PHASA-35, a 35m wingspan solar-electric aircraft, has successfully completed its maiden flight. The landmark flight paves the way to this new aircraft becoming a game changer in the air and... Read More

No minimum load required Isolation voltages of up to 6000V Rugged, reliable and standards-compliant Broad range of devices to meet specific application requirements Flex Power Modules introduces new families of... Read More

Backing new touch user interface technology for mobile device, home appliance, automotive, industrial, and medical applications. UltraSense’s 3D ultrasound technology turns any surface into a touch sensor, enabling new designs... Read More

Microchip’s PIC18-Q43 family combines more Core Independent Peripherals and an extensive development tool ecosystem for improved designs in real-time control and connected applications In microcontroller (MCU) based system design, software... Read More

Seven major semiconductor acquisition agreements valued at $1 billion or more increase the total value of all deals by 22% from the previous year, continuing the strong wave of M&A... Read More

The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two... Read More

Espoo, Finland – Nokia today announced that it will extend its long-standing partnership with French mobile operator, IIiad Group, to roll out 5G networks across France and Italy. The 5G... Read More

The Global Certification Forum GCF and PTCRB certification organization have accepted first test case validations in various FR1 and LTE band combinations using the new Rohde & Schwarz R&S TS... Read More