NEW PRODUCTS

Toshiba Electronic Devices & Storage Corporation Releases 1.5A LDO Regulators in Industry’s Smallest Package for Mobile Applications

Toshiba Electronic Devices & Storage Corporation has today started shipping “TCR15AG,” a low-dropout (LDO) regulator series in the industry’s smallest[1] WCSP6F package. The TCR15AG series is suitable for mobile and modular applications requiring small, thin devices.

Despite its small package, the TCR15AG series can drive a high current of 1.5A, suiting it for power supply applications in Wi-Fi® chipsets for smartphones and tablets, cameras and wireless modules. The new series can also control power supply in applications requiring a high current, including notebook PCs, digital camcorders, storage devices and set-top boxes.

TCR15AG series deliver the industry’s best-in-class[1] ripple rejection ratio and load transient response. They significantly reduce the ripple noise from a power management IC (PMIC) or a DC-DC converter that is often a limiting factor in the power supply for cameras and radio-frequency (RF) circuits. This helps to minimize output voltage fluctuations that occur in response to sharp changes in current during mode transitions in cameras and RF circuits.

Low voltage dropout is secured by use of an external bias voltage pin (VBIAS), which helps to improve system power efficiency and contributes to longer charge life for the batteries of mobile products.

The series offers two kinds of output voltage—adjustable output between 0.60V and 3.6V via external resistors, and fixed output voltages from 0.65 V to 3.6 V—enabling support for a wide range of power supply applications.

The TCR15AG series extensive protection features include overcurrent protection and thermal shutdown, positioning it as a high-efficiency LDO solution for applications requiring highly regulated voltage in the high-current region and low power consumption

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

22 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

22 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

23 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

23 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

23 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

23 hours ago