc (“BLADE”), a digitally-powered aviation company, announced an agreement today to provide a new on-demand urban mobility option in the New... Read More

Microlease and Electro Rent Europe combine to become Electro Rent Corporation The two companies will unify their European operations to become the largest independent test and measurement equipment solutions provider

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Microlease and Electro Rent in Europe have today announced the start of the integration of their European operations.  The two companies will merge over the coming months to join the... Read More

PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms

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Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and... Read More