Categories: NEW PRODUCTS

Encapsulated DC-DC converters offer chassis or DIN rail mounting

XP Power today announced the DTE series of fully encapsulated single output DC-DC converters. The series comprises three ultra wide input voltage range models offering 20 (DTE20), 40 (DTE40) and 60 Watts (DTE60) output power. The units are available in either a chassis mount or a DIN rail format, offering flexibility to the designer of the end-product. The fully encapsulated package helps protect the converter from environmental factors often found in industrial applications, in addition to aiding heat dissipation.

These highly efficient converters, with model-dependant typical efficiency in the range 89 – 92%, run cooler and consume less power compared to other less efficient converters available in the market. The 20 Watt DTE20 model measures 96.0 x 54.0 x 23.3 mm, the 40 Watt DTE40 just 112 x 63.8 x 25.6 mm and the DTE60, 60 Watt model measures 112.0 x 67.8 x 38.0 mm. Two ultra wide 4:1 input voltage range options are based around nominal 24 (9 – 36) and 48 (18 – 75) VDC. Tightly regulated single output voltage options of 5.1, 12, 24 or 48 VDC are available across the range, and isolation is rated at 2500 VDC for 60 seconds.

The DTE series can accommodate a wide range of operating temperatures across the extended industrial range from -40 to +85 degrees C. Full power is available up to a minimum of +70 degrees depending on the model. Compliance to the international safety specification for IT equipment UL/IEC 60950-1 is standard across the range and they all meet the EN55022 Class A limits for both conducted and radiated emissions without the need for any external filtering components.

Protection features such as short circuit, output overload, input under voltage lock-out and output over voltage and a remote on/off capability are standard across the range. Front mounted input and output screw terminal connections provide ease of installation.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

4 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

4 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

5 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

5 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

6 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

7 days ago