Rugged Nicomatic EMM Series rectangular connectors resist high vibration and shock to enable miniaturization in harshest-environment applications

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Meets or exceeds MIL 83513-G and MIL-DTL 55302G; resists fluid immersion, salt spray; temperatures to +150C; multiple different configurations May 2021, Bon-en-Chablais, France: EMM Series connectors from Nicomatic, the leading... Read More

Bluetooth 5.1 module enables mesh networking for ‘massive IoT’ applications

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u-blox NINA-B4 modules use Nordic nRF52833 SoC-enabled Wirepas software for large-scale network deployments Thalwil, Switzerland – May 18, 2021 – u-blox (SIX:UBXN), a leading global provider of positioning and wireless... Read More

New i.MX8M Mini solder-down SoM from Direct Insight combines high performance, miniaturization and low cost

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Low power, multi-featured module enables PCIe access Oxfordshire, UK May 2021: Direct Insight, the UK-based, technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has announced the... Read More

Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing

www.infineon.com Comments Off on Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing

Munich, Germany – 10 May 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced its next-generation 144-Mb Quad Data Rate II+ (QDR ®-II+)... Read More

2300 V isolated EiceDRIVER™ 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor

www.infineon.com Comments Off on 2300 V isolated EiceDRIVER™ 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER™ 2L-SRC Compact (1ED32xx) gate driver family... Read More

Renesas RX MCU Becomes World’s First General-Purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard

www.renesas.com/ Comments Off on Renesas RX MCU Becomes World’s First General-Purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard

By Using Certified RX MCUs, Customers Can Easily Develop Devices Meeting Security Requirements RX MCU Obtains CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard TOKYO, Japan ― Renesas Electronics... Read More

New Harwin Multi-Directional Spring Contacts Address Situations Where Board Connection Flexibility is Needed

www.harwin.com Comments Off on New Harwin Multi-Directional Spring Contacts Address Situations Where Board Connection Flexibility is Needed

Latest additions present a compact method for implementing both horizontal and vertical connections Always providing highly inventive engineering solutions, Harwin has now expanded its range of spring contacts with the addition of... Read More

New cell technology for Neue Klasse: BMW Group strengthens battery expertise as part of the European Battery Innovation initiative.

www.press.bmwgroup.com Comments Off on New cell technology for Neue Klasse: BMW Group strengthens battery expertise as part of the European Battery Innovation initiative.

Munich. The BMW Group is accelerating its development for the battery technology of the future, thereby supporting the ramp-up of a European cell and battery value chain. In this context, Oliver... Read More