BRISTOL, UK and EINDHOVEN, Netherlands, Feb. 23, 2017 – DuPont Electronics & Communications (DuPont) and Holst Centre today announced the third extension of their successful long-term collaboration, which is focused... Read More

IC Insights recently released its new Global Wafer Capacity 2017-2021 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region,... Read More

– Next step of inclusive approach towards systematically making autonomous driving reality – Leading mapping and location service HERE to benefit from transfer of anonymized data JERUSALEM and MUNICH, Feb.... Read More

Corephotonics has partnered with prominent camera module integrator Samsung Electro-Mechanics (SEMCO) to develop a complete reference design, based on its revolutionary dual camera technology. Through this reference design, which is... Read More

Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has received a budget... Read More

To serve the growing number of Internet of Things (IoT) applications, Intel Corporation today announced the Intel® Cyclone® 10 family of field programmable gate arrays (FPGAs). Designed to deliver fast... Read More

Waldenburg (Germany), 9 February 2017 – Würth Elektronik eiSos is unveiling an additional communication service for its customers: With #askLorandt, there’s now a Technology Ambassador ready to help with the... Read More

From vehicles to architectural lighting VTT Technical Research Centre of Finland develops novel LED light sources based on large, flexible and transparent substrates in collaboration with the Finnish companies Flexbright... Read More

Bremen – The Mercedes-Benz Bremen plant operates at full capacity and currently prepares for the series production of electric vehicles of the new product brand EQ. 150 new permanent jobs... Read More