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Enhances client SSD line-up with the addition of premium XG5-P Series with increased performance and capacity

TOKYO – Toshiba Memory Corporation, the world leader in memory solutions, has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express™ (NVMe™) client SSDs improve on the performance of the current XG5 series models and double the maximum capacity to 2TB[1]. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the first calendar quarter of 2018.

The XG5-P series also utilizes a PCI Express® (PCIe®) Gen3 x 4 lane and NVM Express™ Revision 1.2.1 interface, and delivers performance of up to 3000 MB/s sequential read and 2200 MB/s sequential write[2], and up to 320,000 IOPS random read and 265,000 IOPS random write[3]. Its random read/write performance in full access range[4] is approximately 55% better than that of standard XG5 series[5] products. At the same time, low power consumption is maintained at less than 60mW during operation[6].

The new XG5-P series is housed in a standard M.2 2280 form factor and will be available in two capacities, 1TB and 2TB. By utilizing a 64-layer, 3D flash memory BiCS FLASH™ 1TB package developed in-house, the 2TB model offers twice the maximum storage capacity of the standard XG5 series on the same 2.23mm, lightweight single-sided M.2 2280 module. By maintaining a single form factor for all capacities across the XG5-P and XG5 product families, Toshiba Memory Corporation makes it easier to design platforms that need flexible storage.

The XG5-P SSDs will also be available in self-encrypting drive (SED) models[7] supporting TCG Opal Version 2.01, contributing to a wide range of applications including workstations, gaming PCs and read-intensive enterprise use.

*NVM Express and NVMe are trademarks of NVM Express, Inc.
*PCI Express and PCIe are registered trademarks of PCI-SIG.
*All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

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