Nano Dimension has Completed the Development of the Initial Version of its Software Package for 3D Printed Electronics – “Switch”

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Nano Dimension Ltd., a leader in the field of 3D Printed Electronics (NASDAQ, TASE: NNDM), announced today that it has completed the development of the initial version of its software... Read More

NXP, Tongji University, SAIC and Partners Launch First Large-Scale Road Test for Intelligent Connected Vehicles in China

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NXP Supports China’s Intelligent Transportation System with Proven V2X Technology SHANGHAI, July 05, 2016 (GLOBE NEWSWIRE) — NXP Semiconductors(NASDAQ:NXPI) and Tongji University recently announced their support for the launch and... Read More

Ericsson and Abengoa sign agreement for the transfer of Spanish fiber-services leader Abentel

https://www.ericsson.com/thecompany/press/releases/2016/07/2026260 Comments Off on Ericsson and Abengoa sign agreement for the transfer of Spanish fiber-services leader Abentel

Further enhances Ericsson’s comprehensive end-to-end fiber services offering About 500 fiber services experts will join Ericsson Ericsson plans to leverage globally on Abentel’s competence and skills to continue growing in... Read More

Anglia opens free sample and dev kit service

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Ezysample offers same-day despatch and free delivery on newly launched devices and design-in parts. “No questions asked and free for everyone”. Wisbech, UK, 4th July 2016 – Anglia has launched... Read More

Solar Roadways to Pave Route 66 in Missouri With Solar Panels

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In a section of Route 66 located in Missouri, MoDOT, the Federal Highway Administration, and Solar Roadways plans to install solar panels to serve as public roads by the year’s... Read More

Infineon backs European Commission in developing cybersecurity guidelines

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Munich, Germany and Strasbourg, France – July 5, 2016 – Infineon Technologies AG takes an active role in the development of European-level cybersecurity guidelines. Today, the European Commission signed the... Read More

Valens’ First HDBaseT Automotive Silicon is Now Available

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Valens, the developer of HDBaseT technology and founder of the HDBaseT Alliance, is unveiling the VA600T – the first silicon to demonstrate the transmission of high-throughput, time-sensitive applications over an... Read More