Samsung Electronics, a world leader in advanced semiconductor technology, today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. Built... Read More
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LG Display Unveils World’s First 77-inch Flexible and Transparent OLED Display
SEOUL, Korea (June. 22, 2017) – LG Display, the world’s leading innovator of display technologies, announced today that it has developed the world’s first 77-inch flexible and transparent OLED display.... Read More
UltraSoC announces industry’s first processor trace support for RISC-V
Support of five major vendors demonstrates growing strength of RISC-V ecosystem UltraSoC, the leading developer of embedded analytics technology, today announced that it has developed processor trace support for products... Read More
Wind River Teaming with Nation’s Largest Transportation Proving Grounds, Ohio State University, and Central Ohio Region to Develop, Test Smart Connected and Autonomous Technologies
Wind River®, a subsidiary of Intel® Corporation and a leader in delivering software for the Internet of Things (IoT), has engaged with the Transportation Research Center (TRC), The Ohio State... Read More
Ericsson’s award-winning advanced bus converter upgraded to include burst-mode capability for peak power demand
Third-generation BMR458 quarter-brick advanced bus converter upgraded to deliver burst-mode capability and handle 1079W of power for one second New capability negates need for second converter module in parallel BMR458... Read More
Samsung Achieves 220 Lumens per Watt with New Mid-Power LED Package
Samsung Electronics, a world leader in advanced component solutions, today announced that it has begun mass producing a new mid-power LED package, the LM301B, which features the industry’s highest luminous... Read More
GE Renewable Energy and Fina Enerji Sign Ten-year Full Service Agreement in Turkey
Continuing its pioneering collaboration in the development of clean energy in Turkey, GE Renewable Energy and Fina Enerji have concluded negotiations to broaden their cooperation program into a comprehensive ten-year... Read More
Melexis announces availability of highly integrated Time-of-Flight 3D vision solution
Melexis today announces a new Time-of-Flight (ToF) chipsetand development kit that enables simple, modular and future proof design of 3D vision solutions. Previously available only as part of a development system,... Read More
Bosch plans €1 billion investment in German chip production
The German company is reportedly planning to make a record investment into a semiconductor plant in Dresden, Germany. According to Handelsblatt Global, the factory is expected to manufacture chips for... Read More
Air Pollution Monitoring Solution by Intel and Bosch Provides Intelligent Data to Help Manage Air Quality
Directly addressing the issue of air quality, Intel is announcing a new Intel-based Bosch Air Quality Micro Climate Monitoring System (MCMS)*. The system is designed with sensors and software to ensure... Read More
























